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    • 1. 发明授权
    • Silver-based contact material, use of such a contact material, in
switchgear for power engineering applications and method of
manufacturing the contact material
    • 银基接触材料,使用这种接触材料,用于电力工程应用的开关设备和制造接触材料的方法
    • US5796017A
    • 1998-08-18
    • US601059
    • 1996-02-23
    • Franz Hauner
    • Franz Hauner
    • C22C1/05C22C1/10C22C5/06H01H1/02H01H1/023H01H1/0237H01H11/04H01H50/54B22F3/16
    • H01H1/0237H01H2001/02378
    • Contact material based on silver, use of such a contact material in a switching device in power engineering, and process for preparing the contact material. For contact pieces in low-voltage switches, in particular, substitute materials based on silver-iron oxide are proposed for the silver-nickel hitherto often used in practice. According to the invention, such a material contains, as a further effective component, an oxide of a metal of the third sub-group, yttrium oxide (Y.sub.2 O.sub.3) being especially designed for this purpose. For example, a material of the composition Ag/Fe.sub.2 O.sub.3 10/Y.sub.2 O.sub.3 1 meets, with its favourable temperature behaviour, the properties required with respect to the contact property spectrum. In addition, at least one metal oxide which contains elements of the sixth sub-group of the Periodic Table of the Elements, preferably iron tungstate (FeWO.sub.4), can be present. In particular, a material of the composition Ag/Fe.sub.2 O.sub.3 9/Y.sub.2 O.sub.3 1/FeWO.sub.4 0.5 has shown good utility owing to its additionally improved welding and short-circuit behaviour.
    • PCT No.PCT / DE94 / 00935 Sec。 371日期1996年2月23日 102(e)日期1996年2月23日PCT 1994年8月16日PCT公布。 第WO95 / 06321号公报 日期1995年3月2日联系基于银的材料,在动力工程中的开关装置中使用这种接触材料,以及制备接触材料的方法。 对于低压开关中的接触片,特别是针对迄今经常在实践中使用的银 - 镍提出了基于银 - 氧化铁的替代材料。 根据本发明,这种材料作为另一有效成分含有第三子基团的金属氧化物,特别是为此目的而设计的氧化钇(Y 2 O 3)。 例如,组合物Ag / Fe 2 O 3 10 / Y 2 O 3的材料以其良好的温度行为满足相对于接触性质谱所需的性质。 此外,可以存在至少一种含有元素周期表第六子基元素的金属氧化物,优选为钨酸铁(FeWO 4)。 特别地,组合物Ag / Fe 2 O 3 3 / Y 2 O 31 / FeWO 40.5的材料由于其额外改进的焊接和短路性能已显示出良好的效用。
    • 5. 发明授权
    • Silver-based contact material for switchgear used in power engineering
    • 用于电力工程的开关柜用银基接触材料
    • US5663500A
    • 1997-09-02
    • US669463
    • 1996-06-20
    • Franz HaunerManfred MullerGunter Tiefel
    • Franz HaunerManfred MullerGunter Tiefel
    • H01H1/0237C22C5/06
    • H01H1/0237H01H2001/02378
    • Substitute materials are increasingly proposed for contact pieces in low-voltage switches, which until now frequently consisted of silver-nickel. In the case of such a substitute material which, besides silver, contains at least iron oxide (Fe.sub.2 O.sub.3 /Fe.sub.3 O.sub.4) and zirconium oxide (ZrO.sub.2) as active components, the making capacity with regard to the critical welding current is improved by an addition of a further oxide of the sixth subgroup of the Periodic System and/or of a mixed oxide that consists of iron oxide and the oxide of an element of the sixth subgroup of the Periodic System. In this connection, the further additive is, in particular, ferro-wolframate (FeWO.sub.4).
    • PCT No.PCT / DE94 / 01488 Sec。 371日期:1996年6月20日 102(e)1996年6月20日PCT 1994年12月14日PCT PCT。 公开号WO95 / 17758 日期1995年6月29日针对低压开关中的接触片越来越多地提出材料,到现在为止经常由银 - 镍组成。 在除了银以外含有氧化铁(Fe 2 O 3 / Fe 3 O 4)和氧化锆(ZrO 2)作为有效成分的这种替代材料的情况下,通过加入 周期性系统的第六子群的另外的氧化物和/或由氧化铁组成的混合氧化物和周期系统的第六子群的元素的氧化物。 在这方面,另外的添加剂尤其是铁 - 钨酸盐(FeWO 4)。
    • 6. 发明授权
    • Process for bonding a contact layer of silver-metal oxide material and
metal contact base, and suitable contact layer
    • 用于粘合银 - 金属氧化物材料和金属接触基底的接触层以及合适的接触层的方法
    • US5628448A
    • 1997-05-13
    • US617768
    • 1996-03-19
    • Franz Hauner
    • Franz Hauner
    • B23K1/19B23K1/20H01H1/023H01H1/0237H01H11/06
    • B23K1/19B23K1/20H01H1/0231H01H1/0237H01H2001/02378Y10T29/49204Y10T29/49224
    • A contact facing is normally bonded to the carrier by brazing or welding, for which purpose, the bonding side has to have a suitable layer. According to the invention, prior to the bonding operation, the contact facings are treated without fusion in such a way that the metal oxide is at least partially reduced to metal at least on the solder side at the surface and in the subsurface region of the contact facing. The reduction can be carried out by heat treatment in reducing atmosphere. In the case of contact materials based on silver/iron oxide (AgFe.sub.2 O.sub.3 /Fe.sub.3 O.sub.4), in particular, the iron oxide may also be reduced to iron on the switching side since iron oxide is again formed after switching. Alternatively, contact facings may be provided with carbon as reducing agent on the solder side. In particular, the reduction may take place locally in this case.
    • PCT No.PCT / DE94 / 01090 Sec。 371日期:1996年3月19日 102(e)1996年3月19日PCT PCT 1994年9月20日PCT公布。 公开号WO95 / 08833 日期1995年3月30日接触面通常通过钎焊或焊接结合到载体上,为此,粘合侧必须具有合适的层。 根据本发明,在接合操作之前,接触面被处理而不熔化,使得金属氧化物至少部分地在接触面的表面和表面下的至少在焊料侧还原成金属 面对。 还原可以通过在还原气氛中进行热处理来进行。 在基于银/铁氧化物(AgFe 2 O 3 / Fe 3 O 4)的接触材料的情况下,特别地,由于在切换后再次形成氧化铁,所以在开关侧也可以将铁还原成铁。 或者,接触面可以在焊料侧上设置有作为还原剂的碳。 特别地,在这种情况下,可以在本地进行减少。
    • 10. 发明授权
    • Method for presoldering a contact for an electrical switching device and
semi-finished product for use as a contact
    • 用于预先焊接电气开关装置和用于接触的半成品的触点的方法
    • US5520323A
    • 1996-05-28
    • US244996
    • 1994-06-20
    • Franz HaunerManfred Schneider
    • Franz HaunerManfred Schneider
    • B23K1/002B23K1/20B23K35/00H01H1/02H01H1/025H01H11/04B23K37/06
    • B23K35/007B23K1/002B23K1/20B23K2201/36B23K2201/40Y10T29/49213Y10T428/12229Y10T428/12611
    • Contacts such as contact points, contact strips, or contact sections are usually provided with hard solder on a copper-silver basis in the form of a flat solder layer. The contact is then connected over this solder layer with a contact carrier. The solder layer is melted, whereupon the free surface of the solder layer (13, 130) is covered during melting with a material (1, 5, 15) that has no solubility with silver or copper. The material can, during melting of the solder, form a covering (1, 15) beneath the contact (10, 12, 100) provided on its solder side with the solder layer (13, 130) or can also form a covering over the contact (10, 12, 100) provided on its solder side with the solder layer (13, 130). As materials for covering the solder layer (13, 130), high-melting metals, preferably tantalum, or a ceramic are used. In the case of a semi-finished product for use as a contact, the solder layer (13, 130) is in intimate contact over its entire surface with the solder side of the contact (10, 12, 100 ) and has the structure of a melt.
    • PCT No.PCT / DE92 / 01073 Sec。 371日期:1994年6月20日 102(e)日期1994年6月20日PCT提交1992年12月21日PCT公布。 第WO93 / 13535号公报 日期为1993年7月8日。接触点,接触片或接触部分的接触通常以铜 - 银为基础,以平坦焊料层的形式提供硬焊料。 接触件然后通过该焊料层与接触载体连接。 焊料层熔化,于是熔化期间用与银或铜不溶解的材料(1,5,15)覆盖焊料层(13,130)的自由表面。 在焊料熔化期间,该材料可以在其焊料侧上设置有焊料层(13,130)的接触件(10,12,100)下面形成覆盖物(1,15),或者也可形成覆盖物 在其焊料侧设置有焊料层(13,130)的接触(10,12,100)。 作为用于覆盖焊料层(13,130)的材料,使用高熔点金属,优选钽或陶瓷。 在用作接触的半成品的情况下,焊料层(13,130)在其整个表面上与触点(10,12,100)的焊料侧紧密接触,并且具有 一个熔体。