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1. 发明申请

US20090219110A1 MERGED-FILTER MULTIPLEXER 有权
标题翻译：合并过滤器多路复用器
公开(公告)号：US20090219110A1
公开(公告)日：2009-09-03
申请号：US12039536
申请日：2008-02-28
申请人： Edward B. STONEHAM
发明人： Edward B. STONEHAM
IPC分类号： H01P1/213 , H03H7/46
CPC分类号： H01P1/213 , H01P1/2135 , H03D7/02
摘要： A multiplexer circuit may include a first-frequency-quarter-wavelength transmission line extending between a junction between a common terminal and a second-frequency terminal, and a first-frequency low-impedance circuit electrically directly connecting the first transmission line to a circuit ground. In some examples, a second-frequency-quarter-wavelength transmission line may extend between the first transmission line and a third-frequency terminal. A second-frequency low-impedance circuit may electrically directly connect the second transmission line to the circuit ground. The first and second transmission lines and the first and second low-impedance circuits may provide a third-frequency transmission line. A further second-frequency low-impedance circuit may electrically couple the second terminal to the first transmission line. A third-frequency low-impedance circuit may electrically couple the second terminal to the circuit ground. The first-frequency, further second-frequency, and third-frequency low-impedance circuits and the first transmission line may provide in combination a second-frequency transmission line.
摘要翻译：多路复用器电路可以包括在公共端子和第二频率端子之间的连接点之间延伸的第一频率四分之一波长的传输线，以及将第一传输线电连接到电路接地的第一频率低阻抗电路。在一些示例中，第二频率四分之一波长的传输线可以在第一传输线和第三频率终端之间延伸。第二频率低阻抗电路可以将第二传输线电连接到电路接地。第一和第二传输线以及第一和第二低阻抗电路可以提供第三频率传输线。另一个第二频率低阻抗电路可以将第二端子电耦合到第一传输线。第三频率低阻抗电路可以将第二端子电耦合到电路接地。第一频率，第二频率和第三频率低阻抗电路和第一传输线可以组合提供第二频率传输线。

2. 发明申请

US20080153206A1 CHIP MOUNTING WITH FLOWABLE LAYER 有权
标题翻译：芯片安装与流动层
公开(公告)号：US20080153206A1
公开(公告)日：2008-06-26
申请号：US12042144
申请日：2008-03-04
申请人： Edward B. STONEHAM , Thomas M. GAUDETTE
发明人： Edward B. STONEHAM , Thomas M. GAUDETTE
IPC分类号： H01L21/00
CPC分类号： H01L24/32 , H01L23/13 , H01L24/48 , H01L24/83 , H01L25/0655 , H01L2224/05554 , H01L2224/27013 , H01L2224/45014 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2224/83051 , H01L2224/8385 , H01L2924/00014 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/14 , H01L2924/1423 , H01L2924/1433 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2224/45015 , H01L2924/207
摘要： A circuit structure may be formed in a substrate having a face and an open trench, where one or more chips are to be mounted. At least one bridge may extend across an intermediate portion of the trench, and optionally, may divide the trench into sections. A conductive adhesive layer may be applied to the substrate face and, if included, the bridge. One or more circuit chips may be mounted on the adhesive layer, with at least one edge of one circuit chip adjacent to the trench. Alternatively or additionally, an adhesive layer may be applied to a base of a chip and then mounted to the substrate face, in like fashion. The trench may accommodate excess adhesive flowing out from under the one or more chips, while the bridge retains the adhesive across the width of the trench. If the adhesive is conductive, this provides continuity of the conductive layer on the face of the substrate across the trench. In one example, pairs of circuit chips may be effectively mounted in adjacent relationship for interconnection without interference from excess adhesive.
摘要翻译：电路结构可以形成在具有面和开放沟槽的衬底中，其中将安装一个或多个芯片。至少一个桥可以延伸穿过沟槽的中间部分，并且可选地，可以将沟槽划分成多个部分。可以将导电粘合剂层施加到基板表面，如果包括桥，则应用导电粘合剂层。一个或多个电路芯片可以安装在粘合剂层上，其中一个电路芯片的至少一个边缘与沟槽相邻。或者或另外，粘合剂层可以施加到芯片的基部，然后以类似的方式安装到基板面。沟槽可以容纳从一个或多个芯片下面流出的多余的粘合剂，同时桥将粘合剂保持在沟槽的宽度上。如果粘合剂是导电的，则这提供了穿过沟槽的衬底的表面上的导电层的连续性。在一个示例中，电路芯片对可以有效地安装在相邻的关系中用于互连，而不会受到多余粘合剂的干扰。

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