专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US5824157A Fluid jet impregnation 失效
标题翻译：流体喷射浸渍
公开(公告)号：US5824157A
公开(公告)日：1998-10-20
申请号：US523881
申请日：1995-09-06
申请人： Elizabeth F. Foster , Jeffrey C. Hedrick , Robert M. Japp , Konstantinos Papathomas , Stephen L. Tisdale , Alfred Viehbeck
发明人： Elizabeth F. Foster , Jeffrey C. Hedrick , Robert M. Japp , Konstantinos Papathomas , Stephen L. Tisdale , Alfred Viehbeck
IPC分类号： B29B15/12 , H05K3/02 , B05C3/12
CPC分类号： B29B15/122 , H05K3/022
摘要： The invention involves a fluid treatment device to solution or melt impregnate a resin or polymer or any combination thereof into a reinforcement which can be utilized to fabricate composite materials for laminates, circuit boards, structural/aerospace materials, automotive components, etc. The invention offers significant advantages and benefits over existing methods and equipment and allows the impregnation process to be performed at lower cost and higher efficiency with increased environmental safety.
摘要翻译：本发明涉及一种流体处理装置，用于将树脂或聚合物或其任何组合溶解或熔融浸渍到可用于制造用于层压材料，电路板，结构/航空航天材料，汽车部件等的复合材料的增强件中。本发明提供与现有方法和设备相比具有显着的优点和优点，并且允许以更低的成本和更高的效率以更高的环境安全性进行浸渍过程。

2. 发明授权

US5725668A Expandable fluid treatment device for tublar surface treatments 失效
标题翻译：可膨胀流体处理装置，用于表面处理
公开(公告)号：US5725668A
公开(公告)日：1998-03-10
申请号：US770067
申请日：1996-12-19
申请人： Elizabeth F. Foster , Jeffrey C. Hedrick , Stephen L. Tisdale , Alfred Viehbeck
发明人： Elizabeth F. Foster , Jeffrey C. Hedrick , Stephen L. Tisdale , Alfred Viehbeck
IPC分类号： B05B13/02 , B05B15/04 , B08B3/02 , B05C1/04
CPC分类号： B08B3/022 , B05B13/0207 , B05B15/0406 , Y02P70/36 , Y10S118/11
摘要： An apparatus for applying a fluid to an outer surface of an elongated work piece having a longitudinal axis and a cross sectional shape, perpendicular to the longitudinal axis. The apparatus has a head member having an interior wall cross sectional shape adapted for receiving the cross sectional shape of the elongated work piece. The interior cross sectional shape defines an interior wall of the head member. The head member has an input end and an output end. The interior wall has means for applying the fluid to a surface of said elongated member. The head member has preferable a first part and a second part which are joined by an expandable member. The means for applying said fluid comprises a plurality of jets for directing said fluid on said surface and a plurality of output parts for recovering said fluid for applying a fluid to an outer surface, said elongated work piece having a longitudinal axis and a cross sectional shape, perpendicular to said longitudinal axis, comprising: a head member having an interior wall cross sectional shape adapted for receiving said cross sectional shape of said elongated work piece; said interior cross sectional shape defining an interior wall of said head member; said head member has an input end and an output end; said interior wall has means for applying said fluid to a surface of said elongated member.
摘要翻译：一种用于将流体施加到具有垂直于纵向轴线的纵向轴线和横截面形状的细长工件的外表面的装置。该装置具有头部构件，其具有适于接收细长工件的横截面形状的内壁横截面形状。内部横截面形状限定了头部构件的内壁。头部构件具有输入端和输出端。内壁具有将流体施加到所述细长构件的表面的装置。头部构件具有优选的第一部分和第二部分，其通过可扩张构件接合。用于施加所述流体的装置包括用于将所述流体引导在所述表面上的多个喷嘴和用于回收用于将流体施加到外表面的所述流体的多个输出部分，所述细长工件具有纵向轴线和横截面形状垂直于所述纵向轴线，包括：头部构件，其具有适于接收所述细长工件的所述横截面形状的内壁横截面形状; 所述内部横截面形状限定所述头部构件的内壁; 所述头部构件具有输入端和输出端; 所述内壁具有将所述流体施加到所述细长构件的表面的装置。

3. 发明授权

US06634543B2 Method of forming metallic z-interconnects for laminate chip packages and boards 有权
公开(公告)号：US06634543B2
公开(公告)日：2003-10-21
申请号：US10040839
申请日：2002-01-07
申请人： Brian E. Curcio , Donald S. Farquhar , Elizabeth F. Foster , Amit K. Sarkhel
发明人： Brian E. Curcio , Donald S. Farquhar , Elizabeth F. Foster , Amit K. Sarkhel
IPC分类号： B23K2000
CPC分类号： H05K3/462 , B23K20/023 , B23K2101/42 , H05K3/244 , H05K3/328 , H05K3/4623 , H05K2201/096
摘要： Deterioration and damage to insulator materials in an interconnection structure having vertical connections due to exposure to heat during bonding of lamina is avoided by performing diffusion bonding of metal pads at plated through holes (PTH) at temperatures below the melting points of conductive material in the bond. Diffusion bonding is achieved during time periods required for processing (e.g. curing or drying) of insulating materials in the laminated structure.

4. 发明授权

US06335495B1 Patterning a layered chrome-copper structure disposed on a dielectric substrate 失效
标题翻译：对设置在电介质基板上的分层铬铜结构进行成形
公开(公告)号：US06335495B1
公开(公告)日：2002-01-01
申请号：US09343073
申请日：1999-06-29
申请人： Donald S. Farquhar , Edmond O. Fey , Elizabeth F. Foster , Michael J. Klodowski
发明人： Donald S. Farquhar , Edmond O. Fey , Elizabeth F. Foster , Michael J. Klodowski
IPC分类号： H01K111
CPC分类号： H05K3/4641 , H05K1/0224 , H05K3/064 , H05K3/388 , H05K2201/015 , H05K2201/0338
摘要： An electrical structure, comprising a first dielectric layer, a patterned layer on the first dielectric layer, and a second dielectric layer on the patterned layer. The patterned layer includes a metal pattern on the first dielectric layer, a metallic pattern on the metal pattern, and a plugged pattern within a remaining space of the patterned layer. The plugged pattern includes a dielectric material. The second dielectric layer is adhesively bonded to a top surface of the patterned layer. The second dielectric layer includes the dielectric material.
摘要翻译：电结构，包括第一电介质层，第一电介质层上的图案化层和图案化层上的第二电介质层。图案化层包括在第一介电层上的金属图案，金属图案上的金属图案，以及图案化层的剩余空间内的堵塞图案。堵塞图案包括电介质材料。第二电介质层粘合到图案化层的顶表面上。第二电介质层包括电介质材料。

5. 发明授权

US6156484A Gray scale etching for thin flexible interposer 失效
标题翻译：用于薄型柔性插入件的灰度刻蚀
公开(公告)号：US6156484A
公开(公告)日：2000-12-05
申请号：US21758
申请日：1998-02-11
申请人： Ernest Bassous , Gobinda Das , Frank Daniel Egitto , Natalie Barbara Feilchenfeld , Elizabeth F. Foster , Stephen Joseph Fuerniss , James Steven Kamperman , Donald Joseph Mikalsen , Michael Roy Scheuermann , David Brian Stone
发明人： Ernest Bassous , Gobinda Das , Frank Daniel Egitto , Natalie Barbara Feilchenfeld , Elizabeth F. Foster , Stephen Joseph Fuerniss , James Steven Kamperman , Donald Joseph Mikalsen , Michael Roy Scheuermann , David Brian Stone
IPC分类号： G01R1/067 , G01R1/073 , G01R3/00 , G03F7/00
CPC分类号： G01R1/06738 , G01R1/07314 , G01R3/00
摘要： Disclosed is a sculpted probe pad and a gray scale etching process for making arrays of such probe pads on a thin flexible interposer for testing the electrical integrity of microelectronic devices at terminal metallurgy. Also used in the etching process is a novel fixture for holding the substrate and a novel mask for 1-step photolithographic exposure. The result of the invention is an array of test probes of preselected uniform topography, which make ohmic contact at all points to be tested simultaneously and nondestructively.
摘要翻译：公开了一种雕刻的探针焊盘和灰度蚀刻工艺，用于在薄的柔性插入件上制造这种探针焊盘的阵列，用于测试终端冶金时的微电子器件的电气完整性。用于蚀刻工艺中的还有一种用于保持衬底的新型夹具和用于1步光刻曝光的新型掩模。本发明的结果是预选的均匀地形的测试探针的阵列，其在所有点上进行欧姆接触以同时且非破坏性地测试。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式