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    • 5. 发明授权
    • Method for requesting trace data reports from FDC semiconductor fabrication processes
    • 从FDC半导体制造工艺请求跟踪数据报告的方法
    • US06871112B1
    • 2005-03-22
    • US09479852
    • 2000-01-07
    • Elfido Coss, Jr.Michael R. ConboyBryce A. Hendrix
    • Elfido Coss, Jr.Michael R. ConboyBryce A. Hendrix
    • H01L21/02H01L21/66G06F19/00
    • H01L22/20H01L2924/0002H01L2924/00
    • The invention is, in its various aspects, a method and apparatus for dynamically generating trace data reports in a semiconductor fabrication process employing fault detection control. The method comprises specifying data including at least one of a parameter, a trigger, and a frequency, for a trace data report; automatically generating from a fault detection controller a request including the specified data to a report generator; formulating the trace data report responsive to the request; and returning the formulated trace data report from the report generator based on the request. The apparatus is a semiconductor fabrication processing system, comprising: a fabrication tool capable of providing at least one of specified data and a trace data report; a fault detection controller capable of automatically generating a request for the trace data report, the request including the specified data; a report generator capable of requesting at least one of the specified data and the trace data report from the fabrication tool and capable of, if the specified data is requested from the fabrication tool, providing the trace data report; and an operator interface for receiving data specified for the trace data report, the specified data including at least one of a parameter, a trigger, and a frequency for the trace data report, and to which the trace data report may be returned from at least one of the report generator and the fabrication tool.
    • 本发明在其各个方面是一种用于在采用故障检测控制的半导体制造过程中动态产生跟踪数据报告的方法和装置。 该方法包括指定用于跟踪数据报告的包括参数,触发和频率中的至少一个的数据; 从故障检测控制器自动生成包括指定数据的请求到报告生成器; 根据请求制定跟踪数据报告; 并根据请求从报告生成器返回已制定的跟踪数据报告。 该装置是半导体制造处理系统,包括:能够提供指定数据和跟踪数据报告中的至少一个的制造工具; 一个故障检测控制器,能够自动产生跟踪数据报告的请求,该请求包括指定的数据; 报告发生器,其能够从所述制造工具请求所述指定数据和跟踪数据报告中的至少一个,并且如果从所述制造工具请求指定的数据,则能够提供所述跟踪数据报告; 以及用于接收为跟踪数据报告指定的数据的操作者界面,所述指定数据包括用于跟踪数据报告的参数,触发和频率中的至少一个,并且跟踪数据报告至少可以从其返回 报告生成器和制作工具之一。
    • 7. 发明授权
    • Automated material handling system method and arrangement
    • US6035245A
    • 2000-03-07
    • US46854
    • 1998-03-24
    • Michael R. ConboyPatrick J. RyanElfido Coss, Jr.
    • Michael R. ConboyPatrick J. RyanElfido Coss, Jr.
    • G06Q10/08G06F17/00
    • G06Q10/08Y10S414/14
    • A computer controlled manufacturing arrangement and method for selecting between multiple paths for transporting cassettes between processing locations. The manufacturing arrangement includes a plurality of stockers interconnected with tracks on which cassettes are carried on vehicles. A first and second stocker are interconnected by at least a first path and a second path formed by the tracks, and a cassette can be transported from the first to the second stocker via either of the two paths. A plurality of robotic arrangements are configured to transfer cassettes between the stockers and the vehicles. A data processing system is coupled to the robotic arrangements and configured and arranged to maintain an historical record of codes indicative of periods of time expended in transporting cassettes from the first stocker to the second stocker via the first path and second path, respectively. When a cassette is to be transported from the first stocker to the second stocker, the data processing system determines, as a function of the historical record of codes associated with the paths, which of the first or second paths is more likely to result in a lesser period of time in transporting the cassette, and selects one of the first or second paths according to which path is more likely to result in a lesser period of time in transporting the cassette. The robotic arrangement is then instructed to load the cassette on the vehicle of the selected path.
    • 8. 发明授权
    • Fault detection system with real-time database
    • 具有实时数据库的故障检测系统
    • US06868512B1
    • 2005-03-15
    • US10229226
    • 2002-08-27
    • Michael L. MillerElfido Coss, Jr.
    • Michael L. MillerElfido Coss, Jr.
    • H01L21/66H02H3/05G01R31/28
    • H01L22/20Y10S707/99953
    • A method includes receiving incoming fault detection and correction (FDC) data. The incoming FDC data is stored in a real-time database, A first subscriber list designating a first subscriber for at least a portion of the incoming FDC data is provided. The portion of the incoming FDC data designated in the first subscriber list is sent to the first subscriber. A system includes at least one data collection source, a real-time database, and a database management unit. The data collection source is configured to generate incoming fault detection and correction (FDC) data. The database management unit is configured to store the incoming FDC data in the real-time database, provide a first subscriber list designating a first subscriber for at least a portion of the incoming FDC data, and send the portion of the incoming FDC data designated in the first subscriber list to the first subscriber.
    • 一种方法包括接收进入的故障检测和校正(FDC)数据。 输入的FDC数据被存储在实时数据库中。提供了为输入FDC数据的至少一部分指定第一订户的第一用户列表。 在第一用户列表中指定的输入FDC数据的部分被发送到第一用户。 系统包括至少一个数据收集源,实时数据库和数据库管理单元。 数据采集​​源被配置为产生进入的故障检测和校正(FDC)数据。 数据库管理单元被配置为将输入的FDC数据存储在实时数据库中,为进入的FDC数据的至少一部分提供指定第一订户的第一订户列表,并且将指定的输入FDC数据的部分发送到 第一订阅者列表。
    • 10. 发明授权
    • Methods of processing substrates based upon substrate orientation
    • 基于基板取向处理基板的方法
    • US06778876B1
    • 2004-08-17
    • US10286586
    • 2002-11-01
    • Elfido Coss, Jr.Howard E. Castle
    • Elfido Coss, Jr.Howard E. Castle
    • G06F1900
    • H01L21/67288H01L21/67259H01L21/681Y10T29/49014
    • The present invention is generally directed to various methods of processing substrates based upon the substrate orientation. In one embodiment, the method comprises determining a defective die pattern of a process tool based upon an orientation of a semiconducting substrate in the tool during processing operations, positioning at least one subsequently processed semiconducting substrate in the process tool at an orientation selected to minimize defective die produced by the process tool, the selected orientation being based upon the determined defective die pattern of the process tool, and performing processing operations in the process tool on at least one subsequently processed substrate while at least one substrate is positioned in the process tool at the selected orientation. In another illustrative embodiment, the method comprises providing a plurality of semiconducting substrates to a processing tool, positioning each of the substrates within the tool at a selected orientation such that at least one electrical performance characteristic of at least one device formed on each of the substrates is optimized when a process operation is performed thereon in the process tool, and performing the processing operation on each of the substrates in the tool while each of the substrates is positioned at the selected orientation.
    • 本发明一般涉及基于衬底取向处理衬底的各种方法。 在一个实施例中,该方法包括基于处理操作期间工具中的半导体衬底的取向来确定工艺工具的有缺陷的芯片图案,将处理工具中的至少一个随后处理的半导体衬底以选择为使缺陷最小化的方向 由工艺工具生产的模具,所选择的取向基于所确定的处理工具的有缺陷的模具图案,并且在至少一个随后处理的基板上的处理工具中执行处理操作,同时至少一个基板位于处理工具中 所选方向。 在另一示例性实施例中,该方法包括向处理工具提供多个半导体衬底,将工件中的每个衬底以选定的取向定位,使得在每个衬底上形成至少一个器件的至少一个电性能特征 当在处理工具中对其进行处理操作时进行优化,并且在每个基板位于所选取​​向的同时对工具中的每个基板执行处理操作。