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1. 发明申请

US20080265348A1 Method of Manufacturing an Image Sensor and Image Sensor 审中-公开
标题翻译：制作图像传感器和图像传感器的方法
公开(公告)号：US20080265348A1
公开(公告)日：2008-10-30
申请号：US11570248
申请日：2005-05-12
申请人： Joris Maas , Leendert De Bruin , Daniel Wilhelmus Elisabeth Verbugt , Nicolaas Johannes Anthonius Van Veen , Eric Cornelis Egbertus Van Grunsven , Gerardus Lubertus Jacobus Reuvers , Erik Harold Groot
发明人： Joris Maas , Leendert De Bruin , Daniel Wilhelmus Elisabeth Verbugt , Nicolaas Johannes Anthonius Van Veen , Eric Cornelis Egbertus Van Grunsven , Gerardus Lubertus Jacobus Reuvers , Erik Harold Groot
IPC分类号： H01L31/0232 , H01L21/86
CPC分类号： H01L31/02162 , H01L27/14621 , H01L27/14625 , H01L27/14627 , H01L27/14632 , H01L27/14636 , H01L27/1464 , H01L27/14685 , H01L31/02327
摘要： A method of manufacturing a back-side (14) illuminated image sensor (1) is disclosed, comprising the steps of: starting with a wafer (2) having a first (3) and a second surface (4), providing light sensitive pixel regions (5) extending into the wafer (2) from the first surface (3), securing the wafer (2) onto a protective substrate (7) such that the first surface (3) faces the protective substrate, the wafer comprising a substrate of a first material (8) with an optical transparent layer (9) and a layer of semiconductor material (10), wherein the substrate (8) is selectively removed from the layer of semiconductor material by using the optical transparent layer (9) as stopping layer. For back-side illuminated image sensors, light has to transmit through the semiconductor layer and enter into the light sensitive pixel regions (5). In order to reduce absorption losses, it is very advantageous that the semiconductor layer (10) can be made relatively thin with a good uniformity. Because of the reduced thickness of the semiconductor layer, more light can enter into the light sensitive regions, resulting in an improved efficiency of the image sensor.
摘要翻译：公开了一种制造背面（14）照明图像传感器（1）的方法，包括以下步骤：从具有第一（3）和第二表面（4）的晶片（2）开始，提供光敏像素从所述第一表面（3）延伸到所述晶片（2）中的区域（5），将所述晶片（2）固定到保护衬底（7）上，使得所述第一表面（3）面向所述保护衬底，所述晶片包括衬底具有光学透明层（9）和半导体材料层（10）的第一材料（8），其中通过使用光学透明层（9）作为选择性地从半导体材料层中去除基板（8）停止层。对于背面照明图像传感器，光必须透过半导体层并进入光敏像素区域（5）。为了减少吸收损失，非常有利的是，半导体层（10）可以制成相对较薄并具有良好的均匀性。由于半导体层的厚度减小，更多的光可以进入光敏区域，从而提高了图像传感器的效率。

2. 发明授权

US07527441B2 Camera module, holder for use in a camera module, camera system and method of manufacturing a camera module 失效
标题翻译：相机模块，用于相机模块的支架，照相机系统和相机模块的制造方法
公开(公告)号：US07527441B2
公开(公告)日：2009-05-05
申请号：US10521259
申请日：2003-07-11
申请人： Erik Harold Groot
发明人： Erik Harold Groot
IPC分类号： G03B17/00
CPC分类号： H04N5/2253 , H04N5/2254
摘要： The invention relates to a camera module 100. The camera module 100 comprises a holder 102, which provides a light-conducting channel 121. Within the light-conducting channel 121 a lens 112 having an optical axis 106 is present. A solid-state image sensor 113 is present near an end 122 of the light-conducting channel 121. The image sensor 113 is provided with an image pick-up section 114, which is oriented perpendicularly to the optical axis 106. Near the end 122 of the light-conducting channel, forming part of the holder 102, aligning means 131 are present for aligning the image pick-up section 114 with the optical axis 106. In one embodiment of the camera module 100, the inner wall 130 of the holder 102 is substantially rectangular, seen in cross-sectional view in a direction perpendicular to the optical axis 106. Bulges 131 present near the corners of the rectangle form the aligning means. The bulges 131 are provided with L-shaped recesses 132 in which the lateral surfaces 125 of the solid-state image sensor 113 are placed substantially without play. This method of aligning the image pick-up section 114 with the optical axis 106 simplifies the manufacture of the camera module 100.
摘要翻译：本发明涉及相机模块100.照相机模块100包括保持器102，其提供导光通道121.在光导通道121内，存在具有光轴106的透镜112。固态图像传感器113存在于导光通道121的端部122附近。图像传感器113设置有垂直于光轴106定向的图像拾取部分114.靠近端部122 存在形成保持器102的一部分的对准装置131，用于使图像拾取部分114与光轴106对准。在照相机模块100的一个实施例中，保持器的内壁130 102在垂直于光轴106的方向的横截面图中看是基本上矩形的。存在于矩形角附近的凸起131形成对准装置。凸起131设置有L形凹部132，其中固态图像传感器113的侧表面125基本上没有播放。将图像拾取部114与光轴106对准的这种方法简化了相机模块100的制造。

3. 发明授权

US07564496B2 Camera device, method of manufacturing a camera device, wafer scale package 有权
标题翻译：相机装置，制造相机装置的方法，晶片级封装
公开(公告)号：US07564496B2
公开(公告)日：2009-07-21
申请号：US10527778
申请日：2003-09-16
申请人： Edwin Maria Wolterink , Gerardus Maria Dohmen , Aloysius Franciscus Maria Sander , Arjen Gerben Van der Sijde , Leendert De Bruin , Erik Harold Groot , Anton Petrus Maria Van Arendonk
发明人： Edwin Maria Wolterink , Gerardus Maria Dohmen , Aloysius Franciscus Maria Sander , Arjen Gerben Van der Sijde , Leendert De Bruin , Erik Harold Groot , Anton Petrus Maria Van Arendonk
IPC分类号： H04N5/225 , H01L29/78 , H01L21/00
CPC分类号： H04N5/2254 , G02B13/001 , G02B13/006 , G02B13/0085 , H01L27/14618 , H01L27/14625 , H01L27/14627 , H01L2924/0002 , H04N5/2257 , H01L2924/00
摘要： The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image capturing element and a spacer means for maintaining a predetermined distance along the main optical axis though the lens and the image capturing element, and lens substrate for carrying the lens wherein the spacer means comprises an adhesive layer. This enables a mass manufacturing process wherein parts of the individual camera elements can be manufactured in manifold on different substrates, after which the different substrates are stacked, aligned and joined via adhesive layers. In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers. From the stack individual camera devices are sawn out.
摘要翻译：本发明涉及相机装置及其制造方法。相机装置包括图像拍摄元件，用于对图像拍摄元件进行成像的透镜元件和用于通过透镜和图像捕获元件沿着主光轴保持预定距离的间隔装置，以及用于承载透镜，其中间隔件包括粘合剂层。这使得能够进行大量制造过程，其中各个相机元件的部分可以在不同基底上的歧管中制造，之后不同的基底通过粘合剂层堆叠，对准和接合。在制造过程中，板和晶片之间的不同距离通过包括粘合剂层的间隔装置进行调节和维持。从堆叠中单独的相机设备被锯出。

4. 发明授权

US06908315B2 Socket for testing a component and method of testing a component 失效
标题翻译：用于测试组件的套接字和测试组件的方法
公开(公告)号：US06908315B2
公开(公告)日：2005-06-21
申请号：US10181084
申请日：2001-11-14
申请人： Erik Harold Groot
发明人： Erik Harold Groot
IPC分类号： G01R1/073 , G01R1/04 , H01R13/24 , H01R33/76 , H01R9/09
CPC分类号： G01R1/0466
摘要： A socket (1) for accommodating and testing a component (2) having several electrical connectors (3) is disclosed, which socket comprises a substantially rectangular frame (4) surrounding a space (5), which frame (4) includes a first row (6) and a second row (7) of electric conductors (8) which are arranged opposite one another, which conductors (8) have first section (9) with a terminal (10) extending into space (5) for contacting an electric connector (3) of the component (2), and a second section (11) projecting from the frame (4). The spacing (12) between the terminals (10) in each row (6, 7) is adjustable. In the method of testing a component (2) in the socket (1), the spacing (12) between the terminals (10) in each row (6, 7) is adjusted to establish electrical contact between the electrical connectors (3) of the component (2) and its corresponding terminal (10) by placing the component (2) in the socket (1).
摘要翻译：公开了一种用于容纳和测试具有多个电连接器（3）的部件（2）的插座（1），该插座包括围绕空间（5）的基本矩形的框架（4），该框架（4）包括第一排（6）和彼此相对布置的电导体（8）的第二排（7），所述导体（8）具有第一部分（9），所述第一部分具有延伸到空间（5）中的端子（10）（2）的连接器（3）和从框架（4）突出的第二部分（11）。每排（6,7）中的端子（10）之间的间隔（12）是可调节的。在测试插座（1）中的部件（2）的方法中，调整每行（6,7）中的端子（10）之间的间隔（12），以建立电连接器（3）之间的电接触通过将组件（2）放置在插座（1）中，组件（2）及其对应的端子（10）。

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