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    • 1. 发明授权
    • Semiconductor component with trench insulation and corresponding production method
    • 具有沟槽绝缘的半导体元件及相应的生产方法
    • US08552524B2
    • 2013-10-08
    • US10523239
    • 2003-07-19
    • Franz SchulerGeorg Tempel
    • Franz SchulerGeorg Tempel
    • H01L29/00H01L21/8238
    • H01L21/763H01L21/76229H01L21/76232
    • The invention relates to a semiconductor component with trench isolation and to an associated fabrication method, a trench isolation having a deep isolation trench with a covering insulation layer, a side wall insulation layer and an electrically conductive filling layer, which is electrically connected to a predetermined doping region of the semiconductor substrate in a bottom region of the trench. The use of a trench contact, which has a deep contact trench with a side wall insulation layer and an electrically conductive filling layer, which is likewise electrically connected to the predetermined doping region of the semiconductor substrate in a bottom region of the contact trench, makes it possible to improve the electrical shielding properties with a reduced area requirement.
    • 本发明涉及具有沟槽隔离和相关制造方法的半导体部件,具有具有覆盖绝缘层的深隔离沟槽,侧壁绝缘层和导电填充层的沟槽隔离件,其电连接到预定的 在沟槽的底部区域中的半导体衬底的掺杂区域。 与接触沟槽的底部区域同样电连接到半导体衬底的预定掺杂区域的沟槽接触的使用,其具有与侧壁绝缘层和导电填充层的深接触沟槽,使得 可以减小面积要求来改善电屏蔽性能。
    • 5. 发明申请
    • Non-volatile semiconductor memory element and corresponding production and operation method
    • 非易失性半导体存储器元件及相应的生产和操作方法
    • US20060226466A1
    • 2006-10-12
    • US10524158
    • 2003-08-08
    • Franz SchulerGeorg Tempel
    • Franz SchulerGeorg Tempel
    • H01L29/788
    • H01L29/66833G11C16/0475H01L21/28282H01L29/7923
    • The invention relates to a nonvolatile semiconductor storage element and an associated production and control method, comprising a semiconductor substrate (1) in which a source region (S), a drain region (D) and an intermediate channel region are formed. On a first part section (I) of the channel region, a control layer (5) is formed and insulated from the channel region by a first insulating layer (2A) whereas respective charge storage layers (3A and 3B) are formed in a second part section (IIA, IIB) of the channel region and are insulated from the channel region by a second insulating layer (2BA and 2BB). On the charge storage layer (3A, 3B), a programming layer (6A, 6B) is formed and insulated from that by a third insulating layer (4A, 4B) and is electrically connected to a respective source region (S) and drain region (D) via a respective interconnect layer (6AA, 6BB).
    • 本发明涉及一种非易失性半导体存储元件及相关的制造和控制方法,包括其中形成源极区(S),漏极区(D)和中间沟道区的半导体衬底(1)。 在沟道区的第一部分(I)上,通过第一绝缘层(2A)形成控制层(5)并与沟道区绝缘,而形成各自的电荷存储层(3A和3B) 在沟道区域的第二部分部分(IIA,IIB)中,并且通过第二绝缘层(2 BA和2BB)与沟道区域绝缘。 在电荷存储层(3A,3B)上,编程层(6A,6B)与第三绝缘层(4A,4B)的编程层(6A,6B)形成绝缘,并与第一绝缘层 (6A,6BB)中的至少一个(S)和漏极区(D)。
    • 9. 发明授权
    • Method for producing semiconductor memory device having a capacitor
    • 一种具有电容器的半导体存储器件的制造方法
    • US6083765A
    • 2000-07-04
    • US135623
    • 1998-08-18
    • Georg Tempel
    • Georg Tempel
    • H01L27/04H01L21/02H01L21/822H01L21/8242H01L21/8246H01L27/10H01L27/105H01L27/108H01L27/115
    • H01L27/11507H01L27/10808H01L27/11502H01L28/55
    • A semiconductor memory device includes a semiconductor substrate having a surface defining a plane extending substantially parallel thereto. A multiplicity of memory cells disposed on the substrate each have a selection transistor disposed in the plane. The transistor has a gate terminal and first and second electrode terminals. Each of the memory cells has a storage capacitor associated with and triggerable by the transistor. The capacitor has a ferroelectric dielectric and first and second capacitor electrodes. The capacitor has a configuration projecting upward from the plane and is disposed inside a trench extending as far as the second electrode terminal of the transistor. A word line is connected to the gate terminal of the transistor, a bit line is connect to the first electrode terminal of the transistor, and a common conductor layer of electrically conductive material is connected to the first capacitor electrode of the capacitor. A method for producing the device includes producing the capacitor after production of the transistor and metallizing layers associated with the transistor for connection of the word and bit lines, in a configuration projecting upward from the plane, and placing the capacitor inside a trench extending as far as the second electrode terminal of the transistor.
    • 半导体存储器件包括具有限定基本上平行延伸的平面的表面的半导体衬底。 设置在基板上的多个存储单元各自具有设置在平面中的选择晶体管。 晶体管具有栅极端子和第一和第二电极端子。 每个存储单元具有与晶体管相关联并且可由晶体管触发的存储电容器。 电容器具有铁电介质和第一和第二电容器电极。 电容器具有从平面向上突出的配置,并且设置在延伸到晶体管的第二电极端子的沟槽内。 字线连接到晶体管的栅极端子,位线连接到晶体管的第一电极端子,并且导电材料的公共导体层连接到电容器的第一电容器电极。 一种制造该器件的方法包括:在从晶体管向上突出的结构中制造晶体管和与用于连接字线和位线的晶体管相连的金属化层的电容器,以及将电容器放置在远延伸的沟槽内 作为晶体管的第二电极端子。