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1. 发明授权

US07300815B2 Method for fabricating a gold contact on a microswitch 失效
标题翻译：在微动开关上制造金触点的方法
公开(公告)号：US07300815B2
公开(公告)日：2007-11-27
申请号：US11113344
申请日：2005-04-25
申请人： Gordon Tam , Jun Shen
发明人： Gordon Tam , Jun Shen
IPC分类号： H01L21/441
CPC分类号： H01H50/005 , H01H2050/007
摘要： Described is a process to pattern adhesion and top contact layers in such a way that at least some portion of the top contact layers overlaps the adhesion layer, while another portion of the top contact layer overlaps with the bottom contacts, but does not overlap with the adhesion layer. The overlap between the top contact layer and the adhesion layer helps to hold the top contact layer onto the sacrificial layer. Because there is no overlap between the adhesion layer and the bottom contact, the removal of adhesion layer is no longer necessary, leading to better contacts and simplifying the fabrication process.
摘要翻译：描述了以使得至少部分顶部接触层与粘合层重叠的方式图案粘合和顶部接触层的过程，而顶部接触层的另一部分与底部接触部重叠，但是不与粘附层。顶部接触层和粘合层之间的重叠有助于将顶部接触层保持在牺牲层上。因为粘合层和底部接触之间没有重叠，所以不再需要去除粘附层，导致更好的接触和简化制造过程。

2. 发明授权

US07202765B2 Latchable, magnetically actuated, ground plane-isolated radio frequency microswitch 有权
标题翻译：可锁定，磁力驱动，接地平面隔离射频微动开关
公开(公告)号：US07202765B2
公开(公告)日：2007-04-10
申请号：US10845425
申请日：2004-05-14
申请人： Jun Shen , Rimantas L. Vaitkus , Gordon Tam , Meichun Ruan
发明人： Jun Shen , Rimantas L. Vaitkus , Gordon Tam , Meichun Ruan
IPC分类号： H01H51/22
CPC分类号： H01P1/127 , H01H50/005 , H01H2050/007
摘要： Radio frequency (RF) switch comprising an electromagnet formed on a magnet, a transmission line formed on the electromagnet and having a ground line and a signal line, and a movable contact connected to either the ground line or the signal line and capable of electrically coupling the ground line with the signal line. The transmission line is capable of propagating a RF signal if the ground line is electrically decoupled from the signal line. Conversely, the transmission line is incapable of propagating a RF signal if the ground line is electrically coupled with the signal line. The electromagnet can comprise an electromagnetic coil, formed in a layer of dielectric material, electrically coupled to a current source. Preferably, the movable contact is capable of being magnetically actuated, and is latchable. The magnet, the electromagnet, the transmission line, and the movable contact can have dimensions at a micron order of magnitude. The transmission line can be a coplanar waveguide. The coplanar waveguide can include a ground plane positioned between a layer of dielectric material and the electromagnet. The coplanar waveguide can also include means to electrically couple the ground plane to the ground line.
摘要翻译：射频（RF）开关，其包括形成在磁体上的电磁体，形成在电磁体上并具有接地线和信号线的传输线，以及连接到地线或信号线的可移动触点，并且能够电耦合地线与信号线。如果接地线与信号线电耦合，则传输线能够传播RF信号。相反，如果接地线与信号线电耦合，则传输线不能传播RF信号。电磁体可以包括电磁线圈，其形成在电耦合到电流源的电介质材料层中。优选地，可动触头能够被磁力驱动，并且可锁定。磁体，电磁体，传输线和可动触点可以具有微米数量级的尺寸。传输线可以是共面波导。共面波导可以包括位于介电材料层和电磁体之间的接地平面。共面波导还可以包括将接地平面电耦合到地线的装置。

3. 发明授权

US4814258A PMGI bi-layer lift-off process 失效
标题翻译： PMGI双层剥离工艺
公开(公告)号：US4814258A
公开(公告)日：1989-03-21
申请号：US77357
申请日：1987-07-24
申请人： Gordon Tam
发明人： Gordon Tam
IPC分类号： G03F7/09 , G03C1/495 , G03C1/76
CPC分类号： G03F7/094
摘要： An effective bi-layer photoresist structure comprising a bottom planarization layer or PMGI and a top photoresist imaging layer which eliminates an intermixing layer between the top photoresist imaging layer and the bottom planarization layer, and provides a desired undercut profile between the two layers to insure efficient lift-off for gate fabrication, said undercut profile formed due to the solubility effect of a solvent soak on the two layers.
摘要翻译：一种有效的双层光致抗蚀剂结构，其包括底部平坦化层或PMGI和顶部光致抗蚀剂成像层，其消除顶部光致抗蚀剂成像层和底部平坦化层之间的混合层，并且在两层之间提供期望的底切轮廓以确保有效用于浇口制造的剥离，由于溶剂浸泡在两层上的溶解作用而形成所述底切轮廓。

4. 发明授权

US4857481A Method of fabricating airbridge metal interconnects 失效
标题翻译：制造航空桥金属互连的方法
公开(公告)号：US4857481A
公开(公告)日：1989-08-15
申请号：US322943
申请日：1989-03-14
申请人： Gordon Tam , Lisa R. Granick
发明人： Gordon Tam , Lisa R. Granick
IPC分类号： H01L21/306 , H01L21/28 , H01L21/338 , H01L21/768 , H01L29/812
CPC分类号： H01L21/7688 , H01L21/7682 , H01L21/76885
摘要： An improved method of fabricating airbridge metal interconnects uses two photoresist layers having different solubility characteristics. This allows for the removal of one resist without affecting the other. Thus, the underlying semiconductor structure is protected from subsequent etches of the ground plane metal. Consequently, a greater process latitude allows for obtaining higher device yields in fabricating high frequency semiconductor devices employing airbridge metal interconnects.
摘要翻译：制造气桥金属互连的改进方法使用具有不同溶解度特性的两个光致抗蚀剂层。这允许去除一个抗蚀剂而不影响另一个抗蚀剂。因此，保护下面的半导体结构免受接地平面金属的后续蚀刻。因此，更大的工艺纬度允许在制造使用空中桥接金属互连的高频半导体器件中获得更高的器件产量。

5. 发明授权

US07151426B2 Latching micro magnetic relay packages and methods of packaging 有权
标题翻译：闭锁微型继电器封装和封装方法
公开(公告)号：US07151426B2
公开(公告)日：2006-12-19
申请号：US10633914
申请日：2003-08-04
申请人： John Stafford , Gordon Tam , Jun Shen
发明人： John Stafford , Gordon Tam , Jun Shen
IPC分类号： H01H51/22
CPC分类号： B81B7/0077 , H01H1/0036 , H01H36/0006 , H01H50/005 , H01H2036/0093 , H01H2050/007 , H01L23/10 , H01L24/97 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/1461 , H01L2924/30105 , H01L2924/00
摘要： A method of forming a hermetically sealed MEMS package includes a step of providing a supporting GaAs substrate with at least one contact for the MEMS device on the surface of the supporting substrate and forming a cantilever on the surface of the supporting substrate positioned to come into electrical engagement with the contact in one orientation. A metal seal ring is fixed to the surface of the supporting substrate circumferentially around the contact and the cantilever. A cavity is etched in a silicon chip to form a cap member. A metal seal ring is fixed to the cap member around the cavity. The package is hermetically sealed by reflowing a solder alloy, positioned between the two seal rings, in an inert environment without the use of flux.
摘要翻译：形成气密密封的MEMS封装的方法包括以下步骤：在支撑衬底的表面上为MEMS器件提供至少一个接触的支撑GaAs衬底，并在支撑衬底的表面上形成悬臂，定位成电以一个方向与联系人联系。金属密封环周围围绕触点和悬臂固定到支撑基板的表面。在硅芯片中蚀刻空腔以形成帽构件。金属密封圈固定在腔体周围的帽部件上。通过在不使用助焊剂的惰性环境中回流位于两个密封环之间的焊料合金，将封装密封。

6. 发明申请

US20060114084A1 Latching micro-magnetic switch with improved thermal reliability 失效
公开(公告)号：US20060114084A1
公开(公告)日：2006-06-01
申请号：US11151663
申请日：2005-06-14
申请人： Meichun Ruan , Jun Shen , Gordon Tam
发明人： Meichun Ruan , Jun Shen , Gordon Tam
IPC分类号： H01H51/22
CPC分类号： H01H50/005 , H01H2050/007
摘要： A micro-magnetic switch includes a permanent magnet and a supporting device having contacts coupled thereto and an embedded coil. The supporting device can be positioned proximate to the magnet. The switch also includes a cantilever coupled at a central point to the supporting device. The cantilever has a conducting material coupled proximate an end and on a side of the cantilever facing the supporting device and having a soft magnetic material coupled thereto. During thermal cycling the cantilever can freely expand based on being coupled at a central point to the supporting device, which substantially reduces coefficient of thermal expansion differences between the cantilever and the supporting device.

7. 发明申请

US20060084252A1 Method for fabricating a gold contact on a microswith 失效
标题翻译：在微型金属上制作金接触的方法
公开(公告)号：US20060084252A1
公开(公告)日：2006-04-20
申请号：US11113344
申请日：2005-04-25
申请人： Gordon Tam , Jun Shen
发明人： Gordon Tam , Jun Shen
IPC分类号： H01L21/20
CPC分类号： H01H50/005 , H01H2050/007
摘要： Described is a process to pattern adhesion and top contact layers in such a way that at least some portion of the top contact layers overlaps the adhesion layer, while another portion of the top contact layer overlaps with the bottom contacts, but does not overlap with the adhesion layer. The overlap between the top contact layer and the adhesion layer helps to hold the top contact layer onto the sacrificial layer. Because there is no overlap between the adhesion layer and the bottom contact, the removal of adhesion layer is no longer necessary, leading to better contacts and simplifying the fabrication process.
摘要翻译：描述了以使得至少部分顶部接触层与粘合层重叠的方式图案粘合和顶部接触层的过程，而顶部接触层的另一部分与底部接触部重叠，但是不与粘附层。顶部接触层和粘合层之间的重叠有助于将顶部接触层保持在牺牲层上。因为粘合层和底部接触之间没有重叠，所以不再需要去除粘附层，导致更好的接触和简化制造过程。

8. 发明授权

US06894592B2 Micromagnetic latching switch packaging 失效
标题翻译：微电磁闭锁开关包装
公开(公告)号：US06894592B2
公开(公告)日：2005-05-17
申请号：US10147915
申请日：2002-05-20
申请人： Jun Shen , Prasad S. Godavarti , John Stafford , Gordon Tam
发明人： Jun Shen , Prasad S. Godavarti , John Stafford , Gordon Tam
IPC分类号： H01H50/00 , H01H51/22 , H01M51/22
CPC分类号： H01H50/005 , H01H2050/007
摘要： Packages for a micromachined magnetic latching switch, and methods for assembling the packages are described. In one aspect, a substrate is defined by opposing first and second surfaces. A micromagnetic switch integrated circuit (IC) chip is mounted to the first surface. A contact pad on the chip is coupled to a trace on the first surface. A permanent magnet is positioned closely adjacent to the chip. A cap is attached to the first surface. An inner surface of the cap forms an enclosure to enclose the chip on the first surface. The chip can be alternatively mounted to the inner surface of the cap. The chip can be oriented in a standard or flip-chip fashion. In another aspect, a moveable micro-machined cantilever is supported by a surface of a substrate. A cap is attached to the surface. An inner surface of the cap forms an enclosure that encloses the cantilever on the surface of the substrate. A permanent magnet is positioned closely adjacent to the cantilever. An electromagnet is attached to the inner surface or an outer surface of the cap.
摘要翻译：描述了用于微加工磁性锁定开关的封装以及用于组装封装的方法。在一个方面，衬底由相对的第一和第二表面限定。微型开关集成电路（IC）芯片安装在第一表面。芯片上的接触焊盘与第一表面上的迹线耦合。永久磁铁定位成紧邻芯片。盖子连接到第一表面。盖的内表面形成外壳以将芯片封装在第一表面上。芯片可以替代地安装到盖的内表面。该芯片可以以标准或倒装芯片方式定向。另一方面，可移动的微加工悬臂由衬底的表面支撑。盖子贴在表面上。盖的内表面形成在衬底的表面上包围悬臂的外壳。永磁体与悬臂紧邻。电磁铁连接到盖的内表面或外表面。

9. 发明授权

US06778046B2 Latching micro magnetic relay packages and methods of packaging 失效
标题翻译：闭锁微型继电器封装和封装方法
公开(公告)号：US06778046B2
公开(公告)日：2004-08-17
申请号：US10126291
申请日：2002-04-19
申请人： John Stafford , Gordon Tam , Jun Shen
发明人： John Stafford , Gordon Tam , Jun Shen
IPC分类号： H01H5122
CPC分类号： B81B7/0077 , H01H1/0036 , H01H36/0006 , H01H50/005 , H01H2036/0093 , H01H2050/007 , H01L23/10 , H01L24/97 , H01L2924/0002 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/1461 , H01L2924/30105 , H01L2924/00
摘要： A method of forming a hermetically sealed MEMS package includes a step of providing a supporting GaAs substrate with at least one contact for the MEMS device on the surface of the supporting substrate and forming a cantilever on the surface of the supporting substrate positioned to come into electrical engagement with the contact in one orientation. A metal seal ring is fixed to the surface of the supporting substrate circumferentially around the contact and the cantilever. A cavity is etched in a silicon chip to form a cap member. A metal seal ring is fixed to the cap member around the cavity. The package is hermetically sealed by reflowing a solder alloy, positioned between the two seal rings, in an inert environment without the use of flux.
摘要翻译：形成气密密封的MEMS封装的方法包括以下步骤：在支撑衬底的表面上为MEMS器件提供至少一个接触的支撑GaAs衬底，并在支撑衬底的表面上形成悬臂，定位成电以一个方向与联系人联系。金属密封环周围围绕触点和悬臂固定到支撑基板的表面。在硅芯片中蚀刻空腔以形成帽构件。金属密封圈固定在腔体周围的帽部件上。通过在不使用助焊剂的惰性环境中回流位于两个密封环之间的焊料合金，将封装密封。

10. 发明授权

US06750745B1 Micro magnetic switching apparatus and method 失效
标题翻译：微磁开关装置及方法
公开(公告)号：US06750745B1
公开(公告)日：2004-06-15
申请号：US10229227
申请日：2002-08-27
申请人： Chengping Wei , Jun Shen , Gordon Tam
发明人： Chengping Wei , Jun Shen , Gordon Tam
IPC分类号： H01H5122
CPC分类号： H01H50/005 , H01H2036/0093 , H01H2050/007
摘要： Micro magnetic switching apparatus includes a permanent magnet supported on a base and a coil supported by the base so as to define a plurality of sides. A plurality of latching micro magnetic relays each includes a magnetic cantilever positioned to open a first electric circuit in a first orientation and to close the first electric circuit in a second orientation. One each of the relays is mounted adjacent each of the plurality of sides of the coil and adjacent the permanent magnet so as to be latched in one of the first and second orientations when the coil is not activated and to switch to the other of the first and second orientations when the coil is activated and to be latched in the other of the first and second orientations by the permanent magnet.
摘要翻译：微型磁开关装置包括支撑在基座上的永磁体和由基座支撑以限定多个侧面的线圈。多个闭锁微型磁继电器各自包括磁悬臂，定位成以第一方向打开第一电路并且以第二取向关闭第一电路。一个继电器中的每一个被安装在线圈的多个侧面中的每一个周围并且与永磁体相邻，以便当线圈未被激活时被锁定在第一和第二取向中的一个中并且切换到第一以及当线圈被激活并且被永磁体锁定在第一和第二取向中的另一个中时的第二取向。

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