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1. 发明申请

US20090057882A1 Fluid cooled semiconductor power module having double-sided cooling 有权
标题翻译：具有双面冷却的流体冷却半导体功率模块
公开(公告)号：US20090057882A1
公开(公告)日：2009-03-05
申请号：US11899352
申请日：2007-09-05
申请人： Erich W. Gerbsch
发明人： Erich W. Gerbsch
IPC分类号： H01L23/473
CPC分类号： H01L25/072 , H01L23/473 , H01L25/115 , H01L2224/291 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2924/13055 , H01L2924/014 , H01L2924/00
摘要： A semiconductor power module includes one or more power semiconductor power devices sandwiched between a fluid conducting base and a fluid conducting cover joined to the base. Fluid coolant entering the base diverges into a first flow path through the base and a second parallel flow path through the cover, and then converges and discharges through an outlet. The semiconductor devices have upper and lower active areas that are thermally coupled to inboard faces of the cover and base for low double-sided thermal resistance, and the devices are electrically accessed through a set of terminals formed on the base. Multiple sets of semiconductor power devices are double-side cooled by joining multiple fluid conducting covers to the base such that the coolant successively diverges and then re-converges at the locations where each cover is joined to the base. Preferably, the flow paths in both the base and cover include integral features for enhancing the surface area in contact with the coolant.
摘要翻译：半导体功率模块包括一个或多个功率半导体功率器件，其夹在流体导电基座和连接到基座的流体导电盖之间。进入基座的流体冷却剂分流到通过底座的第一流动路径和穿过盖子的第二平行流动路径，然后通过出口收敛和排出。半导体器件具有上下有源区域，其热耦合到盖子和底座的内表面，用于低双面热阻，并且器件通过形成在基座上的一组端子电接触。多组半导体功率器件通过将多个流体导电盖连接到基座而被双面冷却，使得冷却剂依次发散，然后在每个盖接合到基座的位置处重新收敛。优选地，底座和盖子中的流动路径包括用于增强与冷却剂接触的表面积的整体特征。

2. 发明申请

US20090001546A1 Ultra-thick thick film on ceramic substrate 审中-公开
标题翻译：陶瓷基体上的超厚厚膜
公开(公告)号：US20090001546A1
公开(公告)日：2009-01-01
申请号：US11823690
申请日：2007-06-28
申请人： Lynda G. Flederbach , Rick A. Weed , Bradley H. Carter , Erich W. Gerbsch , John K. Isenberg , Carl W. Berlin
发明人： Lynda G. Flederbach , Rick A. Weed , Bradley H. Carter , Erich W. Gerbsch , John K. Isenberg , Carl W. Berlin
IPC分类号： H01L23/373
CPC分类号： H01L23/49861 , H01L23/49833 , H01L2924/0002 , H01L2924/00
摘要： An electrically isolated and thermally conductive double-sided pre-packaged integrated circuit component exhibiting excellent heat dissipative properties, durability and strength, and which can be manufactured at a low cost includes electrically insulated and thermally conductive substrate members having outer surfaces, ultra-thick thick film materials secured to the outer surfaces of the substrate members and a lead member and a transistor member positioned between the substrate members.
摘要翻译：显示出优异的散热特性，耐久性和强度的电绝缘导热双面预先封装的集成电路组件，并且可以以低成本制造，包括具有外表面的超绝缘导热基板部件固定在基板构件的外表面上的薄膜材料和位于基板构件之间的引线构件和晶体管构件。

3. 发明授权

US07295433B2 Electronics assembly having multiple side cooling and method 有权
标题翻译：电子组件具有多个侧面冷却和方法
公开(公告)号：US07295433B2
公开(公告)日：2007-11-13
申请号：US11262400
申请日：2005-10-28
申请人： Ralph S. Taylor , Michael A. Jeter , Erich W. Gerbsch , Jeffrey J. Ronning
发明人： Ralph S. Taylor , Michael A. Jeter , Erich W. Gerbsch , Jeffrey J. Ronning
IPC分类号： H05K7/20
CPC分类号： H05K7/20872 , H05K1/182 , H05K7/20927
摘要： An electronics assembly is provided having a substrate and at least one electronics package supported on the substrate. The electronics package also has electrical circuitry and first and second side surfaces. The assembly further includes a first heat sink device positioned in thermal communication with the first side surface of the electronics package, and a second heat sink device positioned in thermal communication with the second side surface of the electronics package.
摘要翻译：提供了一种电子组件，其具有衬底和支撑在衬底上的至少一个电子封装。电子封装还具有电路和第一和第二侧表面。组件还包括定位成与电子封装的第一侧表面热连通的第一散热器装置，以及定位成与电子封装的第二侧表面热连通的第二散热装置。

4. 发明授权

US07538425B2 Power semiconductor package having integral fluid cooling 有权
标题翻译：功率半导体封装具有整体式流体冷却
公开(公告)号：US07538425B2
公开(公告)日：2009-05-26
申请号：US10900538
申请日：2004-07-28
申请人： Bruce A. Myers , Darrel E. Peugh , Lester Wilkinson , Erich W. Gerbsch
发明人： Bruce A. Myers , Darrel E. Peugh , Lester Wilkinson , Erich W. Gerbsch
IPC分类号： H01L23/34
CPC分类号： H05K1/0272 , H01L23/4334 , H01L23/473 , H01L24/48 , H01L29/0657 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2924/00014 , H01L2924/10253 , H01L2924/13055 , H01L2924/14 , H01L2924/181 , H05K1/0203 , H05K2201/064 , H05K2201/10689 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A power semiconductor device package utilizes integral fluid conducting micro-channels, one or more inlet ports for supplying liquid coolant to the micro-channels, and one or more outlet ports for exhausting coolant that has passed through the micro-channels. The semiconductor device is mounted on a single or multi-layer circuit board having electrical and fluid interconnect features that mate with the electrical terminals and inlet and outlet ports of the device to define a self-contained and self-sealed micro-channel heat exchanger.
摘要翻译：功率半导体器件封装使用集成流体传导微通道，用于向微通道供应液体冷却剂的一个或多个入口端口和用于排出已经通过微通道的冷却剂的一个或多个出口。该半导体器件安装在单层或多层电路板上，该单层或多层电路板具有电气和流体互连特征，其与设备的电端子和入口端口和出口端口配合，以限定独立且自密封的微通道热交换器。

5. 发明申请

US20080198568A1 Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness 有权
标题翻译：双面基板集成电路封装，包括具有增加厚度的引线的引线框架
公开(公告)号：US20080198568A1
公开(公告)日：2008-08-21
申请号：US12150070
申请日：2008-04-24
申请人： Roger A. Mock , Erich W. Gerbsch
发明人： Roger A. Mock , Erich W. Gerbsch
IPC分类号： H05K7/20 , H01R43/00
CPC分类号： H01L23/49833 , H01L23/49861 , H01L2924/0002 , Y10T29/49121 , Y10T29/49222 , H01L2924/00
摘要： An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.
摘要翻译：集成电路封装包括具有第一内表面的第一非导电衬底和具有第二内表面的第二非导电衬底。具有第一厚度的模具设置在第一和第二内表面之间。引线框架包括具有近端和远端的构件。近端具有小于第一厚度的第二厚度。远端设置在第一和第二内表面之间。远端是起伏的，使得远端具有大于第二厚度的有效厚度。

6. 发明授权

US06639798B1 Automotive electronics heat exchanger 有权
标题翻译：汽车电子换热器
公开(公告)号：US06639798B1
公开(公告)日：2003-10-28
申请号：US10178136
申请日：2002-06-24
申请人： Michael A Jeter , Roger A Mock , Erich W Gerbsch , Jeffrey J. Ronning , Ralph S. Taylor , Andrew R. Hayes
发明人： Michael A Jeter , Roger A Mock , Erich W Gerbsch , Jeffrey J. Ronning , Ralph S. Taylor , Andrew R. Hayes
IPC分类号： H05K720
CPC分类号： H05K7/20927 , F28D2021/0029 , F28F3/027 , F28F3/12
摘要： An electronics assembly 10 is provided, including a housing 12 and at least one electronic power device 18 positioned within. A heat sink device 34 is positioned within the housing 12 and is in thermal communication with the electronic power device 18. The heat sink device 34 includes a fluid vessel 44, a fluid input port 50, a fluid output port 52, and at least one fin insert 60 brazed into the fluid vessel 44. The heat sink device 34 is in fluid communication with an automotive radiator 46 such that coolant 48 flows from the automotive radiator 46 through the fluid vessel 44 thereby cooling the electronic power device 18.
摘要翻译：提供电子组件10，其包括壳体12和位于其内的至少一个电子功率器件18。散热装置34定位在壳体12内并与电子功率装置18热连通。散热装置34包括流体容器44，流体输入端口50，流体输出端口52和至少一个翅片插入件60钎焊到流体容器44中。散热装置34与汽车散热器46流体连通，使得冷却剂48从汽车散热器46流过流体容器44，从而冷却电子电力装置18。

7. 发明申请

US20130258592A1 LIQUID COOLED ELECTRONICS ASSEMBLY SUITABLE TO USE ELECTRICALLY CONDUCTIVE COOLANT 有权
标题翻译：液体冷却电子组件适用于电导电冷却液
公开(公告)号：US20130258592A1
公开(公告)日：2013-10-03
申请号：US13432475
申请日：2012-03-28
申请人： SCOTT D. BRANDENBURG , RICHARD D. PARKER , ERICH W. GERBSCH , GARY L. EESLEY , CARL W. BERLIN
发明人： SCOTT D. BRANDENBURG , RICHARD D. PARKER , ERICH W. GERBSCH , GARY L. EESLEY , CARL W. BERLIN
IPC分类号： H05K7/20
CPC分类号： H05K7/20927
摘要： A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly, and then forms another metallic seal between the device assembly and a housing. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.
摘要翻译：一种液冷电力电子组件，其被配置为使用导电冷却剂来冷却功率电子器件，所述电子器件使用利用围绕电介质板的周边的金属密封件密封的电介质板，以形成器件组件，然后在器件组件和一个住房。该配置允许电子设备和冷却剂之间的更直接接触，同时保护电子设备免受潜在导电的冷却剂的接触。用于形成电介质板和壳体的材料被选择为具有相似的热膨胀系数（CTE），使得密封件的可靠性最大化。

8. 发明授权

US07697303B2 Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness 有权
标题翻译：双面基板集成电路封装，包括具有增加厚度的引线的引线框架
公开(公告)号：US07697303B2
公开(公告)日：2010-04-13
申请号：US12150070
申请日：2008-04-24
申请人： Roger A Mock , Erich W. Gerbsch
发明人： Roger A Mock , Erich W. Gerbsch
IPC分类号： H05K5/02
CPC分类号： H01L23/49833 , H01L23/49861 , H01L2924/0002 , Y10T29/49121 , Y10T29/49222 , H01L2924/00
摘要： An integrated circuit package includes a first non-conductive substrate having a first inner surface and a second non-conductive substrate having a second inner surface. A die having a first thickness is disposed between the first and second inner surfaces. A leadframe includes a member having a proximal end and a distal end. The proximal end has a second thickness less than the first thickness. The distal end is disposed between the first and second inner surfaces. The distal end is undulated such that the distal end has an effective thickness greater than the second thickness.
摘要翻译：集成电路封装包括具有第一内表面的第一非导电衬底和具有第二内表面的第二非导电衬底。具有第一厚度的模具设置在第一和第二内表面之间。引线框架包括具有近端和远端的构件。近端具有小于第一厚度的第二厚度。远端设置在第一和第二内表面之间。远端是起伏的，使得远端具有大于第二厚度的有效厚度。

9. 发明授权

US08699225B2 Liquid cooled electronics assembly suitable to use electrically conductive coolant 有权
标题翻译：适合使用导电冷却剂的液冷电子组件
公开(公告)号：US08699225B2
公开(公告)日：2014-04-15
申请号：US13432475
申请日：2012-03-28
申请人： Scott D. Brandenburg , Richard D. Parker , Erich W. Gerbsch , Gary L. Eesley , Carl W. Berlin
发明人： Scott D. Brandenburg , Richard D. Parker , Erich W. Gerbsch , Gary L. Eesley , Carl W. Berlin
IPC分类号： H05K7/20
CPC分类号： H05K7/20927
摘要： A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly, and then forms another metallic seal between the device assembly and a housing. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.
摘要翻译：一种液冷电力电子组件，其被配置为使用导电冷却剂来冷却功率电子器件，所述电子器件使用利用围绕电介质板的周边的金属密封件密封的电介质板，以形成器件组件，然后在器件组件和一个住房。该配置允许电子设备和冷却剂之间的更直接接触，同时保护电子设备免受潜在导电的冷却剂的接触。用于形成电介质板和壳体的材料被选择为具有相似的热膨胀系数（CTE），使得密封件的可靠性最大化。

10. 发明授权

US07960817B2 Semiconductor power module with flexible circuit leadframe 有权
标题翻译：具有柔性电路引线框的半导体电源模块
公开(公告)号：US07960817B2
公开(公告)日：2011-06-14
申请号：US11899365
申请日：2007-09-05
申请人： Erich W. Gerbsch , Robert D. Maple , Monty B. Hayes , Robert J. Campbell
发明人： Erich W. Gerbsch , Robert D. Maple , Monty B. Hayes , Robert J. Campbell
IPC分类号： H01L23/495
CPC分类号： H01L23/36 , H01L23/49861 , H01L23/5385 , H01L23/5387 , H01L25/072 , H01L2224/06181 , H01L2224/32245 , H01L2224/33181 , H01L2924/1305 , H01L2924/13055 , H01L2924/00
摘要： A semiconductor power module includes a semiconductor chip thermally interfaced to a ceramic substrate and a leadframe defined by a flexible circuit disposed intermediate the chip and the ceramic substrate. The flexible circuit includes a conductor layer that is selectively encased in an insulated jacket to ensure adequate electrical insulation between the conductor layer and adjacent conductive surfaces. Preferably, the module is constructed for double side cooling by sandwiching the chip between a pair of ceramic substrates and providing intermediate flexible circuit leadframes on both sides of the chip for electrically accessing the chip terminals.
摘要翻译：半导体功率模块包括与陶瓷衬底热接口的半导体芯片和由设置在芯片和陶瓷衬底之间的柔性电路限定的引线框架。柔性电路包括导体层，其被选择性地封装在绝缘护套中以确保导体层和相邻导电表面之间的充分的电绝缘。优选地，通过将芯片夹在一对陶瓷基板之间并且在芯片的两侧提供用于电接入芯片端子的中间柔性电路引线框架来构造该模块用于双面冷却。

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