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1. 发明授权

US09055694B2 Thermal interface members for removable electronic devices 有权
标题翻译：用于可移动电子设备的热接口部件
公开(公告)号：US09055694B2
公开(公告)日：2015-06-09
申请号：US13551024
申请日：2012-07-17
申请人： David J. Lima
发明人： David J. Lima
IPC分类号： H05K7/20 , H05K13/04 , H05K1/02
CPC分类号： H05K7/20418 , H05K1/0204 , H05K1/0206 , H05K1/0209 , H05K7/205 , H05K2201/0162 , Y10T29/49117
摘要： In some embodiments, an apparatus includes a printed circuit board and a thermal interface member. The printed circuit board is configured to be coupled to an electronic device, such as, for example, a removable (or “pluggable”) optical transceiver. A first surface of the printed circuit board includes a thermally-conductive portion, and a second surface of the printed circuit board includes a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface. The thermal interface member is coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface. The portion of the thermal interface member is deformable and thermally-conductive.
摘要翻译：在一些实施例中，装置包括印刷电路板和热接口部件。印刷电路板被配置为耦合到电子设备，例如可移除（或“可插拔”）光收发器。印刷电路板的第一表面包括导热部分，并且印刷电路板的第二表面包括导热部分，该导热部分通过第二表面的导热部分之间的导热部分第一表面和第二表面。热接口构件联接到印刷电路板的第一表面，使得热界面构件的一部分与第一表面的导热部分接触。热界面构件的部分是可变形的和导热的。

2. 发明授权

US08535787B1 Heat sinks having a thermal interface for cooling electronic devices 有权
标题翻译：散热器具有用于冷却电子设备的热界面
公开(公告)号：US08535787B1
公开(公告)日：2013-09-17
申请号：US12493829
申请日：2009-06-29
申请人： David J. Lima
发明人： David J. Lima
IPC分类号： B41M5/00 , B44C1/17 , G03C7/00 , B32B7/12 , B32B15/04 , B32B15/08 , F28F7/00
CPC分类号： B32B7/12 , B32B3/08 , B32B27/06 , B32B27/281 , B32B27/36 , B32B2255/10 , B32B2255/205 , B32B2307/302 , B32B2307/5825 , F28F2013/006 , Y10T428/24802 , Y10T428/2839 , Y10T428/31681
摘要： Heat sinks having a thermal interface for cooling electronic devices processing units are described herein. In some embodiments, a thermal interface member includes a first material defining a first layer of the apparatus. The thermal interface member further includes a second material being deformable and thermally conductive, and a third material different from the second material, that is an adhesive material. The second material and the third material collectively define a second layer of the apparatus having a first region and a second region. The first region is formed from the second material. The second region is formed from the third material.
摘要翻译：本文描述了具有用于冷却电子设备处理单元的热界面的散热器。在一些实施例中，热界面构件包括限定该装置的第一层的第一材料。热界面构件还包括可变形和导热的第二材料，以及不同于第二材料的第三材料，即粘合材料。第二材料和第三材料共同限定具有第一区域和第二区域的装置的第二层。第一区域由第二材料形成。第二区域由第三材料形成。

3. 发明申请

US20110182027A1 AIR FLOW DUCTS FOR COOLING ELECTRONIC DEVICES WITHIN A DATA PROCESSING UNIT 有权
标题翻译：用于在数据处理单元中冷却电子设备的空气流道
公开(公告)号：US20110182027A1
公开(公告)日：2011-07-28
申请号：US12695509
申请日：2010-01-28
申请人： David J. LIMA , John KULL
发明人： David J. LIMA , John KULL
IPC分类号： G06F1/20
CPC分类号： G06F1/20
摘要： Air flow ducts for improving the air flow within data processing units are described herein. In some embodiments, a duct includes an inlet portion and an outlet portion. An interior surface of the outlet portion of the duct defines, at least in part, a portion of a flow path. The duct is configured to be coupled to a printed circuit board within a data processing unit such that a first portion of a cooling fluid can flow within the flow path between the inlet portion of the duct and an electronic device coupled to the printed circuit board. An exterior surface of the outlet portion of the duct is configured to redirect a second portion of the cooling fluid to a volume within the data processing unit apart from the electronic device.
摘要翻译：这里描述了用于改善数据处理单元内的气流的空气流动管道。在一些实施例中，管道包括入口部分和出口部分。管道的出口部分的内表面至少部分地限定流路的一部分。管道被配置为耦合到数据处理单元内的印刷电路板，使得冷却流体的第一部分可以在管道的入口部分和耦合到印刷电路板的电子设备之间的流动路径内流动。管道的出口部分的外表面被配置成将冷却流体的第二部分重新定向到远离电子设备的数据处理单元内的体积。

4. 发明授权

US07420806B1 Airflow distribution through an electronic device 有权
标题翻译：通过电子设备进行气流分配
公开(公告)号：US07420806B1
公开(公告)日：2008-09-02
申请号：US11285550
申请日：2005-11-22
申请人： David J. Lima , Eric R. Prather
发明人： David J. Lima , Eric R. Prather
IPC分类号： H05K7/20 , H05K5/00
CPC分类号： H05K7/20736 , H05K7/20581
摘要： Techniques for distributing airflow for cooling an electronic device are described. Vanes positioned immediately after a set of cooling fans direct airflow over a plurality of components within the device. For example, the vanes may be designed to segment the net fan blade travel area into equal sections—one section per component—to accomplish balanced airflow distribution. Components requiring cooling include cards, e.g., printed circuit boards and the like. A plurality of cards may form slots between the cards and the vanes may divide the airflow equally among the slots to provide consistent cooling for each of the cards. Embodiments of the invention may be directed to distributing cooling airflows within a computing device, e.g., a network router or a server.
摘要翻译：描述用于分配用于冷却电子设备的气流的技术。在一组冷却风扇之后立即定位的风扇将气流引导到装置内的多个部件上。例如，叶片可以被设计成将净风扇叶片行进区域分成相等的部分 - 每个部件的一个部分 - 以实现平衡的气流分布。需要冷却的部件包括卡，例如印刷电路板等。多个卡可以在卡之间形成槽，并且叶片可以在槽之间平均分配气流，以为每个卡提供一致的冷却。本发明的实施例可以涉及在计算设备（例如，网络路由器或服务器）内分配冷却气流。

5. 发明授权

US5219067A Keyboard pad structure for electronic devices 失效
标题翻译：电子设备的键盘结构
公开(公告)号：US5219067A
公开(公告)日：1993-06-15
申请号：US830734
申请日：1992-02-04
申请人： David J. Lima , John G. Tang
发明人： David J. Lima , John G. Tang
IPC分类号： H01H9/02 , H01H13/06 , H01H13/702
CPC分类号： H01H9/0214 , H01H13/06 , H01H13/702 , H01H2221/002 , H01H2223/002 , H01H2223/04 , H01H2231/034 , H01H2239/01 , H01H2239/034
摘要： An electronic housing structure including an enclosure for containing at least one electronic device having a plurality of user interface switches. The electronic housing structure further has a user interface pad attached to the enclosure near the user interface switches for operating said user interface switches. The user interface pad further seals the enclosure to completely seal and protect the electronic device. The enclosure and the user interface pad are composed of a waterproof, dust-proof and mud-proof material whereby said electronic device can be operated in an outdoor condition.
摘要翻译：一种电子外壳结构，包括用于容纳至少一个具有多个用户接口开关的电子设备的外壳。电子外壳结构还具有附接到用户接口开关附近的外壳的用户界面垫，用于操作所述用户接口开关。用户界面垫进一步密封外壳以完全密封和保护电子设备。外壳和用户接口垫由防水防尘和防泥材料组成，由此所述电子设备可以在室外操作。

6. 发明授权

US08953922B1 Fiber ribbon strain relief clamp 有权
标题翻译：纤维带应变消除夹
公开(公告)号：US08953922B1
公开(公告)日：2015-02-10
申请号：US13190687
申请日：2011-07-26
申请人： David J. Lima , John I. Kull
发明人： David J. Lima , John I. Kull
IPC分类号： G02B6/00 , G02B6/44 , G02B6/38 , G02B6/42
CPC分类号： G02B6/44 , G02B6/3825 , G02B6/3887 , G02B6/3897 , G02B6/4248 , G02B6/4471 , G02B6/4477
摘要： An apparatus for clamping and relieving strain in a set of optical fiber ribbon. The strain relief clamp includes a first attachment portion and second attachment portion configured to secure the strain relief clamp to a system component and a set of optical fiber ribbons to the strain relief clamp. When secured the strain relief clamp is configured to relieve strain in the set of optical fiber ribbons.
摘要翻译：一种用于在一组光纤带中夹紧和释放应变的装置。应变消除夹具包括第一附接部分和第二附接部分，第二附接部分被构造成将应变释放夹固定到系统部件和一组光纤带到应变消除夹。当固定时，应变消除夹具被配置为减轻该组光纤带中的应变。

7. 发明授权

US08534930B1 Circuit boards defining openings for cooling electronic devices 有权
标题翻译：电路板定义用于冷却电子设备的开口
公开(公告)号：US08534930B1
公开(公告)日：2013-09-17
申请号：US12566425
申请日：2009-09-24
申请人： David J. Lima
发明人： David J. Lima
IPC分类号： G02B6/36
CPC分类号： G02B6/426 , G02B6/4246 , G02B6/4268 , G02B6/4284
摘要： Printed circuit boards and assemblies for cooling electronic devices in processing units are described herein. In some embodiments, a printed circuit board configured to be coupled to an electronic device defines a first set of lumens configured to receive a mounting portion of a frame. The frame and a portion of a first surface of the printed circuit board collectively define an internal volume within which at least a portion of the electronic device can be disposed and an external volume that is external to the internal volume. The printed circuit board defines a second set of lumens positioned to place at least a portion of the external volume in fluid communication with the internal volume.
摘要翻译：本文描述了用于在处理单元中冷却电子设备的印刷电路板和组件。在一些实施例中，被配置为耦合到电子设备的印刷电路板限定被配置为接收框架的安装部分的第一组流明。所述框架和所述印刷电路板的第一表面的一部分共同地限定内部容积，所述内部容积可以设置在所述内部容积中，所述电子装置的至少一部分可以被设置在所述内部容积中，所述外部体积在所述内部容积印刷电路板限定了第二组腔，其被定位成使至少一部分外部体积与内部体积流体连通。

8. 发明申请

US20120281365A1 THERMAL INTERFACE MEMBERS FOR REMOVABLE ELECTRONIC DEVICES 有权
标题翻译：用于可拆卸电子设备的热接口部件
公开(公告)号：US20120281365A1
公开(公告)日：2012-11-08
申请号：US13551024
申请日：2012-07-17
申请人： David J. LIMA
发明人： David J. LIMA
IPC分类号： H05K7/20
CPC分类号： H05K7/20418 , H05K1/0204 , H05K1/0206 , H05K1/0209 , H05K7/205 , H05K2201/0162 , Y10T29/49117
摘要： In some embodiments, an apparatus includes a printed circuit board and a thermal interface member. The printed circuit board is configured to be coupled to an electronic device, such as, for example, a removable (or “pluggable”) optical transceiver. A first surface of the printed circuit board includes a thermally-conductive portion, and a second surface of the printed circuit board includes a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface. The thermal interface member is coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface. The portion of the thermal interface member is deformable and thermally-conductive.
摘要翻译：在一些实施例中，装置包括印刷电路板和热接口部件。印刷电路板被配置为耦合到电子设备，例如可移动（或可插拔）光收发器。印刷电路板的第一表面包括导热部分，并且印刷电路板的第二表面包括导热部分，该导热部分通过第二表面的导热部分之间的导热部分第一表面和第二表面。热接口构件联接到印刷电路板的第一表面，使得热界面构件的一部分与第一表面的导热部分接触。热界面构件的部分是可变形的和导热的。

9. 发明申请

US20110110048A1 THERMAL INTERFACE MEMBERS FOR REMOVABLE ELECTRONIC DEVICES 有权
标题翻译：用于可拆卸电子设备的热接口部件
公开(公告)号：US20110110048A1
公开(公告)日：2011-05-12
申请号：US12616497
申请日：2009-11-11
申请人： David J. LIMA
发明人： David J. LIMA
IPC分类号： H05K7/20 , H05K13/04
CPC分类号： H05K7/20418 , H05K1/0204 , H05K1/0206 , H05K1/0209 , H05K7/205 , H05K2201/0162 , Y10T29/49117
摘要： In some embodiments, an apparatus includes a printed circuit board and a thermal interface member. The printed circuit board is configured to be coupled to an electronic device, such as, for example, a removable (or “pluggable”) optical transceiver. A first surface of the printed circuit board includes a thermally-conductive portion, and a second surface of the printed circuit board includes a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface. The thermal interface member is coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface. The portion of thermal interface member is deformable and thermally-conductive.
摘要翻译：在一些实施例中，装置包括印刷电路板和热接口部件。印刷电路板被配置为耦合到电子设备，例如可移除（或“可插拔”）光收发器。印刷电路板的第一表面包括导热部分，并且印刷电路板的第二表面包括导热部分，该导热部分通过第二表面的导热部分之间的导热部分第一表面和第二表面。热接口构件联接到印刷电路板的第一表面，使得热界面构件的一部分与第一表面的导热部分接触。热界面构件的部分是可变形和导热的。

10. 发明申请

US20110056660A1 FRONT-TO-BACK COOLING SYSTEM FOR MODULAR SYSTEMS WITH ORTHOGONAL MIDPLANE CONFIGURATION 审中-公开
公开(公告)号：US20110056660A1
公开(公告)日：2011-03-10
申请号：US12889039
申请日：2010-09-23
申请人： Gunes Aybay , Sindhu Pradeep , Jean-Marc Frailong , David J. Lima
发明人： Gunes Aybay , Sindhu Pradeep , Jean-Marc Frailong , David J. Lima
IPC分类号： F28D15/00
CPC分类号： H05K7/20563
摘要： A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. Each set of modules is independently cooled. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exhausts from a back of the apparatus. A horizontal set of modules is cooled with horizontal front-to-back air flow. When the horizontal set of modules is at the front of the apparatus, a plenum extending exterior to the vertical set of modules allows exhausting horizontally flowing air to the rear of the apparatus. When the horizontal set of modules is at the rear of the apparatus, a plenum extending exterior to the vertical set of modules allows moving air from the front of the apparatus to a chamber holding the horizontal modules.

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