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    • 1. 发明授权
    • Fluid ejection device and method for fabricating fluid ejection device
    • 流体喷射装置和制造流体喷射装置的方法
    • US08491095B2
    • 2013-07-23
    • US13041793
    • 2011-03-07
    • Andrew L. McNeesDavid L. BernardPaul W. DryerSean T. WeaverEric S. Hall
    • Andrew L. McNeesDavid L. BernardPaul W. DryerSean T. WeaverEric S. Hall
    • B41J2/16
    • B41J2/1404B41J2002/14403Y10T29/49401
    • Disclosed is a fluid ejection device that includes a nozzle plate. The nozzle plate includes a plurality of nozzles for fluid ejection. Further, the fluid ejection device includes a substrate disposed below the nozzle plate. The substrate includes a top surface adapted to adhere to the nozzle plate. The substrate also includes at least one fluid via configured within the substrate for providing fluid to the plurality of nozzles of the nozzle plate. Furthermore, the fluid ejection device includes at least one supporting structure configured within each fluid via of the at least one fluid via. The at least one supporting structure is further configured at a predetermined depth from the top surface of the substrate to regulate the flow of the fluid from the at least one fluid via to the plurality of nozzles. Further, disclosed is a method to fabricate the fluid ejection device.
    • 公开了一种包括喷嘴板的流体喷射装置。 喷嘴板包括用于流体喷射的多个喷嘴。 此外,流体喷射装置包括设置在喷嘴板下方的基板。 衬底包括适于粘附到喷嘴板的顶表面。 衬底还包括至少一个流体通路,该流体通孔被配置在衬底内,用于向喷嘴板的多个喷嘴提供流体。 此外,流体喷射装置包括至少一个配置在至少一个流体通路的每个流体通路内的支撑结构。 所述至少一个支撑结构进一步构造在距离所述基板的顶表面的预定深度处以调节所述流体从所述至少一个流体通道到所述多个喷嘴的流动。 此外,公开了制造流体喷射装置的方法。
    • 8. 发明申请
    • FLUID EJECTION DEVICE AND METHOD FOR FABRICATING FLUID EJECTION DEVICE
    • 流体喷射装置及其制造流体喷射装置的方法
    • US20120229569A1
    • 2012-09-13
    • US13041793
    • 2011-03-07
    • Andrew L. McNeesDavid L. BernardPaul W. DryerSean T. WeaverEric S. Hall
    • Andrew L. McNeesDavid L. BernardPaul W. DryerSean T. WeaverEric S. Hall
    • B41J2/14B23P17/00
    • B41J2/1404B41J2002/14403Y10T29/49401
    • Disclosed is a fluid ejection device that includes a nozzle plate. The nozzle plate includes a plurality of nozzles for fluid ejection. Further, the fluid ejection device includes a substrate disposed below the nozzle plate. The substrate includes a top surface adapted to adhere to the nozzle plate. The substrate also includes at least one fluid via configured within the substrate for providing fluid to the plurality of nozzles of the nozzle plate. Furthermore, the fluid ejection device includes at least one supporting structure configured within each fluid via of the at least one fluid via. The at least one supporting structure is further configured at a predetermined depth from the top surface of the substrate to regulate the flow of the fluid from the at least one fluid via to the plurality of nozzles. Further, disclosed is a method to fabricate the fluid ejection device.
    • 公开了一种包括喷嘴板的流体喷射装置。 喷嘴板包括用于流体喷射的多个喷嘴。 此外,流体喷射装置包括设置在喷嘴板下方的基板。 衬底包括适于粘附到喷嘴板的顶表面。 衬底还包括至少一个流体通路,该流体通孔被配置在衬底内,用于向喷嘴板的多个喷嘴提供流体。 此外,流体喷射装置包括至少一个配置在至少一个流体通路的每个流体通路内的支撑结构。 所述至少一个支撑结构进一步构造在距离所述基板的顶表面的预定深度处以调节所述流体从所述至少一个流体通道到所述多个喷嘴的流动。 此外,公开了制造流体喷射装置的方法。