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    • 3. 发明授权
    • Soldering method and apparatus
    • 焊接方法和装置
    • US5234157A
    • 1993-08-10
    • US970409
    • 1992-11-02
    • Linda M. FletcherLeslie A. GuthDouglas W. Monroe
    • Linda M. FletcherLeslie A. GuthDouglas W. Monroe
    • B23K3/02B23K3/08
    • B23K3/085B23K3/02
    • An component or connector lead (12) is soldered to a bare copper metallized area (14) on a circuit board (16) using core solder (26) by manually applying heat from a heated tip (24) to a separate one of the lead and metallized area. As the heat is being applied, a vacuum is drawn in the region where the solder is applied to the lead and/or metallized area to draw off any flux vapors created upon heating of the solder. At the same time, hot air is also directed into the region where the solder is being applied to maintain the flux vapors, created upon heating of the solder, in their vaporous state to facilitate such vapors being drawn off, thereby reducing the amount of flux residues resulting from the soldering operation.
    • 组件或连接器引线(12)通过使用芯焊料(26)通过手动将热量从加热的尖端(24)施加到引线的单独一个而被焊接到电路板(16)上的裸铜金属化区域(14) 和金属化区域。 随着施加热量,在焊料施加到引线和/或金属化区域的区域中抽出真空,以抽出在焊料加热时产生的任何熔剂蒸汽。 同时,热空气也被引导到焊料被施加的区域,以保持在加热焊料时产生的焊剂蒸汽处于其气态,以便于蒸发掉这些蒸气,从而减少焊剂的量 由焊接操作产生的残留物。
    • 5. 发明授权
    • Optical waveguides and components with integrated grin lens
    • 光波导和组件与集成的咧嘴镜头
    • US5719973A
    • 1998-02-17
    • US688324
    • 1996-07-30
    • Douglas W. MonroeMuhammed A. Shahid
    • Douglas W. MonroeMuhammed A. Shahid
    • G02B6/028G02B6/26G02B6/32
    • G02B6/0281G02B6/262
    • An optical device such as an optical fiber waveguide having at least one light transceiving end suitable for transmitting or receiving light, the optical device comprising a core suitable for allowing transmission therethrough of light, a cladding layer surrounding the core and having an index of refraction less than that of the core, and an embedded lens integrally located at the light transceiving end. The embedded lens is preferably a gradient refractive index (GRIN) lens having a refractive index that varies along a radial axis of the light transceiving end of the device and along a longitudinal axis of the light transceiving end of the device. The embedded GRIN lens is comprised of a plurality of dopant regions; the dopant regions comprise regions extending a predetermined distance along the longitudinal axis and having a predetermined diameter. Each dopant region is formed by applying to the light transceiving end of the optical device a mask having an opening with a diameter equivalent to a predetermined diameter, such that an area having the predetermined diameter is exposed, and then bombarding the exposed area with ions of a predetermined energy level. A plurality of like optical devices may be processed in accordance with the present invention in a batch mode by forming an array of devices and utilizing masks appropriate to process each device in parallel.
    • 一种光学装置,例如光纤波导,其具有至少一个适于发射或接收光的光收发端,该光学装置包括适于允许光的透射的芯,围绕该芯的包层,并具有较小的折射率 整体位于光收发端的嵌入式透镜。 嵌入式透镜优选地是具有折射率的梯度折射率(GRIN)透镜,该折射率沿装置的光收发端的径向轴线和装置的光收发端的纵向轴线变化。 嵌入式GRIN透镜由多个掺杂区组成; 掺杂剂区域包括沿着纵向轴线延伸预定距离并且具有预定直径的区域。 通过向光学器件的光收发端施加具有等于预定直径的直径的开口的掩模形成每个掺杂剂区域,使得暴露具有预定直径的区域,然后用离子轰击暴露区域 预定的能量水平。 可以通过形成阵列阵列并利用适合于并行处理每个装置的掩模,以分批模式,按照本发明来处理多个相似的光学装置。
    • 6. 发明授权
    • Soldering method and apparatus
    • 焊接方法和装置
    • US5340016A
    • 1994-08-23
    • US78666
    • 1993-06-16
    • Linda M. FletcherLeslie A. GuthDouglas W. Monroe
    • Linda M. FletcherLeslie A. GuthDouglas W. Monroe
    • B23K3/02B23K3/08B23K1/00B23K1/012
    • B23K3/085B23K3/02
    • A technique is provided for manually performing a soldering operation on an article with a low-solids flux-containing solder to bond an object to the article with a reduced amount of flux residues. The technique is practiced by first manually applying heat to the article and to the object which is in contact therewith, such as by contacting the article and/or object with a heated tip of a soldering pencil, iron or gun. Once the object and article have been heated, a low-solids flux-containing solder is then applied so as to be reflowed upon contact with the heated article and the object in order to bond them together when the solder solidifies. Simultaneously, heated air (i,e., air heated above the ambient temperature) is directed at the article and the object towards the region where the solder is being applied to maintain any flux vapors, which were created upon heating of the solder, in their vaporous state. The heated air prevents condensation, and therefore unwanted deposition, of flux residues on the soldered article.
    • 提供了一种技术,用于手动地对具有低固体含量焊剂的焊料的制品进行焊接操作,以将物体以较少量的焊剂残余物结合到制品上。 该技术通过首先手动地对制品和与其接触的物体进行加热来实施,例如通过使物品和/或物体与钎焊铅笔,铁或枪的加热尖端接触。 一旦物体和制品被加热,然后施加低固体含量的焊剂焊料,以便在与加热的物品和物体接触时回流,以便当焊料固化时将它们结合在一起。 同时,加热的空气(即,在环境温度以上被加热的空气)被引导到制品和物体朝着施加焊料的区域,以保持在焊料加热时产生的任何通量蒸气, 他们的气候状态。 加热的空气防止焊料制品上的焊剂残留物的冷凝,因此不希望的沉积。