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    • 5. 发明授权
    • Double patterning for lithography to increase feature spatial density
    • 用于光刻的双重图案化以增加特征空间密度
    • US08148052B2
    • 2012-04-03
    • US12514777
    • 2007-11-13
    • Anja Monique VanleenhovePeter DirksenDavid Van SteenwinckelGerben DoornbosCasper JuffermansMark Van Dal
    • Anja Monique VanleenhovePeter DirksenDavid Van SteenwinckelGerben DoornbosCasper JuffermansMark Van Dal
    • G03F7/26
    • G03F7/0035G03F7/11H01L21/0271H01L21/0273H01L21/823821H01L29/66795H01L29/6681H01L29/785
    • A method of forming a pattern in at least one device layer in or on a substrate comprises: coating the device layer with a first photoresist layer; exposing the first photoresist using a first mask; developing the first photoresist layer to form a first pattern on the substrate; coating the substrate with a protection layer; treating the protection layer to cause a change therein where it is in contact with the first photoresist, to render the changed protection layer substantially immune to a subsequent exposure and/or developing step; coating the substrate with a second photoresist layer; exposing the second photoresist layer using a second mask; and developing the second photoresist layer to form a second pattern on the substrate without significantly affecting the first pattern in the first photoresist layer, wherein the first and second patterns together define interspersed features having a spatial frequency greater than that of the features defined in each of the first and second patterns separately. The process has particular utility in defining source, drain and fin features of finFET devices with a smaller feature size than otherwise achievable with the prevailing lithography tools.
    • 在衬底中或衬底上的至少一个器件层中形成图案的方法包括:用第一光致抗蚀剂层涂覆器件层; 使用第一掩模曝光第一光致抗蚀剂; 显影第一光致抗蚀剂层以在基底上形成第一图案; 用保护层涂覆基板; 处理保护层以在其中与第一光致抗蚀剂接触的地方发生变化,使得改变的保护层基本上不受随后的曝光和/或显影步骤的影响; 用第二光致抗蚀剂层涂覆基板; 使用第二掩模曝光所述第二光致抗蚀剂层; 并且显影所述第二光致抗蚀剂层以在所述基板上形成第二图案,而不会显着影响所述第一光致抗蚀剂层中的所述第一图案,其中所述第一和第二图案一起限定散布特征,其空间频率大于 第一和第二模式分开。 该方法在定义具有较小的特征尺寸的finFET器件的源极,漏极和鳍片特征方面具有特别的用途,而与主要的光刻工具不同。
    • 8. 发明申请
    • Lithographic Method
    • 平版方法
    • US20080241764A1
    • 2008-10-02
    • US12065926
    • 2006-09-05
    • Peter ZandbergenJeroen H. LammersDavid Van Steenwinckel
    • Peter ZandbergenJeroen H. LammersDavid Van Steenwinckel
    • G03F7/20
    • G03F7/0392
    • The present invention provides a method of lithographic patterning in order to the strength of the patterned photoresist. The method comprises: applying to a surface to be patterned a photoresist (18) comprising a polymer resin, a photocatalyst generator which generates a catalyst on exposure to actinic radiation, and a quencher; and exposing the photoresist (18) to actinic radiation through a mask pattern (12). This is followed, in either order, by carrying out a post-exposure bake; and developing the photoresist (18) with a developer to remove a portion of the photoresist which has been exposed to the actinic radiation. The polymer resin is substantially insoluble in the developer prior to exposure to actinic radiation and rendered soluble in the developer by the action of the catalyst, and wherein the polymer resin is crosslinked by the action of the quencher during the bake.
    • 本发明提供了一种平版印刷图案化方法,以便图案化光致抗蚀剂的强度。 该方法包括:向待图案化的表面施加包含聚合物树脂的光致抗蚀剂(18),在曝光于光化辐射时产生催化剂的光催化剂产生剂和猝灭剂; 以及通过掩模图案(12)将光致抗蚀剂(18)暴露于光化辐射。 接下来,按照任何顺序,通过进行曝光后烘烤; 以及用显影剂显影光致抗蚀剂(18)以去除已经暴露于光化辐射的光致抗蚀剂的一部分。 聚合物树脂在暴露于光化辐射之前基本上不溶于显影剂,并通过催化剂的作用使其溶解在显影剂中,并且其中聚合物树脂在烘烤期间通过猝灭剂的作用而交联。