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    • 1. 发明授权
    • Plain surface acoustical product and coating therefor
    • 平面声产品及其涂层
    • US5874161A
    • 1999-02-23
    • US555386
    • 1995-11-09
    • James D. PapeDarryl L. Sensenig
    • James D. PapeDarryl L. Sensenig
    • B27N7/00C09D5/00C09D5/02E04B1/84E04B1/86B32B5/16
    • C09D5/028B27N7/005C09D5/00E04B1/86E04B2001/8461E04B2001/8476Y10T428/24893Y10T428/24901Y10T428/273Y10T428/277Y10T442/2139
    • This invention describes two products both with a plain, nonperforated surface visual consisting of a fiberboard substrate with or without a laminated porous nonwoven scrim and then a finished painted surface. The finish painted surface decorates or finishes the board, but most important, must remain acoustically transparent to retain the sound absorption properties of the fiberboard prior to painting. The fiberboard substrate is made to be porous or modified with hole perforations to cause it to be a good sound absorber. If the fiberboard substrate is sufficiently porous without hole perforations, then the sprayable, high solids, porous paint can be directly applied. If hole perforations are used to improve the sound absorption properties of the board substrate, then a porous, nonwoven scrim is attached and painted using the same high solids porous paint. This painted scrim must be sufficiently optically opaque to hide the hole punched board, yet sufficiently open to render it acoustically transparent. The inventions also include the paint coating alone or the paint/scrim coating alone.
    • 本发明描述了两种产品,两种产品均具有普通的非穿孔表面视觉,该纤维板基底具有或不具有叠层的多孔无纺布,然后是完成的涂漆表面。 涂漆表面装饰或完成板,但最重要的是,必须保持声学透明度,以便在涂漆之前保持纤维板的吸声性能。 将纤维板基材制成多孔的或用孔穿孔改性以使其成为良好的吸音体。 如果纤维板基材足够多孔而没有孔穿孔,则可以直接施加可喷雾的高固含量多孔涂料。 如果使用孔穿孔来改善板基材的吸声性能,则使用相同的高固体多孔涂料附着和涂漆多孔的非织造松节纱。 这种被涂的稀松布必须足够光学不透明以隐藏穿孔板,但是足够开放以使其在声学上是透明的。 本发明还包括单独的涂料涂料或单独的涂料/稀释剂涂料。
    • 2. 发明授权
    • Plain surface acoustical product and coating therefor
    • 平面声产品及其涂层
    • US06284351B1
    • 2001-09-04
    • US09275101
    • 1999-03-24
    • Darryl L. Sensenig
    • Darryl L. Sensenig
    • B32B516
    • B32B21/10B32B5/022B32B5/26B32B21/02B32B2305/026B32B2307/102C09D5/028G10K11/162Y10T428/24893Y10T428/258Y10T428/273Y10T428/277Y10T442/2139
    • This invention describes two products both with a plain, fine textured, nonperforated surface visual consisting of a fiberboard substrate with or without a laminated porous nonwoven scrim and then a finished painted surface. The finish painted surface decorates or finishes the board, but most important, must remain acoustically transparent to retain the sound absorption properties of the fiberboard prior to painting. The fiberboard substrate is made to be porous or modified with hole perforations to cause it to be a good sound absorber. If the fiberboard substrate is sufficiently porous without hole perforations, then the sprayable, high solids, porous paint can be directly applied. If hole perforations are used to improve the sound absorption properties of the board substrate, then a porous, nonwoven scrim is attached and painted using the same high solids porous paint. This painted scrim must be sufficiently optically opaque to hide the hole punched board, yet sufficiently open to render it acoustically transparent. The inventions also include the paint coating alone or the paint/scrim coating alone.
    • 本发明描述了两种具有普通,细纹理,非穿孔表面视觉的产品,它们由具有或不具有层压的多孔无纺布的纤维板基底和随后的涂漆表面组成。 涂漆表面装饰或完成板,但最重要的是,必须保持声学透明度,以便在涂漆之前保持纤维板的吸声性能。 将纤维板基材制成多孔的或用孔穿孔改性以使其成为良好的吸音体。 如果纤维板基材足够多孔而没有孔穿孔,则可以直接施加可喷雾的高固含量多孔涂料。 如果使用孔穿孔来改善板基材的吸声性能,则使用相同的高固体多孔涂料附着和涂漆多孔的非织造松节纱。 这种被涂的稀松布必须足够光学不透明以隐藏穿孔板,但是足够开放以使其在声学上是透明的。 本发明还包括单独的涂料涂料或单独的涂料/稀释剂涂料。
    • 5. 发明授权
    • Plain surface acoustical product and coating therefor
    • 平面声产品及其涂层
    • US5888626A
    • 1999-03-30
    • US791447
    • 1997-01-27
    • Darryl L. Sensenig
    • Darryl L. Sensenig
    • B32B5/26B32B21/10C09D5/02G10K11/162B32B5/16
    • C09D5/028B32B21/10B32B5/26G10K11/162Y10T428/24893Y10T428/258Y10T428/273Y10T428/277Y10T442/2139
    • This invention describes two products both with a plain, fine textured, nonperforated surface visual consisting of a fiberboard substrate with or without a laminated porous nonwoven scrim and then a finished painted surface. The finish painted surface decorates or finishes the board, but most important, must remain acoustically transparent to retain the sound absorption properties of the fiberboard prior to painting. The fiberboard substrate is made to be porous or modified with hole perforations to cause it to be a good sound absorber. If the fiberboard substrate is sufficiently porous without hole perforations, then the sprayable, high solids, porous paint can be directly applied. If hole perforations are used to improve the sound absorption properties of the board substrate, then a porous, nonwoven scrim is attached and painted using the same high solids porous paint. This painted scrim must be sufficiently optically opaque to hide the hole punched board, yet sufficiently open to render it acoustically transparent. The inventions also include the paint coating alone or the paint/scrim coating alone.
    • 本发明描述了两种具有普通,细纹理,非穿孔表面视觉的产品,它们由具有或不具有叠层多孔无纺布的纤维板基底以及随后的涂漆表面组成。 涂漆表面装饰或完成板,但最重要的是,必须保持声学透明度,以便在涂漆之前保持纤维板的吸声性能。 将纤维板基材制成多孔的或用孔穿孔改性以使其成为良好的吸音体。 如果纤维板基材足够多孔而没有孔穿孔,则可以直接施加可喷雾的高固含量多孔涂料。 如果使用孔穿孔来改善板基材的吸声性能,则使用相同的高固体多孔涂料附着和涂漆多孔的非织造松节纱。 这种被涂的稀松布必须足够光学不透明以隐藏穿孔板,但是足够开放以使其在声学上是透明的。 本发明还包括单独的涂料涂料或单独的涂料/稀释剂涂料。
    • 6. 发明授权
    • Plain surface acoustical product
    • 平面声学产品
    • US5674594A
    • 1997-10-07
    • US295096
    • 1994-08-24
    • Darryl L. Sensenig
    • Darryl L. Sensenig
    • B05D7/06C09D5/02E04B1/84E04B1/86G10K11/162B32B5/16
    • G10K11/162B05D7/06C09D5/028E04B1/86E04B2001/8461E04B2001/8476Y10T428/24893Y10T428/249962Y10T428/258Y10T428/273Y10T428/277
    • This invention describes two products both with a plain, fine textured, nonperforated surface visual consisting of a fiberboard substrate with or without a laminated porous nonwoven scrim and then a finished painted surface. The finish painted surface decorates or finishes the board, but most important, must remain acoustically transparent to retain the sound absorption properties of the fiberboard prior to painting. The fiberboard substrate is made to be porous or modified with hole perforations to cause it to be a good sound absorber. If the fiberboard substrate is sufficiently porous without hole perforations, then the sprayable, high solids, porous paint can be directly applied. If hole perforations are used to improve the sound absorption properties of the board substrate, then a porous, nonwoven scrim is attached and painted using the same high solids porous paint. This painted scrim must be sufficiently optically opaque to hide the hole punched board, yet sufficiently open to render it acoustically transparent.
    • 本发明描述了两种具有普通,细纹理,非穿孔表面视觉的产品,它们由具有或不具有层压的多孔无纺布的纤维板基底和随后的涂漆表面组成。 涂漆表面装饰或完成板,但最重要的是,必须保持声学透明度,以便在涂漆之前保持纤维板的吸声性能。 将纤维板基材制成多孔的或用孔穿孔改性以使其成为良好的吸音体。 如果纤维板基材足够多孔而没有孔穿孔,则可以直接施加可喷雾的高固含量多孔涂料。 如果使用孔穿孔来改善板基材的吸声性能,则使用相同的高固体多孔涂料附着并涂漆多孔的非织造布料。 这种被涂的稀松布必须足够光学不透明以隐藏穿孔板,但是足够开放以使其在声学上是透明的。
    • 7. 发明授权
    • Loose-lay and adhered surface coverings
    • 松散和粘附的表面覆盖物
    • US4654244A
    • 1987-03-31
    • US635145
    • 1984-07-27
    • Donald C. EckertJ. Richard GeorgeGeorge L. LilleyDarryl L. SensenigJames A. Tshudy
    • Donald C. EckertJ. Richard GeorgeGeorge L. LilleyDarryl L. SensenigJames A. Tshudy
    • B32B27/30D06N7/00E04F15/10E04F15/18E04F15/22B32B3/14
    • E04F15/22B32B27/30D06N7/00E04F15/082E04F15/105E04F15/18E04F15/182E04F15/186Y10T428/163
    • The present invention concerns loose-lay floor structures comprising at least two layers of reinforcing material and processes to design and produce them. Loose-lay floors may be designed which will be suitable for use over stable subfloors, or which will accommodate the movement of very unstable subfloors. Flooring constructed according to this invention will have the ability to resist buckling, curling and doming, and will resist moving under a rolling load. A process is also provided for modifying structures comprising a single reinforcing layer in situ so as to convert structures with unacceptable buckling characteristics into structures with acceptable buckling characteristics. As an alternative, the reinforcing layer may be premodified such that, when used to provide a surface covering, the covering will have acceptable buckling characteristics. In appropriate circumstances, surface coverings of the present invention may also be adhered to subsurfaces, and processes are described wherein the required adhesive capacity of an adhesive can be calculated.
    • 本发明涉及包括至少两层增强材料的松散地板结构以及设计和生产它们的过程。 可以设计松散地板,适用于稳定的地板底板,或适应非常不稳定的底层地板的运动。 根据本发明构造的地板将具有抵抗弯曲,卷曲和拱起的能力,并且将抵抗在滚动载荷下移动。 还提供了一种方法,用于在现场改变包括单个增强层的结构,以将具有不可接受的屈曲特性的结构转化为具有可接受的屈曲特性的结构。 作为替代,增强层可以被预先改质,使得当用于提供表面覆盖物时,覆盖物将具有可接受的屈曲特性。 在适当的情况下,本发明的表面覆盖物也可以附着于表面,并且描述了可以计算出粘合剂所要求的粘合能力的方法。
    • 8. 发明授权
    • Flotation method for orienting chips in the manufacture of surface
covering
    • 表面覆盖制造中芯片定向浮选方法
    • US4552606A
    • 1985-11-12
    • US473016
    • 1983-03-07
    • Timothy D. ColyerDarryl L. Sensenig
    • Timothy D. ColyerDarryl L. Sensenig
    • B32B3/14B32B3/18B32B27/14B32B33/00B32B37/00B32B43/00D06N7/00B32B5/16
    • D06N7/0052Y10T156/1097
    • A substantially non-overlapping tightly packed layer of plastic chips is formed and attached to the surface of a substrate by a method in which the chips are dispersed onto the surface of a liquid, flowing from a first location to a second location. The rate of flow of the surface of the liquid is reduced at the second location to cause the chips to pack together in a single-chip-thickness layer. The layer of chips is then removed from the liquid by passing a porous web upward at an angle from below the liquid surface through the chip layer-liquid interface. The chip layer is then transferred to a heat-sensitive transparent adhesive coating on a suitable prepared substrate and secured thereon by means of heat and pressure. A resinous wear layer which is transparent after fusion is then applied. Prior to fusion of the wear layer, it may be passed beneath a smoothing blade or, if a more embossed surface texture is desired, beneath an air knife to move some of the resinous wear layer material from between the chips onto the surfaces thereof.
    • 通过其中芯片分散在从第一位置到第二位置的液体表面上的方法,形成基本上不重叠的紧密堆积的塑料芯片层并附着到基板的表面。 在第二位置处,液体表面的流动速率降低,使得芯片在单芯片厚度层中堆叠在一起。 然后通过使多孔纤维网从液面下方穿过芯片层 - 液体界面以一定角度向上通过多孔纸,从液体中除去切片。 然后将芯片层转移到合适制备的基板上的热敏透明粘合剂涂层上,并通过热和压力将其固定在其上。 然后施加融合后透明的树脂耐磨层。 在熔融层之前,其可以通过平滑刮刀下方,或者如果需要更压花的表面纹理,则在气刀下方将一些树脂耐磨层材料从芯片之间移动到其表面上。