专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08953922B1 Fiber ribbon strain relief clamp 有权
标题翻译：纤维带应变消除夹
公开(公告)号：US08953922B1
公开(公告)日：2015-02-10
申请号：US13190687
申请日：2011-07-26
申请人： David J. Lima , John I. Kull
发明人： David J. Lima , John I. Kull
IPC分类号： G02B6/00 , G02B6/44 , G02B6/38 , G02B6/42
CPC分类号： G02B6/44 , G02B6/3825 , G02B6/3887 , G02B6/3897 , G02B6/4248 , G02B6/4471 , G02B6/4477
摘要： An apparatus for clamping and relieving strain in a set of optical fiber ribbon. The strain relief clamp includes a first attachment portion and second attachment portion configured to secure the strain relief clamp to a system component and a set of optical fiber ribbons to the strain relief clamp. When secured the strain relief clamp is configured to relieve strain in the set of optical fiber ribbons.
摘要翻译：一种用于在一组光纤带中夹紧和释放应变的装置。应变消除夹具包括第一附接部分和第二附接部分，第二附接部分被构造成将应变释放夹固定到系统部件和一组光纤带到应变消除夹。当固定时，应变消除夹具被配置为减轻该组光纤带中的应变。

2. 发明授权

US09055694B2 Thermal interface members for removable electronic devices 有权
标题翻译：用于可移动电子设备的热接口部件
公开(公告)号：US09055694B2
公开(公告)日：2015-06-09
申请号：US13551024
申请日：2012-07-17
申请人： David J. Lima
发明人： David J. Lima
IPC分类号： H05K7/20 , H05K13/04 , H05K1/02
CPC分类号： H05K7/20418 , H05K1/0204 , H05K1/0206 , H05K1/0209 , H05K7/205 , H05K2201/0162 , Y10T29/49117
摘要： In some embodiments, an apparatus includes a printed circuit board and a thermal interface member. The printed circuit board is configured to be coupled to an electronic device, such as, for example, a removable (or “pluggable”) optical transceiver. A first surface of the printed circuit board includes a thermally-conductive portion, and a second surface of the printed circuit board includes a thermally-conductive portion that is coupled to the thermally-conductive portion of the first surface by a thermally-conductive via between the first surface and the second surface. The thermal interface member is coupled to the first surface of the printed circuit board such that a portion of the thermal interface member is in contact with the thermally-conductive portion of the first surface. The portion of the thermal interface member is deformable and thermally-conductive.
摘要翻译：在一些实施例中，装置包括印刷电路板和热接口部件。印刷电路板被配置为耦合到电子设备，例如可移除（或“可插拔”）光收发器。印刷电路板的第一表面包括导热部分，并且印刷电路板的第二表面包括导热部分，该导热部分通过第二表面的导热部分之间的导热部分第一表面和第二表面。热接口构件联接到印刷电路板的第一表面，使得热界面构件的一部分与第一表面的导热部分接触。热界面构件的部分是可变形的和导热的。

3. 发明授权

US08535787B1 Heat sinks having a thermal interface for cooling electronic devices 有权
标题翻译：散热器具有用于冷却电子设备的热界面
公开(公告)号：US08535787B1
公开(公告)日：2013-09-17
申请号：US12493829
申请日：2009-06-29
申请人： David J. Lima
发明人： David J. Lima
IPC分类号： B41M5/00 , B44C1/17 , G03C7/00 , B32B7/12 , B32B15/04 , B32B15/08 , F28F7/00
CPC分类号： B32B7/12 , B32B3/08 , B32B27/06 , B32B27/281 , B32B27/36 , B32B2255/10 , B32B2255/205 , B32B2307/302 , B32B2307/5825 , F28F2013/006 , Y10T428/24802 , Y10T428/2839 , Y10T428/31681
摘要： Heat sinks having a thermal interface for cooling electronic devices processing units are described herein. In some embodiments, a thermal interface member includes a first material defining a first layer of the apparatus. The thermal interface member further includes a second material being deformable and thermally conductive, and a third material different from the second material, that is an adhesive material. The second material and the third material collectively define a second layer of the apparatus having a first region and a second region. The first region is formed from the second material. The second region is formed from the third material.
摘要翻译：本文描述了具有用于冷却电子设备处理单元的热界面的散热器。在一些实施例中，热界面构件包括限定该装置的第一层的第一材料。热界面构件还包括可变形和导热的第二材料，以及不同于第二材料的第三材料，即粘合材料。第二材料和第三材料共同限定具有第一区域和第二区域的装置的第二层。第一区域由第二材料形成。第二区域由第三材料形成。

4. 发明授权

US07420806B1 Airflow distribution through an electronic device 有权
标题翻译：通过电子设备进行气流分配
公开(公告)号：US07420806B1
公开(公告)日：2008-09-02
申请号：US11285550
申请日：2005-11-22
申请人： David J. Lima , Eric R. Prather
发明人： David J. Lima , Eric R. Prather
IPC分类号： H05K7/20 , H05K5/00
CPC分类号： H05K7/20736 , H05K7/20581
摘要： Techniques for distributing airflow for cooling an electronic device are described. Vanes positioned immediately after a set of cooling fans direct airflow over a plurality of components within the device. For example, the vanes may be designed to segment the net fan blade travel area into equal sections—one section per component—to accomplish balanced airflow distribution. Components requiring cooling include cards, e.g., printed circuit boards and the like. A plurality of cards may form slots between the cards and the vanes may divide the airflow equally among the slots to provide consistent cooling for each of the cards. Embodiments of the invention may be directed to distributing cooling airflows within a computing device, e.g., a network router or a server.
摘要翻译：描述用于分配用于冷却电子设备的气流的技术。在一组冷却风扇之后立即定位的风扇将气流引导到装置内的多个部件上。例如，叶片可以被设计成将净风扇叶片行进区域分成相等的部分 - 每个部件的一个部分 - 以实现平衡的气流分布。需要冷却的部件包括卡，例如印刷电路板等。多个卡可以在卡之间形成槽，并且叶片可以在槽之间平均分配气流，以为每个卡提供一致的冷却。本发明的实施例可以涉及在计算设备（例如，网络路由器或服务器）内分配冷却气流。

5. 发明授权

US5219067A Keyboard pad structure for electronic devices 失效
标题翻译：电子设备的键盘结构
公开(公告)号：US5219067A
公开(公告)日：1993-06-15
申请号：US830734
申请日：1992-02-04
申请人： David J. Lima , John G. Tang
发明人： David J. Lima , John G. Tang
IPC分类号： H01H9/02 , H01H13/06 , H01H13/702
CPC分类号： H01H9/0214 , H01H13/06 , H01H13/702 , H01H2221/002 , H01H2223/002 , H01H2223/04 , H01H2231/034 , H01H2239/01 , H01H2239/034
摘要： An electronic housing structure including an enclosure for containing at least one electronic device having a plurality of user interface switches. The electronic housing structure further has a user interface pad attached to the enclosure near the user interface switches for operating said user interface switches. The user interface pad further seals the enclosure to completely seal and protect the electronic device. The enclosure and the user interface pad are composed of a waterproof, dust-proof and mud-proof material whereby said electronic device can be operated in an outdoor condition.
摘要翻译：一种电子外壳结构，包括用于容纳至少一个具有多个用户接口开关的电子设备的外壳。电子外壳结构还具有附接到用户接口开关附近的外壳的用户界面垫，用于操作所述用户接口开关。用户界面垫进一步密封外壳以完全密封和保护电子设备。外壳和用户接口垫由防水防尘和防泥材料组成，由此所述电子设备可以在室外操作。

6. 发明授权

US08534930B1 Circuit boards defining openings for cooling electronic devices 有权
标题翻译：电路板定义用于冷却电子设备的开口
公开(公告)号：US08534930B1
公开(公告)日：2013-09-17
申请号：US12566425
申请日：2009-09-24
申请人： David J. Lima
发明人： David J. Lima
IPC分类号： G02B6/36
CPC分类号： G02B6/426 , G02B6/4246 , G02B6/4268 , G02B6/4284
摘要： Printed circuit boards and assemblies for cooling electronic devices in processing units are described herein. In some embodiments, a printed circuit board configured to be coupled to an electronic device defines a first set of lumens configured to receive a mounting portion of a frame. The frame and a portion of a first surface of the printed circuit board collectively define an internal volume within which at least a portion of the electronic device can be disposed and an external volume that is external to the internal volume. The printed circuit board defines a second set of lumens positioned to place at least a portion of the external volume in fluid communication with the internal volume.
摘要翻译：本文描述了用于在处理单元中冷却电子设备的印刷电路板和组件。在一些实施例中，被配置为耦合到电子设备的印刷电路板限定被配置为接收框架的安装部分的第一组流明。所述框架和所述印刷电路板的第一表面的一部分共同地限定内部容积，所述内部容积可以设置在所述内部容积中，所述电子装置的至少一部分可以被设置在所述内部容积中，所述外部体积在所述内部容积印刷电路板限定了第二组腔，其被定位成使至少一部分外部体积与内部体积流体连通。

7. 发明申请

US20110056660A1 FRONT-TO-BACK COOLING SYSTEM FOR MODULAR SYSTEMS WITH ORTHOGONAL MIDPLANE CONFIGURATION 审中-公开
公开(公告)号：US20110056660A1
公开(公告)日：2011-03-10
申请号：US12889039
申请日：2010-09-23
申请人： Gunes Aybay , Sindhu Pradeep , Jean-Marc Frailong , David J. Lima
发明人： Gunes Aybay , Sindhu Pradeep , Jean-Marc Frailong , David J. Lima
IPC分类号： F28D15/00
CPC分类号： H05K7/20563
摘要： A front-to-back cooling system allows cooling of an apparatus containing two orthogonal sets of modules. Each set of modules is independently cooled. A vertical set of modules is cooled with vertical air flow across the modules that enters from a front of the apparatus and exhausts from a back of the apparatus. A horizontal set of modules is cooled with horizontal front-to-back air flow. When the horizontal set of modules is at the front of the apparatus, a plenum extending exterior to the vertical set of modules allows exhausting horizontally flowing air to the rear of the apparatus. When the horizontal set of modules is at the rear of the apparatus, a plenum extending exterior to the vertical set of modules allows moving air from the front of the apparatus to a chamber holding the horizontal modules.

8. 发明授权

US07804684B1 Cooling system for a data processing unit 有权
标题翻译：数据处理单元的冷却系统
公开(公告)号：US07804684B1
公开(公告)日：2010-09-28
申请号：US12341580
申请日：2008-12-22
申请人： Gunes Aybay , David J. Lima , Olaf Moeller
发明人： Gunes Aybay , David J. Lima , Olaf Moeller
IPC分类号： H05K7/20 , H05K5/00
CPC分类号： H05K7/20563 , H05K7/1445
摘要： A data processing unit includes a chassis configured to contain a line card. The chassis defines, at least in part, a portion of a first flow pathway and a portion of a second flow pathway. The chassis is configured such that a first portion of a gas can flow within the first flow pathway between an intake region and the first end portion of the line card such that the first portion of the gas flows across a first end portion of the line card in a first direction. The chassis is configured such that a second portion of the gas can flow within the second flow pathway between the intake region and a second end portion of the line card such that the second portion of the gas flows across the second end portion of the line card in a second direction opposite the first direction.
摘要翻译：数据处理单元包括被配置为容纳线卡的机架。至少部分地，底盘限定第一流动路径的一部分和第二流动路径的一部分。底盘构造成使得气体的第一部分可以在进入区域和线卡的第一端部之间的第一流动路径内流动，使得气体的第一部分流过线路卡的第一端部在第一个方向。底盘被构造成使得气体的第二部分可以在进入区域和线路卡的第二端部之间的第二流动路径内流动，使得气体的第二部分流过线路卡的第二端部在与第一方向相反的第二方向上。

9. 发明申请

US20090296352A1 THERMAL MANAGEMENT OF ELECTRONIC DEVICES 有权
标题翻译：电子设备的热管理
公开(公告)号：US20090296352A1
公开(公告)日：2009-12-03
申请号：US11363095
申请日：2006-02-28
申请人： David J. Lima
发明人： David J. Lima
IPC分类号： H05K7/20
CPC分类号： H05K1/0207 , G02B6/4269 , G02B6/4272 , H05K1/0206 , H05K7/205 , H05K7/20545 , H05K2201/066 , H05K2201/09309 , Y10T29/49826
摘要： Thermal management is provided for a device. The device may include a substrate having a mounting area on a first surface of the substrate. The device may also include first thermal vias extending from the mounting area to at least an interior of the substrate. The device may also include at least one thermal plane substantially parallel to the first surface of the substrate, the at least one thermal plane being in thermal contact with at least one of the first thermal vias. The device may also include a heat sink attachment area, and second thermal vias extending from the heat sink attachment area to the interior of the substrate, the at least one thermal plane being in thermal contact with the second thermal vias.
摘要翻译：为设备提供热管理。该装置可以包括在基板的第一表面上具有安装区域的基板。该装置还可以包括从安装区域延伸到基板的至少内部的第一热通孔。该装置还可以包括基本上平行于衬底的第一表面的至少一个热平面，所述至少一个热平面与第一热通孔中的至少一个热接触。该装置还可以包括散热器附接区域和从散热器附接区域延伸到衬底内部的第二热通路，该至少一个热平面与第二热通孔热接触。

10. 发明授权

US07420820B1 Positionable handle for insertion and extraction 有权
标题翻译：可插拔手柄
公开(公告)号：US07420820B1
公开(公告)日：2008-09-02
申请号：US11260838
申请日：2005-10-27
申请人： David J. Lima
发明人： David J. Lima
IPC分类号： H05K7/14
CPC分类号： H05K7/1407
摘要： A device for insertion and extraction of printed circuit boards or other components from a device or system such as a network router includes a positionable handle. The handle adjusts in a manner similar to a handle on a c-clamp, and may be repositioned relative to the centerline of a driveshaft of the device. Additionally, the handle may include internal detents that define selectable handle positions. Various handle positions may allow an operator to utilize limited available space and increase the mechanical advantage of the handle.
摘要翻译：用于从诸如网络路由器的设备或系统插入和提取印刷电路板或其他组件的设备包括可定位的手柄。手柄以类似于c夹具上的手柄的方式调节，并且可以相对于装置的驱动轴的中心线重新定位。另外，手柄可以包括限定可选择的手柄位置的内部制动器。各种手柄位置可允许操作者利用有限的可用空间并增加手柄的机械优点。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式