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    • 1. 发明申请
    • PROGRAMMABLE METALLIZATION CELL WITH ION BUFFER LAYER
    • 具有离子缓冲层的可编程金属化电池
    • US20110180775A1
    • 2011-07-28
    • US12692861
    • 2010-01-25
    • Yuyu LINFeng-Ming LeeYi-Chou Chen
    • Yuyu LINFeng-Ming LeeYi-Chou Chen
    • H01L45/00H01L29/18H01L21/06
    • H01L45/085H01L45/122H01L45/1233H01L45/1266H01L45/145
    • A programmable metallization device, comprises a first electrode; a memory layer electrically coupled to the first electrode and adapted for electrolytic formation and destruction of a conducting bridge therethrough; an ion-supplying layer containing a source of ions of a first metal element capable of diffusion into and out of the memory layer; a conductive ion buffer layer between the ion-supplying layer and the memory layer, and which allows diffusion therethrough of said ions; and a second electrode electrically coupled to the ion-supplying layer. Circuitry is coupled to the device to apply bias voltages to the first and second electrodes to induce creation and destruction of conducting bridges including the first metal element in the memory layer. The ion buffer layer can improve retention of the conducting bridge by reducing the likelihood that the first metallic element will be absorbed into the ion supplying layer.
    • 可编程金属化器件,包括第一电极; 存储层,其电耦合到所述第一电极并适于通过其导电桥的电解形成和破坏; 离子供给层,其含有能够扩散到所述存储层中的第一金属元素的离子源; 在离子供给层和存储层之间的导电离子缓冲层,并且允许所述离子的扩散; 以及电耦合到所述离子供应层的第二电极。 电路耦合到器件以向第一和第二电极施加偏置电压,以引起包括存储器层中的第一金属元件的导电桥的产生和破坏。 离子缓冲层可以通过降低第一金属元素被吸收到离子供给层中的可能性来改善导电桥的保留。