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    • 2. 发明申请
    • PROGRAMMABLE METALLIZATION CELL WITH ION BUFFER LAYER
    • 具有离子缓冲层的可编程金属化电池
    • US20110180775A1
    • 2011-07-28
    • US12692861
    • 2010-01-25
    • Yuyu LINFeng-Ming LeeYi-Chou Chen
    • Yuyu LINFeng-Ming LeeYi-Chou Chen
    • H01L45/00H01L29/18H01L21/06
    • H01L45/085H01L45/122H01L45/1233H01L45/1266H01L45/145
    • A programmable metallization device, comprises a first electrode; a memory layer electrically coupled to the first electrode and adapted for electrolytic formation and destruction of a conducting bridge therethrough; an ion-supplying layer containing a source of ions of a first metal element capable of diffusion into and out of the memory layer; a conductive ion buffer layer between the ion-supplying layer and the memory layer, and which allows diffusion therethrough of said ions; and a second electrode electrically coupled to the ion-supplying layer. Circuitry is coupled to the device to apply bias voltages to the first and second electrodes to induce creation and destruction of conducting bridges including the first metal element in the memory layer. The ion buffer layer can improve retention of the conducting bridge by reducing the likelihood that the first metallic element will be absorbed into the ion supplying layer.
    • 可编程金属化器件,包括第一电极; 存储层,其电耦合到所述第一电极并适于通过其导电桥的电解形成和破坏; 离子供给层,其含有能够扩散到所述存储层中的第一金属元素的离子源; 在离子供给层和存储层之间的导电离子缓冲层,并且允许所述离子的扩散; 以及电耦合到所述离子供应层的第二电极。 电路耦合到器件以向第一和第二电极施加偏置电压,以引起包括存储器层中的第一金属元件的导电桥的产生和破坏。 离子缓冲层可以通过降低第一金属元素被吸收到离子供给层中的可能性来改善导电桥的保留。
    • 3. 发明授权
    • Unipolar programmable metallization cell
    • 单极可编程金属化电池
    • US09437266B2
    • 2016-09-06
    • US13675923
    • 2012-11-13
    • Feng-Ming LeeYu-Yu LinMing-Hsiu Lee
    • Feng-Ming LeeYu-Yu LinMing-Hsiu Lee
    • H01L45/00G11C11/00H01L27/24
    • G11C11/00H01L27/2409H01L45/085H01L45/1233H01L45/1266H01L45/145
    • A programmable metallization device comprises a first electrode and a second electrode, and a dielectric layer, a conductive ion-barrier layer, and an ion-supplying layer in series between the first and second electrodes. In operation, a conductive bridge is formed or destructed in the dielectric layer to represent a data value using bias voltages having the same polarity, enabling the use of diode access devices. To form a conductive bridge, a bias is applied that is high enough to cause ions to penetrate the conductive ion-barrier layer into the dielectric layer, which then form filaments or bridges. To destruct the conductive bridge, a bias of the same polarity is applied that causes current to flow through the structure, while ion flow is blocked by the conductive ion-barrier layer. As a result of Joule heating, any bridge in the dielectric layer disintegrates.
    • 可编程金属化器件包括在第一和第二电极之间串联的第一电极和第二电极以及电介质层,导电离子阻挡层和离子供给层。 在操作中,在电介质层中形成或破坏导电桥,以使用具有相同极性的偏置电压来表示数据值,从而能够使用二极管接入装置。 为了形成导电桥,施加足够高的偏压,使得离子将导电离子阻挡层穿透到电介质层中,然后形成细丝或桥。 为了破坏导电桥,施加相同极性的偏压,导致电流流过结构,同时离子流被导电离子阻挡层阻挡。 作为焦耳加热的结果,介电层中的任何桥分解。
    • 5. 发明授权
    • Programmable metallization cell with ion buffer layer
    • 可编程金属化电池与离子缓冲层
    • US08134139B2
    • 2012-03-13
    • US12692861
    • 2010-01-25
    • Yu-Yu LinFeng-Ming LeeYi-Chou Chen
    • Yu-Yu LinFeng-Ming LeeYi-Chou Chen
    • H01L29/18H01L21/06H01L45/00
    • H01L45/085H01L45/122H01L45/1233H01L45/1266H01L45/145
    • A programmable metallization device, comprises a first electrode; a memory layer electrically coupled to the first electrode and adapted for electrolytic formation and destruction of a conducting bridge therethrough; an ion-supplying layer containing a source of ions of a first metal element capable of diffusion into and out of the memory layer; a conductive ion buffer layer between the ion-supplying layer and the memory layer, and which allows diffusion therethrough of said ions; and a second electrode electrically coupled to the ion-supplying layer. Circuitry is coupled to the device to apply bias voltages to the first and second electrodes to induce creation and destruction of conducting bridges including the first metal element in the memory layer. The ion buffer layer can improve retention of the conducting bridge by reducing the likelihood that the first metallic element will be absorbed into the ion supplying layer.
    • 可编程金属化器件,包括第一电极; 存储层,其电耦合到所述第一电极并适于通过其导电桥的电解形成和破坏; 离子供给层,其含有能够扩散到所述存储层中的第一金属元素的离子源; 在离子供给层和存储层之间的导电离子缓冲层,并且允许所述离子的扩散; 以及电耦合到所述离子供应层的第二电极。 电路耦合到器件以向第一和第二电极施加偏置电压,以引起包括存储器层中的第一金属元件的导电桥的产生和破坏。 离子缓冲层可以通过降低第一金属元素被吸收到离子供给层中的可能性来改善导电桥的保留。
    • 7. 发明申请
    • UNIPOLAR PROGRAMMABLE METALLIZATION CELL
    • UNIPOLAR可编程金属化细胞
    • US20140131653A1
    • 2014-05-15
    • US13675923
    • 2012-11-13
    • FENG-MING LEEYU-YU LINMING-HSIU LEE
    • FENG-MING LEEYU-YU LINMING-HSIU LEE
    • H01L45/00G11C11/00
    • G11C11/00H01L27/2409H01L45/085H01L45/1233H01L45/1266H01L45/145
    • A programmable metallization device comprises a first electrode and a second electrode, and a dielectric layer, a conductive ion-barrier layer, and an ion-supplying layer in series between the first and second electrodes. In operation, a conductive bridge is formed or destructed in the dielectric layer to represent a data value using bias voltages having the same polarity, enabling the use of diode access devices. To form a conductive bridge, a bias is applied that is high enough to cause ions to penetrate the conductive ion-barrier layer into the dielectric layer, which then form filaments or bridges. To destruct the conductive bridge, a bias of the same polarity is applied that causes current to flow through the structure, while ion flow is blocked by the conductive ion-barrier layer. As a result of Joule heating, any bridge in the dielectric layer disintegrates.
    • 可编程金属化器件包括在第一和第二电极之间串联的第一电极和第二电极以及电介质层,导电离子阻挡层和离子供给层。 在操作中,在电介质层中形成或破坏导电桥,以使用具有相同极性的偏置电压来表示数据值,从而能够使用二极管接入装置。 为了形成导电桥,施加足够高的偏压,使得离子将导电离子阻挡层穿透到电介质层中,然后形成细丝或桥。 为了破坏导电桥,施加相同极性的偏压,导致电流流过结构,同时离子流被导电离子阻挡层阻挡。 作为焦耳加热的结果,介电层中的任何桥分解。
    • 10. 发明授权
    • Programmable metallization cell with two dielectric layers
    • 具有两个电介质层的可编程金属化电池
    • US09117515B2
    • 2015-08-25
    • US13352946
    • 2012-01-18
    • Feng-Ming LeeYu-Yu Lin
    • Feng-Ming LeeYu-Yu Lin
    • G11C11/00G11C13/00H01L45/00H01L27/24G11C8/10
    • G11C13/0011G11C8/10G11C2213/54G11C2213/71H01L27/2463H01L45/085H01L45/1233H01L45/144H01L45/1608H01L45/1675
    • A programmable metallization device comprises a first electrode and a second electrode, and a first dielectric layer, a second dielectric layer, and an ion-supplying layer in series between the first and second electrodes. In operation, a conductive bridge is formed or destructed in the first dielectric layer to represent a data value. During read, a read bias is applied that is sufficient to cause formation of a transient bridge in the second dielectric layer, and make a conductive path through the cell if the bridge is present in the first dielectric layer. If the bridge is not present in the first dielectric layer during the read, then the conductive path is not formed. Upon removal of the read bias voltage any the conductive bridge formed in the second dielectric layer is destructed while the conductive bridge in the corresponding other first dielectric layer, if any, remains.
    • 可编程金属化器件包括第一电极和第二电极,以及在第一和第二电极之间串联的第一电介质层,第二电介质层和离子供给层。 在操作中,在第一电介质层中形成或破坏导电桥以表示数据值。 在读取期间,施加足以在第二电介质层中形成瞬态电桥的读取偏压,并且如果桥存在于第一介电层中,则形成通过电池的导电路径。 如果在读取期间桥不在第一电介质层中,则不形成导电路径。 在去除读取的偏置电压时,形成在第二介电层中的任何导电桥被破坏,而相应的其它第一介电层(如果有的话)中的导电桥保留。