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1. 发明授权

US4754546A Electrical connector for surface mounting and method of making thereof 失效
标题翻译：用于表面安装的电连接器及其制造方法
公开(公告)号：US4754546A
公开(公告)日：1988-07-05
申请号：US841081
申请日：1986-03-18
申请人： James C. K. Lee , Richard Beck , Chune Lee , Edward Hu
发明人： James C. K. Lee , Richard Beck , Chune Lee , Edward Hu
IPC分类号： H01B13/00 , H01R13/24 , H01R43/00 , H01R43/16 , H05K7/14 , H01R13/48
CPC分类号： H01R13/2414 , H01R43/007 , H01R43/16 , Y10T29/4921
摘要： An anisotropic elastomeric conductor is fabricated by stacking a plurality of metal sheets and elastomeric sheets, where the metal sheets have a plurality of parallel electrically conductive elements formed therein. By coating a curable elastomeric resin on the metal sheets, and then curing the resulting layered structure, a solid elastomeric block having a plurality of parallel electrically conductive elements running its length is obtained. Individual elastomeric conductors suitable for interfacing between electronic components are obtained by slicing the block in a direction perpendicular to the conductors. The conductor slices so obtained are particularly suitable for interfacing between electronic devices having planar arrays of electrical contact pads.
摘要翻译：通过堆叠多个金属片和弹性片制造各向异性弹性体导体，其中金属片在其中形成有多个平行的导电元件。通过在金属板上涂覆可固化的弹性体树脂，然后固化所得到的层状结构，得到具有多个平行导电元件的固体弹性体块，该平行导电元件的长度为其长度。通过在与导体垂直的方向上切割块来获得适合于电子部件之间的接合的各个弹性体导体。如此获得的导体片特别适用于具有电接触焊盘的平面阵列的电子器件之间的接口。

2. 发明授权

US5014161A System for detachably mounting semiconductors on conductor substrate 失效
标题翻译：半导体可拆卸地安装在导体基板上的系统
公开(公告)号：US5014161A
公开(公告)日：1991-05-07
申请号：US477133
申请日：1990-02-07
申请人： James C. K. Lee , Gene M. Amdahl , Richard Beck , Chune Lee , Edward Hu
发明人： James C. K. Lee , Gene M. Amdahl , Richard Beck , Chune Lee , Edward Hu
IPC分类号： H01R13/24 , H01R43/00 , H01R43/16
CPC分类号： H01R13/2414 , H01R43/007 , H01R43/16
摘要： A semiconductor mounting system is provided for the detachable surface mounting of one or more semiconductor dies on a conductor substrate, such as a ceramic substrate or printed circuit board. The system employs a resilient, anisotropic conductor pad which is interposed between the semiconductor die and the conductor substrate. The conductor pad is capable of conducting electric signals in one direction only, and insulates in the other two orthogonal directions. Thus, by compressing the semiconductor die and resilient conductor pad against the conductor substrate, electrical contact is established between contacts on the semiconductor die and corresponding contacts on the conductor substrate. In the preferred embodiment, additional conductor pads are placed over the semiconductor dies, and a heat sink placed over the second conductor pads. In this way, the semiconductor dies are mounted in a resilient structure for protection, while heat dissipation is enhanced by the metallic elements in the second conductor pad.
摘要翻译：提供半导体安装系统，用于在诸如陶瓷基板或印刷电路板的导体基板上的一个或多个半导体管芯的可拆卸表面安装。该系统采用介于半导体管芯和导体衬底之间的弹性各向异性导体焊盘。导体焊盘只能在一个方向上传导电信号，并且在另外两个正交方向绝缘。因此，通过将半导体管芯和弹性导体焊盘压靠在导体衬底上，在半导体管芯上的触点和导体衬底上的对应触点之间建立电接触。在优选实施例中，附加的导体焊盘放置在半导体管芯上方，放置在第二导体焊盘上方的散热片。以这种方式，半导体管芯被安装在用于保护的弹性结构中，而散热由第二导体焊盘中的金属元件增强。

3. 发明授权

US5387495A Sequential multilayer process for using fluorinated hydrocarbons as a dielectric 失效
标题翻译：使用氟化烃作为电介质的顺序多层方法
公开(公告)号：US5387495A
公开(公告)日：1995-02-07
申请号：US864375
申请日：1992-04-06
申请人： James C. K. Lee , Arshad Ahmad , Chune Lee , Myrna E. Castro , Francisca Tung
发明人： James C. K. Lee , Arshad Ahmad , Chune Lee , Myrna E. Castro , Francisca Tung
IPC分类号： G03F7/00 , H01L21/48 , H01L23/498 , H05K1/05 , H05K3/10 , H05K3/24 , H05K3/46 , G03C5/00
CPC分类号： H05K3/4647 , G03F7/0035 , H01L21/4857 , H01L23/49894 , H01L2924/0002 , H05K1/056 , H05K2201/015 , H05K2203/0733 , H05K3/108 , H05K3/243
摘要： A method of forming a multilayer circuit board is disclosed which includes a build-up process in which, beginning with a solidified layer of the dielectric disposed upon a substrate, alternate layers of conducting metal and dielectric are sequentially deposited. Each layer of conducting metal lines is defined using photoresist and a photolithographic technique. After the lines are deposited, the photoresist is removed and a second layer of photoresist defines the conductive posts which function as through holes between metal layers. After each layer of conductive line and posts is formed, and the photoresist is removed, the dielectric is flowed into place and solidified to insulate adjacent metal lines and posts. The process may be repeated as many times as necessary to build up layers of conducting metal and dielectric, and form the completed multilayer wiring board.
摘要翻译：公开了一种形成多层电路板的方法，其包括积聚过程，其中从设置在基底上的电介质的凝固层开始，依次沉积交替的导电金属和电介质层。使用光致抗蚀剂和光刻技术限定每层导电金属线。在沉积线之后，去除光致抗蚀剂，并且第二层光致抗蚀剂限定用作金属层之间的通孔的导电柱。在形成每层导电线和柱之后，并且去除光致抗蚀剂，电介质流入就位并固化以使相邻金属线和柱绝缘。该过程可以根据需要重复多次，以建立导电金属和电介质层，并形成完成的多层布线板。

4. 发明授权

US4809962A Fast-clamping vise 失效
标题翻译：快速夹紧虎钳
公开(公告)号：US4809962A
公开(公告)日：1989-03-07
申请号：US170876
申请日：1988-03-21
申请人： Fung-Chune Lee
发明人： Fung-Chune Lee
IPC分类号： B25B1/12 , B25B1/02
CPC分类号： B25B1/125
摘要： A vise includes: a vise body, a stationary vise jaw secured to the vise body, a movable vise jaw operatively moving in cooperation with the stationary vise jaw as driven by a screw, a pair of half nut portions formed on a pair of shear-like clamping handles which are operatively closed to form a combined nut engageable with the screw by a clutch, or opened to disengage the two half nut portions from the screw for fast movement of the movable vise jaw for quickly clamping a work piece between the movable jaw and the stationary jaw.
摘要翻译：台钳包括：虎钳体，固定在虎钳体上的固定虎钳，与由固定的虎钳相配合地运动的可动虎钳爪，由螺钉驱动;一对半螺母部分，类似的夹紧把手可操作地关闭以形成通过离合器与螺钉接合的组合螺母，或者打开以将两个半螺母部分从螺钉上脱开，以便可动虎钳的快速移动，从而快速地将工件夹紧在可动夹爪和静止颚。

5. 发明授权

US4729166A Method of fabricating electrical connector for surface mounting 失效
标题翻译：制造表面安装电连接器的方法
公开(公告)号：US4729166A
公开(公告)日：1988-03-08
申请号：US757600
申请日：1985-07-22
申请人： James Lee , Richard Beck , Chune Lee , Edward Hu
发明人： James Lee , Richard Beck , Chune Lee , Edward Hu
IPC分类号： H01B1/22 , H01R13/24 , H01R43/00 , H01R43/16 , H01R43/20 , H01R13/48
CPC分类号： H01R13/2414 , H01B1/22 , H01R12/714 , H01R43/007 , H01R43/16 , Y10T29/4921
摘要： An anisotropic elastomeric conductor is fabricated by stacking a plurality of first and second sheets, where the first sheets include a plurality of parallel electrically conductive fibers and the second sheets are composed of electrically insulating material. By introducing a curable elastomeric resin into the layered structure of sheets, and then curing the resin, a solid elastomeric block having a plurality of parallel electrically conductive fibers running its length is obtained. Individual elastomeric conductors suitable for interfacing between electronic components are obtained by slicing the block in a direction perpendicular to the conductors. The conductor slices so obtained are particularly suitable for interfacing between electronic devices having planar arrays of electrical contact pads.
摘要翻译：通过堆叠多个第一和第二片材制造各向异性弹性体导体，其中第一片材包括多个平行的导电纤维，第二片材由电绝缘材料构成。通过将可固化的弹性体树脂引入层状结构的片材中，然后固化树脂，获得具有多个平行导电纤维延伸其长度的固体弹性体块体。通过在与导体垂直的方向上切割块来获得适合于电子部件之间的接合的各个弹性体导体。如此获得的导体片特别适用于具有电接触焊盘的平面阵列的电子器件之间的接口。

6. 发明授权

US4577398A Method for mounting a semiconductor chip 失效
标题翻译：半导体芯片的安装方法
公开(公告)号：US4577398A
公开(公告)日：1986-03-25
申请号：US648570
申请日：1984-09-07
申请人： John W. Sliwa , Roy J. Burt , Chune Lee , John MacKay , Cindy A. Johnson
发明人： John W. Sliwa , Roy J. Burt , Chune Lee , John MacKay , Cindy A. Johnson
IPC分类号： H01L21/60 , H01L23/12
CPC分类号： H01L24/83 , H01L24/29 , H01L2224/2919 , H01L2224/83138 , H01L2224/8319 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01018 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01049 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , Y10T29/49128
摘要： A method of attaching a semiconductor chip to a mounting surface is disclosed. A solder barrier is applied to the mounting surface, and a preform of solder is located within the solder barrier. The preform is heated and then cooled in a vacuum to preflow the solder and secure the solder to the mounting surface substantially without voids. The semiconductor chip is then placed over the preflowed solder, which is reheated and then recooled in a vacuum to secure the chip to the mounting surface.
摘要翻译：公开了一种将半导体芯片附接到安装表面的方法。焊接屏障被施加到安装表面，并且焊料预制件位于焊料屏障内。预制件被加热，然后在真空中冷却以预先焊接焊料，并将焊料固定到安装表面上，基本上没有空隙。然后将半导体芯片放置在预先流动的焊料上，该焊料被再加热，然后在真空中再冷却以将芯片固定到安装表面。

7. 发明授权

US4954873A Electrical connector for surface mounting 失效
标题翻译：电气连接器用于表面安装
公开(公告)号：US4954873A
公开(公告)日：1990-09-04
申请号：US147779
申请日：1988-01-25
申请人： James Lee , Richard Beck , Chune Lee , Edward Hu
发明人： James Lee , Richard Beck , Chune Lee , Edward Hu
IPC分类号： H01R13/24 , H01R43/00 , H01R43/16
CPC分类号： H01R13/2414 , H01R43/007 , H01R43/16
摘要： An anisotropic elastomeric conductor is fabricated by stacking a plurality of first and second sheets, where the first sheets include a plurality of parallel electrically conductive fibers and the second sheets are composed of electrically insulating material. By introducing a curable elastomeric resin into the layered structure of sheets, and then curing the resin, a solid elastomeric block having a plurality of parallel electrically conductive fibers running its length is obtained. Individual elastomeric conductors suitable for interfacing between electronic components are obtained by slicing the block in a direction perpendicular to the conductors. The conductor slices so obtained are particularly suitable for interfacing between electronic devices having planar arrays of electrical contact pads.
摘要翻译：通过堆叠多个第一和第二片材制造各向异性弹性体导体，其中第一片材包括多个平行的导电纤维，第二片材由电绝缘材料构成。通过将可固化的弹性体树脂引入层状结构的片材中，然后固化树脂，获得具有多个平行导电纤维延伸其长度的固体弹性体块体。通过在与导体垂直的方向上切割块来获得适合于电子部件之间的接合的各个弹性体导体。如此获得的导体片特别适用于具有电接触焊盘的平面阵列的电子器件之间的接口。

8. 发明授权

US4778950A Anisotropic elastomeric interconnecting system 失效
标题翻译：各向异性弹性互连系统
公开(公告)号：US4778950A
公开(公告)日：1988-10-18
申请号：US853313
申请日：1986-04-17
申请人： James C. K. Lee , Richard Beck , Chune Lee , Edward Hu
发明人： James C. K. Lee , Richard Beck , Chune Lee , Edward Hu
IPC分类号： H01B5/16 , H01L25/065 , H01R11/01 , H01R13/24 , H01R43/00 , H01R43/16 , H05K3/40 , H01B7/00
CPC分类号： H01R13/2414 , H01L25/0657 , H01R43/007 , H05K3/4007 , H05K3/4038 , H01L2224/45147 , H01L2225/0652 , H01L2225/06527 , H01L2225/06579 , H01L2924/00014 , H01L2924/01047 , H01L2924/15312 , H01R43/16 , H05K2201/0133 , H05K2201/0281 , H05K2203/0235 , Y10T29/435
摘要： Electronic assemblies are fabricated by stacking alternate connecting layers and component layers. The component layers may be virtually any rigid structure having contact regions formed on at least one face thereof. The connecting layers are formed from anisotropic elastomeric conductors which in turn are fabricated by stacking a plurality of conductive sheets and insulating sheets, where the conductive sheets have a plurality of parallel electrically conductive elements formed therein. By introducing a curable elastomeric resin into the stacked structure so formed, and then curing the elastomer, a solid elastomeric block having a plurality of parallel electrically conductive elements running its length is obtained. Individual elastomeric conductors suitable as connecting layers interfacing between adjacent component layers are obtained by slicing the block in a direction perpendicular to the conductors.
摘要翻译：电子组件通过堆叠交替的连接层和组件层来制造。组件层可以是几乎任何刚性结构，其具有形成在其至少一个面上的接触区域。连接层由各向异性弹性体导体形成，其又通过堆叠多个导电片和绝缘片来制造，其中导电片在其中形成有多个平行的导电元件。通过将可固化弹性体树脂引入到如此形成的层叠结构中，然后固化弹性体，获得具有多个平行导电元件延伸其长度的固体弹性体块。通过在垂直于导体的方向上切割块来获得适合作为相邻部件层之间连接的连接层的各个弹性体导体。

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