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1. 发明授权

US5378347A Reducing tin sludge in acid tin plating 失效
标题翻译：在酸性锡镀层中减少锡污泥
公开(公告)号：US5378347A
公开(公告)日：1995-01-03
申请号：US65104
申请日：1993-05-19
申请人： Donald Thomson , David A. Luke , Claudia Mosher
发明人： Donald Thomson , David A. Luke , Claudia Mosher
IPC分类号： C25D3/32 , C25D3/30 , C25D3/60 , C25D21/18
CPC分类号： C25D3/30
摘要： The present invention relates to a solution for use in the electroplating of tin and tin alloys comprising a basis solution which includes fluoboric acid or an organic sulfonic acid or one of their salts, divalent tin ions, and an antioxidant compound which includes a transition metal selected from the elements of Group IV B, V B or VI B of the Periodic Table in an amount effective to assist in maintaining the tin ions in the divalent state. Another aspect of the invention relates to a method for preventing, reducing or minimizing the oxidation of tin ions in an acid electroplating solution by adding one of these antioxidant compounds thereto. This method is effective in certain basis solutions even when iron contamination or high oxygen levels are present.
摘要翻译：本发明涉及一种用于锡和锡合金电镀的溶液，其包括基础溶液，其包含氟硼酸或有机磺酸或它们的一种盐，二价锡离子和包含所选择的过渡金属的抗氧化剂化合物从元素周期表第ⅣB族，Ⅴ族或ⅥB族元素中以有助于维持二价态的锡离子的量。本发明的另一方面涉及一种通过向其中加入这些抗氧化剂化合物之一来防止，减少或最小化酸性电镀溶液中锡离子氧化的方法。即使存在铁污染或高氧含量，该方法在某些基础溶液中也是有效的。

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