专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20080138176A1 Apparatus for manufacturing semiconductor device 审中-公开
标题翻译：半导体器件制造装置
公开(公告)号：US20080138176A1
公开(公告)日：2008-06-12
申请号：US11881012
申请日：2007-07-25
申请人： Hyung-Joon Kim , Seung-Bae Lee , Dae-Hyun Yang , Ki-Yung Lee
发明人： Hyung-Joon Kim , Seung-Bae Lee , Dae-Hyun Yang , Ki-Yung Lee
IPC分类号： H01L21/677
CPC分类号： H01L21/67173 , H01L21/6719 , H01L21/67196 , H01L21/67201
摘要： The present invention provides an apparatus for manufacturing a semiconductor device. The apparatus includes vacuum wafer transfer modules disposed in a line so as to correspond to stages, a loadlock chamber module transferring wafers in vacuum, first process chambers disposed around the vacuum wafer transfer modules so as to process the wafers transferred from the loadlock chamber module, first buffer stages disposed in the vacuum wafer transfer modules so that the wafers are loaded thereon and unloaded therefrom, a first transfer robot disposed between the first process chambers so as to transfer the wafers from the loadlock chamber module to the first process chambers and then to transfer the wafers from the loadlock chamber module onto the first buffer stages, second process chambers disposed around the vacuum wafer transfer modules so as to process the wafers transferred from the first buffer stages, and a second transfer robot disposed between the second process chambers so as to transfer the wafers, which are transferred to the first buffer stages, to the second process chambers.
摘要翻译：本发明提供一种半导体器件的制造装置。该装置包括：一排设置成对应于一级的真空晶片传送模块，一个负载锁定室模块，在真空中传送晶片，设置在真空晶片传送模块周围的第一处理室，以处理从负载锁定室模块传送的晶片，设置在真空晶片转移模块中的第一缓冲级，使得晶片在其上装载并卸载;第一传送机器人，设置在第一处理室之间，以将晶片从负载锁定室模块传送到第一处理室，然后到将晶片从负载锁定室模块转移到第一缓冲级上，第二处理室设置在真空晶片传送模块周围，以处理从第一缓冲级传送的晶片，以及设置在第二处理室之间的第二传送机器人，以便以将转移到第一缓冲级的晶片传送到第二缓冲级处理室。

IPRDB

热门服务

关于我们

友情链接

联系方式