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1. 发明授权

US11719428B2 Compressive heat sink 有权
公开(公告)号：US11719428B2
公开(公告)日：2023-08-08
申请号：US17604753
申请日：2020-04-18
申请人： Edward B. Stoneham
发明人： Edward B. Stoneham
IPC分类号： F21V29/71 , F21V19/00 , F21Y115/10
CPC分类号： F21V29/717 , F21V19/0035 , F21Y2115/10
摘要： A heat-sink assembly is configured with two parts to grip a light-emitting element and produce a transverse force urging a surface of the light-emitting element toward a surface of the heat-sink assembly, which conducts heat away from the light-emitting element. Fastening mechanisms and a fulcrum inter-connect the heat-sink parts and produce the force that grips the light-emitting element. A configuration of the heat-sink parts creates a semi-enclosed space accessible through a gap. A configuration of elastomeric gaskets within the semi-enclosed space protects a portion of the space from intrusion of liquids or other environmental influences. Configuration of the heat-sink parts to form a recess in the heat-sink assembly provides protection of the light-emitting element from mechanical damage, and the recess may contain transparent materials that further protect the light-emitting element from detrimental environmental influences.

2. 发明授权

US07411279B2 Component interconnect with substrate shielding 失效
标题翻译：元件互连与基板屏蔽
公开(公告)号：US07411279B2
公开(公告)日：2008-08-12
申请号：US10882378
申请日：2004-06-30
申请人： Edward B. Stoneham , Thomas M. Gaudette
发明人： Edward B. Stoneham , Thomas M. Gaudette
IPC分类号： H01L39/02
CPC分类号： H01L23/552 , H01L23/66 , H01L24/48 , H01L25/0655 , H01L25/16 , H01L2224/48091 , H01L2924/00014 , H01L2924/14 , H01L2924/1423 , H01L2924/16153 , H01L2924/19041 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An example of a circuit structure may include a first dielectric layer having first and second surfaces, and a channel extending at least partially between the first and second surfaces and along a length of the first dielectric layer. First and second conductive layers may be disposed on respective portions of the first and second surfaces. A first conductor, having an end, may be disposed on a surface of the first dielectric layer, including at least a first portion extending around at least a portion of the conductor end. The second conductive layer may line the channel extending around a portion of the conductor end. Some examples may include a stripline having a second conductor connected to the first conductor. Some examples may include a cover having a wall positioned on the first dielectric over the second conductor.
摘要翻译：电路结构的示例可以包括具有第一和第二表面的第一介电层以及至少部分地在第一和第二表面之间以及沿着第一介电层的长度延伸的通道。第一和第二导电层可以设置在第一和第二表面的相应部分上。具有端部的第一导体可以设置在第一电介质层的表面上，包括至少围绕导体端的至少一部分延伸的第一部分。第二导电层可以围绕导体端的一部分延伸的通道线。一些示例可以包括具有连接到第一导体的第二导体的带状线。一些示例可以包括具有位于第二导体上的第一电介质上的壁的盖。

3. 发明授权

US5087959A Protective coating useful as a passivation layer for semiconductor devices 失效
标题翻译：保护涂层可用作半导体器件的钝化层
公开(公告)号：US5087959A
公开(公告)日：1992-02-11
申请号：US162912
申请日：1988-03-02
申请人： Masahiro Omori , Edward B. Stoneham
发明人： Masahiro Omori , Edward B. Stoneham
IPC分类号： H01L23/29 , H01L23/31
CPC分类号： H01L23/298 , H01L23/3171 , H01L23/3192 , H01L2924/0002 , H01L2924/19041
摘要： A protective coating useful as a passivation layer for semiconductor devices incorporates a thin film of an amorphous diamond-like carbon. In one implementation, a thin film of amorphous silicon is deposited over the carbon material. The semiconductive passivation coating prevents electrical shorts, dissipates charge build-up and protects against chemical contamination.
摘要翻译：可用作半导体器件的钝化层的保护涂层结合有非晶类金刚石碳的薄膜。在一个实施方案中，非晶硅薄膜沉积在碳材料上。半导体钝化涂层防止电气短路，消除电荷积聚并防止化学污染。

4. 发明申请

US20220214033A1 COMPRESSIVE HEAT SINK 有权
公开(公告)号：US20220214033A1
公开(公告)日：2022-07-07
申请号：US17604753
申请日：2020-04-18
申请人： Edward B. Stoneham
发明人： Edward B. Stoneham
IPC分类号： F21V29/71 , F21V19/00
摘要： A heat-sink assembly is configured with two parts to grip a light-emitting element and produce a transverse force urging a surface of the light-emitting element toward a surface of the heat-sink assembly, which conducts heat away from the light-emitting element. Fastening mechanisms and a fulcrum inter-connect the heat-sink parts and produce the force that grips the light-emitting element. A configuration of the heat-sink parts creates a semi-enclosed space accessible through a gap. A configuration of elastomeric gaskets within the semi-enclosed space protects a portion of the space from intrusion of liquids or other environmental influences. Configuration of the heat-sink parts to form a recess in the heat-sink assembly provides protection of the light-emitting element from mechanical damage, and the recess may contain transparent materials that further protect the light-emitting element from detrimental environmental influences.

5. 发明申请

US20200037410A1 APPARATUS AND METHODS FOR CONTROLLING LED LIGHT FLUX 审中-公开
公开(公告)号：US20200037410A1
公开(公告)日：2020-01-30
申请号：US16337412
申请日：2017-10-02
申请人： Edward B. Stoneham
发明人： Edward B. Stoneham
IPC分类号： H05B33/08
摘要： A rectangular pulse generator system is operatively configured to generate a generator output signal, the generator output signal formed as a base rectangular waveform gated by a modulating rectangular waveform, the base rectangular waveform having a first frequency and the modulating rectangular waveform having a second frequency less than the first frequency. A low-pass filter coupled to the rectangular pulse generator system is configured to receive a filter input signal representative of the generator output signal and to produce a filter output signal representative of the filter input signal. A voltage-controlled current source coupled to the low-pass filter generates a drive signal conducted by at least one LED producing a light flux determined by the current level of the LED drive signal. Methods are devised for calibration and for setting the average light flux level.

6. 发明授权

US07813145B2 Circuit structure with multifunction circuit cover 有权
标题翻译：具有多功能电路盖的电路结构
公开(公告)号：US07813145B2
公开(公告)日：2010-10-12
申请号：US11692129
申请日：2007-03-27
申请人： Edward B. Stoneham , Thomas M. Gaudette
发明人： Edward B. Stoneham , Thomas M. Gaudette
IPC分类号： H05K9/00
CPC分类号： H05K9/0024 , H01L2224/48091 , H01L2224/73265 , H01L2924/16152 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要： A cover assembly may be mounted on a substrate. The cover assembly may have an interior surface spaced from the substrate and may bound a hollow chamber over a circuit assembly. The hollow chamber may be filled with a fluid, such as a gas or a liquid. The cover assembly may also have an edge extending along the substrate around the circuit assembly and may include a dielectric cover, an electromagnetic shield, a conductive assembly, a resistive layer, and an aperture with a gas-permeable membrane. The electromagnetic shield. The dielectric cover may substantially enclose the hollow chamber bounded by the cover assembly. The electromagnetic shield may be attached to the dielectric cover and also substantially enclose the hollow chamber. The conductive assembly may extend along and may be electrically isolated from the electromagnetic shield. The conductive assembly may be conductively coupled to the circuit assembly.
摘要翻译：盖组件可以安装在基板上。盖组件可以具有与基板间隔开的内表面，并且可以在电路组件上限定中空室。中空室可以填充有诸如气体或液体的流体。盖组件还可以具有沿着基板围绕电路组件延伸的边缘，并且可以包括电介质盖，电磁屏蔽，导电组件，电阻层和具有透气膜的孔。电磁屏蔽。电介质盖可以基本上封闭由盖组件限定的中空室。电磁屏蔽件可以附接到电介质盖并且基本上包围中空室。导电组件可以沿着电磁屏蔽件延伸并且可以与电磁屏蔽件电隔离。导电组件可以导电地耦合到电路组件。

7. 发明申请

US20090219110A1 MERGED-FILTER MULTIPLEXER 有权
标题翻译：合并过滤器多路复用器
公开(公告)号：US20090219110A1
公开(公告)日：2009-09-03
申请号：US12039536
申请日：2008-02-28
申请人： Edward B. STONEHAM
发明人： Edward B. STONEHAM
IPC分类号： H01P1/213 , H03H7/46
CPC分类号： H01P1/213 , H01P1/2135 , H03D7/02
摘要： A multiplexer circuit may include a first-frequency-quarter-wavelength transmission line extending between a junction between a common terminal and a second-frequency terminal, and a first-frequency low-impedance circuit electrically directly connecting the first transmission line to a circuit ground. In some examples, a second-frequency-quarter-wavelength transmission line may extend between the first transmission line and a third-frequency terminal. A second-frequency low-impedance circuit may electrically directly connect the second transmission line to the circuit ground. The first and second transmission lines and the first and second low-impedance circuits may provide a third-frequency transmission line. A further second-frequency low-impedance circuit may electrically couple the second terminal to the first transmission line. A third-frequency low-impedance circuit may electrically couple the second terminal to the circuit ground. The first-frequency, further second-frequency, and third-frequency low-impedance circuits and the first transmission line may provide in combination a second-frequency transmission line.
摘要翻译：多路复用器电路可以包括在公共端子和第二频率端子之间的连接点之间延伸的第一频率四分之一波长的传输线，以及将第一传输线电连接到电路接地的第一频率低阻抗电路。在一些示例中，第二频率四分之一波长的传输线可以在第一传输线和第三频率终端之间延伸。第二频率低阻抗电路可以将第二传输线电连接到电路接地。第一和第二传输线以及第一和第二低阻抗电路可以提供第三频率传输线。另一个第二频率低阻抗电路可以将第二端子电耦合到第一传输线。第三频率低阻抗电路可以将第二端子电耦合到电路接地。第一频率，第二频率和第三频率低阻抗电路和第一传输线可以组合提供第二频率传输线。

8. 发明授权

US07276988B2 Multi-substrate microstrip to waveguide transition 有权
标题翻译：多衬底微带至波导过渡
公开(公告)号：US07276988B2
公开(公告)日：2007-10-02
申请号：US10882885
申请日：2004-06-30
申请人： Edward B. Stoneham
发明人： Edward B. Stoneham
IPC分类号： H01P5/107
CPC分类号： H01P5/107
摘要： A method and apparatus for coupling a conductor-based transmission line, such as a strip transmission line, to a waveguide. The transmission line may be separated from a corresponding conducting ground plane by a first dielectric substrate layer. The ground plane may be adhesively coupled to a portion of the waveguide, and may be offset from the interior of the waveguide, so that adhesive squeezed out between the ground plane and the waveguide may be at least partially shielded from the waveguide, and thus does not significantly perturb electromagnetic signals within the waveguide.
摘要翻译：一种用于将诸如带状传输线的基于导体的传输线耦合到波导的方法和装置。传输线可以通过第一电介质基底层与对应的导电接地平面分离。接地平面可以粘合地耦合到波导的一部分，并且可以从波导的内部偏移，使得在接地平面和波导之间挤出的粘合剂可以至少部分地与波导屏蔽，因此不明显扰乱波导内的电磁信号。

9. 发明授权

US5983089A Slotline-mounted flip chip 失效
标题翻译：插槽式倒装芯片
公开(公告)号：US5983089A
公开(公告)日：1999-11-09
申请号：US725972
申请日：1996-10-04
申请人： Clifford A. Mohwinkel , Edward B. Stoneham , Edwin F. Johnson
发明人： Clifford A. Mohwinkel , Edward B. Stoneham , Edwin F. Johnson
IPC分类号： H05K3/34 , H01L23/66 , H01P5/08 , H01P5/12 , H03D9/06 , H03F3/60 , H03F3/68 , H04B1/26
CPC分类号： H03F3/604 , H01L23/66 , H01L2223/6644 , H01L2224/16 , H01L2924/3011 , H03F2200/372
摘要： First and second slotlines are mounted on an electrically insulating substrate having a planar face with a connection region. Each slotline has first and second, spaced-apart coplanar conductors that extend into the connection region. A fifth, ground conductor, also mounted on the substrate face, is spaced from and coplanar with the first and second slotlines and has a proximal portion in the connection region. A chip circuit includes first and second field-effect transistors (FETs) flip mounted in the connection region to all five conductors. The gates of the FETs are connected to the first slotline for receiving an input signal. The drains are connected to the second slotline for outputting the signal amplified by the transistors. The sources of the FETs are connected to the fifth conductor. This general configuration can be modified for use as an amplifier, oscillator, frequency multiplier or mixer. The slotline may divide into parallel slotline portions for providing plural circuits in parallel with distributed impedance matching. A slotline may loop back from the connection region to provide a choice for impedance matching, and a portion of the fifth conductor may extend between slotline conductors to provide capacitive coupling.
摘要翻译：第一和第二槽线安装在具有连接区域的具有平面的电绝缘基板上。每个槽线具有延伸到连接区域中的第一和第二间隔开的共面导体。也安装在基板表面上的第五个接地导体与第一和第二槽槽间隔开并且与第一和第二槽槽线共面并且在连接区域中具有近端部分。芯片电路包括第一和第二场效应晶体管（FET），其在与所有五个导体的连接区域中翻转安装。 FET的栅极连接到第一时隙线以接收输入信号。漏极连接到第二槽线，用于输出由晶体管放大的信号。 FET的源极连接到第五导体。该通用配置可以被修改为用作放大器，振荡器，倍频器或混频器。时隙线可以划分成并行的时隙线部分，用于与分布式阻抗匹配并行提供多个电路。缝线可以从连接区域回环以提供阻抗匹配的选择，并且第五导体的一部分可以在缝线导体之间延伸以提供电容耦合。

10. 发明授权

US5942957A Flip-mounted impedance 失效
标题翻译：倒装阻抗
公开(公告)号：US5942957A
公开(公告)日：1999-08-24
申请号：US929688
申请日：1997-09-15
申请人： Clifford A. Mohwinkel , Edwin F. Johnson , Edward B. Stoneham
发明人： Clifford A. Mohwinkel , Edwin F. Johnson , Edward B. Stoneham
IPC分类号： H03F1/56 , H03F3/60 , H01P5/12
CPC分类号： H03F3/605 , H03F1/56 , H03F3/604 , H01L2223/6644 , H03F2200/372
摘要： A radio-frequency power amplifier includes a multiple-FET chip that is flip-mounted on a connection region of a substrate. An input impedance-matching network is also mounted on the substrate. The network includes a coplanar waveguide having an elongate waveguide signal conductor for each gate terminal on the FET chip with a distal end spaced from the connection region and a proximal end in the connection region. The distal ends are connected to a single base input conductor. The proximal ends are flip-mounted to respective ones of gate terminals of the FET chip. A capacitor couples each of the input signal conductor distal ends to an adjacent ground conductor. The signal conductors and capacitors provide a selected impedance at a selected frequency. The capacitors may be on a separate chip flip-mounted to the coplanar transmission line conductors, and may be formed as coplanar waveguides with open-ended signal conductors or as overlay capacitors. An output coplanar waveguide includes, for each drain terminal, an output signal conductor having an end in the connection region that is electrically connected to the flip-mounted FET chip. This waveguide also has a length selected to provide desired impedance matching.
摘要翻译：射频功率放大器包括翻转安装在基板的连接区域上的多FET芯片。输入阻抗匹配网络也安装在基板上。网络包括共面波导，其具有用于FET芯片上的每个栅极端子的细长波导信号导体，其远端与连接区域间隔开，远端在连接区域中。远端连接到单个基本输入导体。近端被倒置安装到FET芯片的各个栅极端子。电容器将每个输入信号导体远端连接到相邻的接地导体。信号导体和电容器以选定的频率提供选定的阻抗。电容器可以在与共面的传输线导体上翻转安装的单独的芯片上，并且可以形成为具有开放式信号导体或覆盖电容器的共面波导。输出共面波导包括针对每个漏极端子的输出信号导体，该输出信号导体在连接区域中与电连接到翻盖式FET芯片的端部连接。该波导还具有选择的长度以提供期望的阻抗匹配。

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