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1. 发明授权

US07057281B2 Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths 失效
标题翻译：使用具有减小厚度内部长度的引线框架的微电子部件组件
公开(公告)号：US07057281B2
公开(公告)日：2006-06-06
申请号：US10425538
申请日：2003-04-28
申请人： Neo Chee Peng , Tan Hock Chuan , Chew Beng Chye , David Chai Yih Ming , Michael Tan Kian Shing
发明人： Neo Chee Peng , Tan Hock Chuan , Chew Beng Chye , David Chai Yih Ming , Michael Tan Kian Shing
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L23/3114 , H01L23/3107 , H01L23/315 , H01L23/3171 , H01L23/4951 , H01L23/4952 , H01L23/49548 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/06136 , H01L2224/32145 , H01L2224/32245 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01031 , H01L2924/01032 , H01L2924/01074 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , Y10T29/49121 , Y10T29/49171 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599
摘要： The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.
摘要翻译：本公开提出了用于制造微电子部件组件的各种微电子部件组件设计和方法。在一个具体实现中，微电子部件组件包括微电子部件，至少两个引线和至少两个接合线。每个引线可以具有与微电子部件的端子相邻的较小厚度的内部长度，以及具有比内部长度的接合表面更远离微电子部件的外表面的主体。每个接合线将微电子部件耦合到引线之一并且具有不大于引线的外表面的高度的微电子部件向外的最大高度。

2. 发明申请

US20050080612A1 Spelling and encoding method for ideographic symbols 失效
标题翻译：表意符号的拼写和编码方法
公开(公告)号：US20050080612A1
公开(公告)日：2005-04-14
申请号：US10672336
申请日：2003-09-26
申请人： David Chai , Sing Lin , Andrew Soong
发明人： David Chai , Sing Lin , Andrew Soong
IPC分类号： G06F17/22 , G06F17/28
CPC分类号： G06F17/2223
摘要： The present invention relates to a spelling and encoding method for ideographic symbols, such as Chinese characters. The spelling method can provide first and second components for identifying first and second groups of ideographic symbols, wherein the two groups can have at least one common ideographic symbol correlating with the two components. For example, the two components can be a Chinese Pinyin spelling and a Four Corner Numerical Index, respectively, which can each identify a group of Chinese characters and be combined to identify one or more characters. The spelling method can further provide a third component to differentiate a plurality of ideographic symbols common to the two groups to uniquely identify each common symbol. In one embodiment, an alphanumeric spelling can be provided to uniquely identify each ideographic symbol. The encoding method can encode various alphanumeric representations of the ideographic symbols by the 7-bit ASCII standard code.
摘要翻译：本发明涉及用于表意符号的拼写和编码方法，例如汉字。拼写方法可以提供用于识别第一和第二组表意符号符号的第一和第二组件，其中两组可以具有与两个组件相关联的至少一个公共表意符号。例如，这两个组件可以分别是中文拼音和四角数字索引，它们可以分别标识一组汉字，并组合起来识别一个或多个字符。拼写方法还可以提供第三组件来区分两组共同的多个表意符号，以唯一地标识每个公共符号。在一个实施例中，可以提供字母数字拼写来唯一地标识每个表意符号。编码方法可以通过7位ASCII标准码对表意符号的各种字母数字表示进行编码。

3. 发明申请

US20080233684A1 MICROELECTRONIC COMPONENT ASSEMBLIES EMPLOYING LEAD FRAMES HAVING REDUCED-THICKNESS INNER LENGTHS 有权
标题翻译：微电子组件组装采用具有减小内径的导线框架
公开(公告)号：US20080233684A1
公开(公告)日：2008-09-25
申请号：US12108396
申请日：2008-04-23
申请人： Neo Chee Peng , Tan Hock Chuan , Chew Beng Chye , David Chai Yih Ming , Michael Tan Kian Shing
发明人： Neo Chee Peng , Tan Hock Chuan , Chew Beng Chye , David Chai Yih Ming , Michael Tan Kian Shing
IPC分类号： H01L21/60
CPC分类号： H01L23/3114 , H01L23/3107 , H01L23/315 , H01L23/3171 , H01L23/4951 , H01L23/4952 , H01L23/49548 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/06136 , H01L2224/32145 , H01L2224/32245 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01031 , H01L2924/01032 , H01L2924/01074 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , Y10T29/49121 , Y10T29/49171 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599
摘要： The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.
摘要翻译：本公开提出了用于制造微电子部件组件的各种微电子部件组件设计和方法。在一个具体实现中，微电子部件组件包括微电子部件，至少两个引线和至少两个接合线。每个引线可以具有与微电子部件的端子相邻的较小厚度的内部长度，以及具有比内部长度的接合表面更远离微电子部件的外表面的主体。每个接合线将微电子部件耦合到引线之一并且具有不大于引线的外表面的高度的微电子部件向外的最大高度。

4. 发明授权

US07425470B2 Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths 有权
标题翻译：使用具有减小厚度内部长度的引线框架的微电子部件组件
公开(公告)号：US07425470B2
公开(公告)日：2008-09-16
申请号：US10920117
申请日：2004-08-17
申请人： Neo Chee Peng , Tan Hock Chuan , Chew Beng Chye , David Chai Yih Ming , Michael Tan Kian Shing
发明人： Neo Chee Peng , Tan Hock Chuan , Chew Beng Chye , David Chai Yih Ming , Michael Tan Kian Shing
IPC分类号： H01L21/00 , H01L23/495 , H01R43/00 , H05K3/02
CPC分类号： H01L23/3114 , H01L23/3107 , H01L23/315 , H01L23/3171 , H01L23/4951 , H01L23/4952 , H01L23/49548 , H01L23/49575 , H01L24/45 , H01L24/48 , H01L24/73 , H01L2224/06136 , H01L2224/32145 , H01L2224/32245 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/73215 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01031 , H01L2924/01032 , H01L2924/01074 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/181 , H01L2924/20751 , H01L2924/20752 , Y10T29/49121 , Y10T29/49171 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/85399 , H01L2224/05599
摘要： The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, a microelectronic component assembly includes a microelectronic component, at least two leads, and at least two bond wires. Each of the leads may have a reduced-thickness inner length adjacent terminals of the microelectronic component and a body having an outer surface spaced farther from the microelectronic component than a bond surface of the inner length. Each of the bond wires couples the microelectronic component to one of the leads and has a maximum height outwardly from the microelectronic component that is no greater than the height of the outer surface of the lead.
摘要翻译：本公开提出了用于制造微电子部件组件的各种微电子部件组件设计和方法。在一个具体实现中，微电子部件组件包括微电子部件，至少两个引线和至少两个接合线。每个引线可以具有与微电子部件的端子相邻的较小厚度的内部长度，以及具有比内部长度的接合表面更远离微电子部件的外表面的主体。每个接合线将微电子部件耦合到引线之一并且具有不大于引线的外表面的高度的微电子部件向外的最大高度。

5. 发明申请

US20060011845A1 Method of enhancing performance of doped scintillation crystals 有权
标题翻译：增强掺杂闪烁晶体性能的方法
公开(公告)号：US20060011845A1
公开(公告)日：2006-01-19
申请号：US11230167
申请日：2005-09-19
申请人： Bruce Chai , David Chai , Randall Lux
发明人： Bruce Chai , David Chai , Randall Lux
IPC分类号： G01T1/20 , C09K11/08
CPC分类号： C04B35/16 , C04B2235/3224 , C04B2235/3427 , C04B2235/76 , C04B2235/9646 , C09K11/7774 , C30B29/34 , C30B31/06 , C30B33/02
摘要： A method for enhancing the light yield of a doped scintillation crystal may include a reducing step if the crystal includes a dopant, such as cerium in a first oxidation state, such as the 4+ state. The scintillation crystal may include a rare earth silicate. The reducing may include heating in an oxygen-free ambient. The reducing may be used after an oxygen vacancy filling step that causes at least some of the dopant to increase in its oxidation state.
摘要翻译：如果晶体包括诸如4+状态的第一氧化态的铈等掺杂剂，则增加掺杂闪烁晶体的光产率的方法可以包括还原步骤。闪烁晶体可以包括稀土硅酸盐。还原可以包括在无氧环境中加热。在氧空位填充步骤之后可以使用还原，其导致至少一些掺杂剂增加其氧化态。

6. 发明授权

US09957956B1 Systems and methods for canister fluid filters 有权
公开(公告)号：US09957956B1
公开(公告)日：2018-05-01
申请号：US15217938
申请日：2016-07-22
申请人： David Chai
发明人： David Chai
IPC分类号： A01K63/04 , F04B9/14 , B01D36/00 , F04B19/22 , F04B19/04
CPC分类号： F04B9/14 , A01K63/045 , F04B19/04 , F04B19/22
摘要： The present invention covers systems and methods for priming a canister fluid filtration system. It utilizes the push and pull caused by the movement of a piston of a priming pump between two openings in the chamber of the priming pump, to push the air out of the canister and introduces fluid into it, thereby achieving the purpose of priming the fluid filtration system.

7. 发明申请

US20070045797A1 Microelectronic devices and microelectronic support devices, and associated assemblies and methods 有权
标题翻译：微电子器件和微电子支持器件，以及相关组件和方法
公开(公告)号：US20070045797A1
公开(公告)日：2007-03-01
申请号：US11218256
申请日：2005-09-01
申请人： Teck Lee , David Chai , Hong Ng
发明人： Teck Lee , David Chai , Hong Ng
IPC分类号： H01L23/02
CPC分类号： H01L23/12 , H01L21/76898 , H01L23/13 , H01L23/3121 , H01L23/3135 , H01L23/481 , H01L24/05 , H01L24/06 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L2224/04042 , H01L2224/05571 , H01L2224/05599 , H01L2224/06136 , H01L2224/2518 , H01L2224/32225 , H01L2224/45144 , H01L2224/4809 , H01L2224/48091 , H01L2224/48095 , H01L2224/48227 , H01L2224/48235 , H01L2224/4824 , H01L2224/4845 , H01L2224/48464 , H01L2224/48472 , H01L2224/48599 , H01L2224/49 , H01L2224/73215 , H01L2224/73265 , H01L2224/85203 , H01L2224/85205 , H01L2224/85399 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/09701 , H01L2924/10253 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/15787 , Y10T29/49826 , H01L2924/00 , H01L2224/05552
摘要： Microelectronic devices, associated assemblies, and associated methods are disclosed herein. For example, certain aspects of the invention are directed toward a microelectronic device that includes a microfeature workpiece having a side and an aperture in the side. The device can further include a workpiece contact having a surface. At least a portion of the surface of the workpiece contact can be accessible through the aperture and through a passageway extending between the aperture and the surface. Other aspects of the invention are directed toward a microelectronic support device that includes a support member having a side carrying a support contact that can be connectable to a workpiece contact of a microfeature workpiece. The device can further include recessed support contact means carried by the support member. The recessed support contact means can be connectable to a second workpiece contact of the microfeature workpiece.
摘要翻译：本文公开了微电子器件，相关联的组件和相关联的方法。例如，本发明的某些方面涉及一种微电子器件，该微电子器件包括具有侧面和孔侧的微特征工件。该装置还可包括具有表面的工件接触件。工件接触面的至少一部分表面可以通过孔径和通过在孔和表面之间延伸的通道而接近。本发明的其它方面涉及一种微电子支撑装置，其包括支撑构件，所述支撑构件具有承载能够连接到微特征工件的工件接触件的支撑触点的侧面。该装置还可以包括由支撑构件承载的凹进的支撑接触装置。凹入的支撑接触装置可以连接到微特征工件的第二工件接触件。

8. 发明申请

US20060173389A1 Reflex massager 审中-公开
标题翻译：反射按摩器
公开(公告)号：US20060173389A1
公开(公告)日：2006-08-03
申请号：US11048978
申请日：2005-02-03
申请人： David Chai
发明人： David Chai
IPC分类号： A61H7/00
CPC分类号： A61H15/00 , A61H2015/0042
摘要： The REFLEX MASSAGER is a plastic hand-held, non-electric, massager for the human body. The massager consists of a handle with massaging balls attached by flexible spring coils to the ends of the handle/base unit. The massaging balls of the massager comes in contact with the skin and are rolled all over the body to provide a deep, powerful massage.
摘要翻译： REFLEX MASSAGER是一种塑料手持式非电动按摩器，适用于人体。按摩器包括一个带柔性弹簧线圈的按摩球把手和手柄/底座单元的端部。按摩器的按摩球与皮肤接触并在身体上滚动以提供深层次的强力按摩。

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