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    • 3. 发明授权
    • Method of forming a body-tie
    • 形成身体的方法
    • US07732287B2
    • 2010-06-08
    • US11415703
    • 2006-05-02
    • Paul S. FechnerGordon A. ShawEric E. Vogt
    • Paul S. FechnerGordon A. ShawEric E. Vogt
    • H01L21/336
    • H01L29/78615H01L29/66772
    • A method of forming a body-tie. The method includes forming the body-tie during an STI scheme of an SOI process. During the STI scheme, a first trench is formed. The first trench stops before a buried oxide layer of the SOI substrate. The first trench may determine a height of body tie that is shared between at least two FETs. A second trench may also be formed within the first trench. The second trench stops in the SOI substrate. The second trench defines the location and shape of a body-tie. Once the location and shape of the body-tie are defined, an oxide is deposited above the body-tie. The deposited oxide prevents certain implants from entering the body tie. By preventing these implants, a source and a drain implant may be self-aligned to the source and drain areas without requiring the use of the photoresist mask to shield the body tie regions from the source and drain implant.
    • 一种形成身体的方法。 该方法包括在SOI工艺的STI方案期间形成体系。 在STI方案中,形成第一沟槽。 第一沟槽在SOI衬底的掩埋氧化物层之前停止。 第一沟槽可以确定在至少两个FET之间共享的身体连接的高度。 也可以在第一沟槽内形成第二沟槽。 第二沟槽在SOI衬底中停止。 第二个沟槽定义了一个领带的位置和形状。 一旦定义了身体领带的位置和形状,就会在身体绑带上方沉积氧化物。 沉积的氧化物防止某些植入物进入身体束带。 通过防止这些植入物,源极和漏极注入可以与源极和漏极区域自对准,而不需要使用光致抗蚀剂掩模来屏蔽源极和漏极植入物的主体连接区域。
    • 7. 发明申请
    • Fabrication process for silicon-on-insulator field effect transistors using high temperature nitrogen annealing
    • 使用高温氮退火的绝缘体上硅场效应晶体管的制造工艺
    • US20080254590A1
    • 2008-10-16
    • US11783598
    • 2007-04-10
    • Eric E. VogtPaul S. Fechner
    • Eric E. VogtPaul S. Fechner
    • H01L21/76
    • H01L21/76283H01L21/84H01L27/1203
    • Disclosed is a method of fabricating a silicon-on-insulator (SOI) device that enables high device densities and mitigates variances in carrier mobility and saturation drain current (Idsat). The fabrication method incorporates one or more high temperature nitrogen anneal processes. The high temperature nitrogen anneal nitridizes the interfaces between the n-well and p-well silicon islands and the buried oxide layer. The high temperature nitrogen anneal also nitridizes the interfaces between the n-well and p-well silicon islands and the shallow trench isolation structure. The presence of diffused nitrogen at these interfaces substantially prevents compressive stresses on the n-well and p-well silicon islands, and substantially prevents upward bending of the n-well and p-well silicon islands, which cause variances in carrier mobility and Idsat.
    • 公开了一种制造绝缘体上硅(SOI)器件的方法,其能够实现高器件密度并减轻载流子迁移率和饱和漏极电流的变化(Id)。 该制造方法包括一个或多个高温氮退火工艺。 高温氮退火使n阱和p阱硅岛和掩埋氧化物层之间的界面氮化。 高温氮退火还使n阱和p阱硅岛与浅沟槽隔离结构之间的界面氮化。 在这些界面处扩散氮的存在基本上防止了n阱和p阱硅岛上的压缩应力,并且基本上防止了n阱和p阱硅岛的向上弯曲,这导致载流子迁移率的变化, SUB> sat