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    • 3. 发明申请
    • Resin Composition
    • 树脂组合物
    • US20100120994A1
    • 2010-05-13
    • US12604247
    • 2009-10-22
    • Toru SAITOMasaki IHARAAkinori YAMAMOTODaisuke OGAYA
    • Toru SAITOMasaki IHARAAkinori YAMAMOTODaisuke OGAYA
    • C08L83/00
    • C08G75/08C08L81/02G02B1/041C08L81/00
    • A resin composition is disclosed, which is obtained by polymerizing and curing a polymerizable composition at least containing: component A: a compound having in one molecule at lease one episulfide structure represented by the following formula (1): wherein X represents S or C, and R1 represents C1-10 hydrocarbon, component B: a compound having per molecule at least one SH group, and component C: an organosilicon compound represented by the following formula (2): R1mR2pSiX14−p−m  (2) wherein R1 is an organic group having a polymerizable reaction group, R2 is a C1-6 hydrocarbon group, X1 is a hydrolytic group, m is 0 or 1, and p is 0 or 1, the component C being present in a proportion of 6 parts by mass or more and 50 parts by mass or less per 100 parts by mass of the total of the component A and the component B.
    • 公开了通过聚合和固化可聚合组合物获得的树脂组合物,所述聚合性组合物至少含有:组分A:具有一个分子中的由下式(1)表示的至少一个环硫结构的化合物:其中X表示S或C, 和R 1表示C 1-10烃,成分B:每分子具有至少一个SH基团的化合物,成分C:由下式(2)表示的有机硅化合物:R1mR2pSiX14-p-m(2)其中R1是 具有可聚合反应基团的有机基团,R 2为C 1-6烃基,X 1为水解基团,m为0或1,p为0或1,组分C以6质量份的比例存在,或 相对于成分A和成分B的合计100质量份,更多为50质量份以下。