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    • 1. 发明授权
    • Providing secondary power pins in integrated circuit design
    • 在集成电路设计中提供二次电源引脚
    • US08495547B2
    • 2013-07-23
    • US12910336
    • 2010-10-22
    • Joachim KeinertDouglass T. LambPeter J. Osler
    • Joachim KeinertDouglass T. LambPeter J. Osler
    • G06F17/50
    • G06F17/5077
    • An integrated circuit (IC) design with multiple metal layers containing cells requiring secondary power supply. After placing the cells and stripes of a primary power/ground grid in metal layers of the IC design, specific cells are provided with secondary power stripes in a first metal layer. The secondary power stripes are designed in such a way that each secondary power/ground stripe exhibits a full overlap with a stripe of a corresponding primary power/ground grid in a different metal layer. Subsequently, signals from the IC design are routed, and power vias between the primary power/ground grid stripes and the secondary power/ground stripes are generated.
    • 集成电路(IC)设计,具有多个含有需要二次电源的电池的金属层。 在将主电源/接地网格的电池和条纹放置在IC设计的金属层中之后,特定电池在第一金属层中设置有次级电源条。 次级功率条纹被设计成使得每个次级电源/接地条带与不同金属层中的对应的主电源/接地网格的条带完全重叠。 随后,来自IC设计的信号被路由,并且产生主电源/接地网格条和次级电源/接地条之间的电源通孔。
    • 7. 发明授权
    • Creating integrated circuit capacitance from gate array structures
    • 从门阵列结构创建集成电路电容
    • US07728362B2
    • 2010-06-01
    • US11337010
    • 2006-01-20
    • Anthony Correale, Jr.Benjamin J. BowersDouglass T. LambNishith Rohatgi
    • Anthony Correale, Jr.Benjamin J. BowersDouglass T. LambNishith Rohatgi
    • H01L27/10
    • H01L27/11807H01L27/0207H01L27/11898H01L28/40
    • Using gate arrays to create capacitive structures within an integrated circuit are disclosed. Embodiments comprise having a gate array of P-type field effect transistors (P-fets) and N-type field effect transistors (N-fets) in an integrated circuit design, coupling drains and sources for one or more P-fets and gates for one or more N-fets to a power supply ground, and coupling gates for the one or more P-fets and the drains and sources for one or more N-fets to a positive voltage of the power supply. In some embodiments, source-to-drain leakage current for capacitive apparatuses of P-fets and N-fets are minimized by biasing one or more P-fets and one or more N-fets to the positive voltage and the ground, respectively. In other embodiments, the capacitive structures may be implemented using fusible elements to isolate the capacitive structures in case of shorts.
    • 公开了使用门阵列来在集成电路内形成电容结构。 实施例包括在集成电路设计中具有P型场效应晶体管(P-fets)和N型场效应晶体管(N-fets)的栅极阵列,将用于一个或多个P-fets和栅极的漏极和源耦合 将一个或多个N-fets连接到电源地,以及将一个或多个P-fets的栅极和用于一个或多个N-fets的漏极和源耦合到电源的正电压。 在一些实施例中,通过将一个或多个P-fets和一个或多个N-fets分别偏置到正电压和地电位,P-fets和N-fets的电容式设备的源极到漏极泄漏电流被最小化。 在其他实施例中,可以使用可熔元件实现电容结构,以在短路的情况下隔离电容结构。
    • 9. 发明授权
    • Creating integrated circuit capacitance from gate array structures
    • 从门阵列结构创建集成电路电容
    • US08188516B2
    • 2012-05-29
    • US12717605
    • 2010-03-04
    • Anthony Correale, Jr.Benjamin J. BowersDouglass T. LambNishith Rohatgi
    • Anthony Correale, Jr.Benjamin J. BowersDouglass T. LambNishith Rohatgi
    • H01L27/10H01L23/52
    • H01L27/11807H01L27/0207H01L27/11898H01L28/40
    • Techniques for using gate arrays to create capacitive structures within an integrated circuit are disclosed. Embodiments comprise placing a gate array of P-type field effect transistors (P-fets) and N-type field effect transistors (N-fets) in an integrated circuit design, coupling drains and sources for one or more P-fets and gates for one or more N-fets to a power supply ground, and coupling gates for the one or more P-fets and the drains and sources for one or more N-fets to a positive voltage of the power supply. In some embodiments, source-to-drain leakage current for capacitive apparatuses of P-fets and N-fets are minimized by biasing one or more P-fets and one or more N-fets to the positive voltage and the ground, respectively. In other embodiments, the capacitive structures may be implemented using fusible elements to isolate the capacitive structures in case of shorts.
    • 公开了在集成电路内使用门阵列来形成电容结构的技术。 实施例包括将P型场效应晶体管(P-fets)和N型场效应晶体管(N-fets)的栅极阵列放置在集成电路设计中,将用于一个或多个P-fets和栅极的漏极和源耦合 将一个或多个N-fets连接到电源地,以及将一个或多个P-fets的栅极和用于一个或多个N-fets的漏极和源耦合到电源的正电压。 在一些实施例中,通过将一个或多个P-fets和一个或多个N-fets分别偏置到正电压和地电位,P-fets和N-fets的电容式设备的源极到漏极泄漏电流被最小化。 在其他实施例中,可以使用可熔元件实现电容结构,以在短路的情况下隔离电容结构。
    • 10. 发明授权
    • Method and program product of level converter optimization
    • 电平转换器优化的方法和程序产品
    • US07089510B2
    • 2006-08-08
    • US10720562
    • 2003-11-24
    • Anthony Correale, Jr.David S. KungDouglass T. LambZhigang PanRuchir Puri
    • Anthony Correale, Jr.David S. KungDouglass T. LambZhigang PanRuchir Puri
    • G06F17/50
    • G06F17/5068G06F17/5045
    • A method and program product for optimizing level converter placement in a multi supply integrated circuit. Each level converter is placed at a minimum power point to minimize net power and transitional delay from a first (low) voltage net source through the level converter and to a second (higher) voltage net sink. Then, inefficient level converters are eliminated. Level converters with fanin cones below a selected minimum cone size are deleted and low voltage sources to the deleted level converter reverted. Higher voltage level circuit elements receiving inputs from multiple level converters are replaced with equivalent low voltage circuit elements. Low voltage buffer driving level converters are both replaced by a single said level converter.
    • 一种用于优化多电源集成电路中的电平转换器放置的方法和程序产品。 每个电平转换器被放置在最小功率点以最小化净功率和从第一(低)电压净源通过电平转换器到第二(较高)电压净接收器的过渡延迟。 然后,消除了低效率的电平转换器。 具有低于选定的最小锥度尺寸的扇形锥体的电平转换器被删除,并且删除的电平转换器的低电压源恢复。 接收来自多电平转换器的输入的更高电压电平的电路元件被等效的低电压电路元件代替。 低电压缓冲器驱动电平转换器都由单个所述电平转换器代替。