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    • 1. 发明授权
    • System for detachably mounting semiconductors on conductor substrate
    • 半导体可拆卸地安装在导体基板上的系统
    • US5014161A
    • 1991-05-07
    • US477133
    • 1990-02-07
    • James C. K. LeeGene M. AmdahlRichard BeckChune LeeEdward Hu
    • James C. K. LeeGene M. AmdahlRichard BeckChune LeeEdward Hu
    • H01R13/24H01R43/00H01R43/16
    • H01R13/2414H01R43/007H01R43/16
    • A semiconductor mounting system is provided for the detachable surface mounting of one or more semiconductor dies on a conductor substrate, such as a ceramic substrate or printed circuit board. The system employs a resilient, anisotropic conductor pad which is interposed between the semiconductor die and the conductor substrate. The conductor pad is capable of conducting electric signals in one direction only, and insulates in the other two orthogonal directions. Thus, by compressing the semiconductor die and resilient conductor pad against the conductor substrate, electrical contact is established between contacts on the semiconductor die and corresponding contacts on the conductor substrate. In the preferred embodiment, additional conductor pads are placed over the semiconductor dies, and a heat sink placed over the second conductor pads. In this way, the semiconductor dies are mounted in a resilient structure for protection, while heat dissipation is enhanced by the metallic elements in the second conductor pad.
    • 提供半导体安装系统,用于在诸如陶瓷基板或印刷电路板的导体基板上的一个或多个半导体管芯的可拆卸表面安装。 该系统采用介于半导体管芯和导体衬底之间的弹性各向异性导体焊盘。 导体焊盘只能在一个方向上传导电信号,并且在另外两个正交方向绝缘。 因此,通过将半导体管芯和弹性导体焊盘压靠在导体衬底上,在半导体管芯上的触点和导体衬底上的对应触点之间建立电接触。 在优选实施例中,附加的导体焊盘放置在半导体管芯上方,放置在第二导体焊盘上方的散热片。 以这种方式,半导体管芯被安装在用于保护的弹性结构中,而散热由第二导体焊盘中的金属元件增强。
    • 2. 发明授权
    • Electrical connector for surface mounting
    • 电气连接器用于表面安装
    • US4954873A
    • 1990-09-04
    • US147779
    • 1988-01-25
    • James LeeRichard BeckChune LeeEdward Hu
    • James LeeRichard BeckChune LeeEdward Hu
    • H01R13/24H01R43/00H01R43/16
    • H01R13/2414H01R43/007H01R43/16
    • An anisotropic elastomeric conductor is fabricated by stacking a plurality of first and second sheets, where the first sheets include a plurality of parallel electrically conductive fibers and the second sheets are composed of electrically insulating material. By introducing a curable elastomeric resin into the layered structure of sheets, and then curing the resin, a solid elastomeric block having a plurality of parallel electrically conductive fibers running its length is obtained. Individual elastomeric conductors suitable for interfacing between electronic components are obtained by slicing the block in a direction perpendicular to the conductors. The conductor slices so obtained are particularly suitable for interfacing between electronic devices having planar arrays of electrical contact pads.
    • 通过堆叠多个第一和第二片材制造各向异性弹性体导体,其中第一片材包括多个平行的导电纤维,第二片材由电绝缘材料构成。 通过将可固化的弹性体树脂引入层状结构的片材中,然后固化树脂,获得具有多个平行导电纤维延伸其长度的固体弹性体块体。 通过在与导体垂直的方向上切割块来获得适合于电子部件之间的接合的各个弹性体导体。 如此获得的导体片特别适用于具有电接触焊盘的平面阵列的电子器件之间的接口。