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    • 2. 发明授权
    • Micro-emitter-based low-contact-force interconnection device
    • 微型发射器低接触力互连装置
    • US5245248A
    • 1993-09-14
    • US682648
    • 1991-04-09
    • Chung ChanKeith WarnerGeorge B. Cvijanovich
    • Chung ChanKeith WarnerGeorge B. Cvijanovich
    • H01J1/304H01R13/03H01R43/16H05K3/32H05K3/40
    • H01J1/304H01R13/03H01R43/16H05K3/325H05K3/4007Y10S439/95
    • An interconnection device for providing electrical connection between two separable conducting elements that requires less applied force than a standard ohmic connection device of the same connection area includes a surface of at least a first conducting element that includes a plurality of atomically sharp projections for creating a strong electric field near the tip of each projection, each projection being disposed within a locally depressed portion of an insulating layer that serves to maintain a space between each tip and a second conducting element that contacts the insulating layer. The strong electric field at each tip induces a variety of conduction modes each contributing to an aggregate current flow from the first conducting element to the second. In an alternate embodiment, a plurality of projections are disposed on the peaks and valleys of a rough surface without an insulating layer, the projections providing a variety of conduction modes.
    • 一种用于在两个可分离的导电元件之间提供电连接的互连装置,其需要比同一连接区域的标准欧姆连接装置更少的施加力,包括至少第一导电元件的表面,该第一导电元件包括​​多个用于产生强的 每个突起的尖端附近的电场,每个突起设置在绝缘层的局部凹陷部分中,该绝缘层用于保持每个尖端与接触绝缘层的第二导电元件之间的空间。 每个尖端处的强电场引起各种导电模式,每个传导模式有助于从第一导电元件到第二导电元件的聚集电流。 在替代实施例中,多个突起设置在粗糙表面的峰谷处,而没有绝缘层,突起提供各种导电模式。
    • 5. 发明授权
    • Micro emitter based low contact force interconnection device
    • 微型发射器低接触力互连装置
    • US5660570A
    • 1997-08-26
    • US402140
    • 1995-03-10
    • Chung ChanKeith WarnerGeorge B. Cvijanovich
    • Chung ChanKeith WarnerGeorge B. Cvijanovich
    • H01J1/304H01R4/58H01R43/16H05K3/32H05K3/40H01J1/30
    • H01R4/58H01J1/304H01R43/16H05K3/325H05K3/4007Y10S439/95
    • An interconnection device is disclosed for providing electrical connection between two conducting elements that requires less applied force than a standard ohmic connection device of the same connection area. A surface of at least a first conducting element includes a plurality of atomically sharp projections for creating a strong electric field near the tip of each projection, each projection being disposed within a locally depressed portion of an insulating layer that serves to maintain a space between each tip and a second conducting element that contacts the insulating layer. The strong electric field at each tip induces a variety of conduction modes each contributing to an aggregate current flow from the first conducting element to the second. In an alternate embodiment, a plurality of projections are disposed on the peaks and valleys of a rough surface without an insulating layer, the projections providing a variety of conduction modes.
    • 公开了一种用于在两个导电元件之间提供电连接的互连装置,其需要比同一连接区域的标准欧姆连接装置更少的施加力。 至少第一导电元件的表面包括多个原子锋利的突起,用于在每个突起的尖端附近产生强电场,每个突起设置在绝缘层的局部凹陷部分内,其用于保持每个 尖端和接触绝缘层的第二导电元件。 每个尖端处的强电场引起各种导电模式,每个传导模式有助于从第一导电元件到第二导电元件的聚集电流。 在替代实施例中,多个突起设置在粗糙表面的峰谷处,而没有绝缘层,突起提供各种导电模式。