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1. 发明授权

US08772929B2 Package for three dimensional integrated circuit 有权
标题翻译：三维集成电路封装
公开(公告)号：US08772929B2
公开(公告)日：2014-07-08
申请号：US13297992
申请日：2011-11-16
申请人： Chih-Hao Chen , Long Hua Lee , Chun-Hsing Su , Yi-Lin Tsai , Kung-Chen Yeh , Chung Yu Wang , Jui-Pin Hung , Jing-Cheng Lin
发明人： Chih-Hao Chen , Long Hua Lee , Chun-Hsing Su , Yi-Lin Tsai , Kung-Chen Yeh , Chung Yu Wang , Jui-Pin Hung , Jing-Cheng Lin
IPC分类号： H01L23/48 , H01L21/78
CPC分类号： H01L21/563 , H01L21/561 , H01L21/78 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/131 , H01L2224/16225 , H01L2224/17181 , H01L2224/26145 , H01L2224/2919 , H01L2224/32145 , H01L2224/73204 , H01L2224/81193 , H01L2224/81815 , H01L2224/83104 , H01L2224/9202 , H01L2224/92125 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/351 , H01L2224/81 , H01L2224/32225 , H01L2924/00 , H01L2924/00014 , H01L2224/11 , H01L2924/014 , H01L2924/0665
摘要： A wafer level package includes a semiconductor die bonded on a supporting wafer. The semiconductor die has at least a step recess at its substrate. An underfill layer is formed between the semiconductor die and the supporting wafer. Moreover, the height of the underfill layer is limited by the step recess. During a fabrication process of the wafer level package, the step recess helps to reduce the stress on the wafer level package.
摘要翻译：晶片级封装包括结合在支撑晶片上的半导体管芯。半导体管芯在其衬底上至少有一个台阶凹槽。在半导体管芯和支撑晶片之间形成底部填充层。此外，底部填充层的高度受到台阶凹槽的限制。在晶片级封装的制造过程中，台阶凹槽有助于减小晶片级封装上的应力。

2. 发明申请

US20130119533A1 Package for Three Dimensional Integrated Circuit 有权
标题翻译：三维集成电路封装
公开(公告)号：US20130119533A1
公开(公告)日：2013-05-16
申请号：US13297992
申请日：2011-11-16
申请人： Chih-Hao Chen , Long Hua Lee , Chun-Hsing Su , Yi-Lin Tsai , Kung-Chen Yeh , Chung Yu Wang , Jui-Pin Hung , Jing-Cheng Lin
发明人： Chih-Hao Chen , Long Hua Lee , Chun-Hsing Su , Yi-Lin Tsai , Kung-Chen Yeh , Chung Yu Wang , Jui-Pin Hung , Jing-Cheng Lin
IPC分类号： H01L23/48 , H01L21/78
CPC分类号： H01L21/563 , H01L21/561 , H01L21/78 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/81 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2224/131 , H01L2224/16225 , H01L2224/17181 , H01L2224/26145 , H01L2224/2919 , H01L2224/32145 , H01L2224/73204 , H01L2224/81193 , H01L2224/81815 , H01L2224/83104 , H01L2224/9202 , H01L2224/92125 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2924/12042 , H01L2924/15311 , H01L2924/181 , H01L2924/18161 , H01L2924/351 , H01L2224/81 , H01L2224/32225 , H01L2924/00 , H01L2924/00014 , H01L2224/11 , H01L2924/014 , H01L2924/0665
摘要： A wafer level package includes a semiconductor die bonded on a supporting wafer. The semiconductor die has at least a step recess at its substrate. An underfill layer is formed between the semiconductor die and the supporting wafer. Moreover, the height of the underfill layer is limited by the step recess. During a fabrication process of the wafer level package, the step recess helps to reduce the stress on the wafer level package.
摘要翻译：晶片级封装包括结合在支撑晶片上的半导体管芯。半导体管芯在其衬底上至少有一个台阶凹槽。在半导体管芯和支撑晶片之间形成底部填充层。此外，底部填充层的高度受到台阶凹槽的限制。在晶片级封装的制造过程中，台阶凹槽有助于减小晶片级封装上的应力。

3. 发明申请

US20130122689A1 Methods for De-Bonding Carriers 有权
标题翻译：去绑定载体的方法
公开(公告)号：US20130122689A1
公开(公告)日：2013-05-16
申请号：US13298014
申请日：2011-11-16
申请人： Chung Yu Wang , Jui-Pin Hung , Chih-Hao Chen , Chun-Hsing Su , Yi-Chao Mao , Kung-Chen Yeh , Yi-Lin Tsai , Ying-Tz Hung , Chin-Fu Kao , Shih-Yi Syu , Chin-Chuan Chang , Hsien-Wen Liu , Long Hua Lee
发明人： Chung Yu Wang , Jui-Pin Hung , Chih-Hao Chen , Chun-Hsing Su , Yi-Chao Mao , Kung-Chen Yeh , Yi-Lin Tsai , Ying-Tz Hung , Chin-Fu Kao , Shih-Yi Syu , Chin-Chuan Chang , Hsien-Wen Liu , Long Hua Lee
IPC分类号： H01L21/78
CPC分类号： H01L21/6835 , H01L21/6836 , H01L21/78 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68368 , H01L2221/68381 , H01L2224/11002 , H01L2224/13025 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/15311 , H01L2924/18161 , H01L2224/81 , H01L2224/83 , H01L2224/11 , H01L2924/00
摘要： A method includes performing a dicing on a composite wafer including a plurality of dies, wherein the composite wafer is bonded on a carrier when the step of dicing is performed. After the step of dicing, the composite wafer is mounted onto a tape. The carrier is then de-bonded from the composite wafer and the first tape.
摘要翻译：一种方法包括在包括多个管芯的复合晶片上执行切割，其中当执行切割步骤时，复合晶片结合在载体上。在切割步骤之后，将复合晶片安装在带上。然后将载体从复合晶片和第一带去粘合。

4. 发明授权

US08629043B2 Methods for de-bonding carriers 有权
标题翻译：去离子载体的方法
公开(公告)号：US08629043B2
公开(公告)日：2014-01-14
申请号：US13298014
申请日：2011-11-16
申请人： Chung Yu Wang , Jui-Pin Hung , Chih-Hao Chen , Chun-Hsing Su , Yi-Chao Mao , Kung-Chen Yeh , Yi-Lin Tsai , Ying-Tz Hung , Chin-Fu Kao , Shih-Yi Syu , Chin-Chuan Chang , Hsien-Wen Liu , Long Hua Lee
发明人： Chung Yu Wang , Jui-Pin Hung , Chih-Hao Chen , Chun-Hsing Su , Yi-Chao Mao , Kung-Chen Yeh , Yi-Lin Tsai , Ying-Tz Hung , Chin-Fu Kao , Shih-Yi Syu , Chin-Chuan Chang , Hsien-Wen Liu , Long Hua Lee
IPC分类号： H01L21/78
CPC分类号： H01L21/6835 , H01L21/6836 , H01L21/78 , H01L24/94 , H01L24/97 , H01L25/0652 , H01L25/0655 , H01L25/50 , H01L2221/68318 , H01L2221/68327 , H01L2221/6834 , H01L2221/68368 , H01L2221/68381 , H01L2224/11002 , H01L2224/13025 , H01L2224/1403 , H01L2224/14181 , H01L2224/16145 , H01L2224/16227 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/94 , H01L2224/97 , H01L2225/06513 , H01L2225/06541 , H01L2924/15311 , H01L2924/18161 , H01L2224/81 , H01L2224/83 , H01L2224/11 , H01L2924/00
摘要： A method includes performing a dicing on a composite wafer including a plurality of dies, wherein the composite wafer is bonded on a carrier when the step of dicing is performed. After the step of dicing, the composite wafer is mounted onto a tape. The carrier is then de-bonded from the composite wafer and the first tape.
摘要翻译：一种方法包括在包括多个管芯的复合晶片上执行切割，其中当执行切割步骤时，复合晶片结合在载体上。在切割步骤之后，将复合晶片安装在带上。然后将载体从复合晶片和第一带去粘合。

5. 发明授权

US09662812B2 Methods for molding integrated circuits 有权
公开(公告)号：US09662812B2
公开(公告)日：2017-05-30
申请号：US13485307
申请日：2012-05-31
申请人： Chih-Hao Chen , Hsien-Wen Liu , Yi-Lin Tsai , Jui-Pin Hung , Jing-Cheng Lin
发明人： Chih-Hao Chen , Hsien-Wen Liu , Yi-Lin Tsai , Jui-Pin Hung , Jing-Cheng Lin
IPC分类号： B29C43/18 , H01L21/56 , H01L23/31 , H01L23/00
CPC分类号： B29C43/18 , H01L21/565 , H01L23/3121 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/94 , H01L2924/1531 , H01L2924/157 , H01L2924/00012 , H01L2224/81
摘要： A method includes molding a polymer onto a package component. The step of molding includes a first molding stage performed at a first temperature, and a second molding stage performed at a second temperature different from the first temperature.

6. 发明申请

US20130207306A1 Methods for Molding Integrated Circuits 有权
标题翻译：集成电路成型方法
公开(公告)号：US20130207306A1
公开(公告)日：2013-08-15
申请号：US13485307
申请日：2012-05-31
申请人： Chih-Hao Chen , Hsien-Wen Liu , Yi-Lin Tsai , Jui-Pin Hung , Jing-Cheng Lin
发明人： Chih-Hao Chen , Hsien-Wen Liu , Yi-Lin Tsai , Jui-Pin Hung , Jing-Cheng Lin
IPC分类号： B29C43/18 , H01L21/56
CPC分类号： B29C43/18 , H01L21/565 , H01L23/3121 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2224/16145 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73204 , H01L2224/94 , H01L2924/1531 , H01L2924/157 , H01L2924/00012 , H01L2224/81
摘要： A method includes molding a polymer onto a package component. The step of molding includes a first molding stage performed at a first temperature, and a second molding stage performed at a second temperature different from the first temperature.
摘要翻译：一种方法包括将聚合物模塑到包装部件上。模制步骤包括在第一温度下进行的第一模塑阶段和在与第一温度不同的第二温度下进行的第二模塑阶段。

7. 发明授权

US08956954B2 Method of processing wafers for saving material and protecting environment 有权
标题翻译：处理晶圆以节省材料和保护环境的方法
公开(公告)号：US08956954B2
公开(公告)日：2015-02-17
申请号：US13400587
申请日：2012-02-21
申请人： Chih-Hao Chen
发明人： Chih-Hao Chen
IPC分类号： H01L21/78
CPC分类号： H01L21/67271 , H01L21/67092 , H01L21/67288 , H01L22/20
摘要： A method of processing wafers for saving material and protecting environment is implemented to collect defective or incomplete wafers and perform cutting operation to create a plurality of separate dies. According to the requirement of a specification, the backs of the dies are grinded to allow each die to have a predetermined thickness. Thereafter, the grinded dies with completeness are sequentially placed onto a carrying means. With the method, the defective or incomplete wafers, which would be discarded in general wafer manufacturing, may be reclaimed to go through cutting, grinding, and selecting operations, so that the dies with completeness on the defective wafers can be picked out and processed again, so as to increase the yield, lower the manufacturing cost, reduce the amount of the wafer waste, increase the wafer utilization, and meet the demands of energy saving, carbon reduction, and environmental protection.
摘要翻译：实施用于处理用于节省材料和保护环境的晶片的方法以收集有缺陷或不完整的晶片并执行切割操作以创建多个单独的模具。根据说明书的要求，研磨模具的背面以允许每个模具具有预定的厚度。此后，将具有完整性的研磨的模具依次放置在承载装置上。通过该方法，可以回收在通常的晶片制造中丢弃的有缺陷或不完整的晶片，以进行切割，研磨和选择操作，使得可以挑选并处理有缺陷晶片的完整性的模具，从而提高产量，降低制造成本，减少晶圆浪费，提高晶圆利用率，满足节能减排和环保要求。

8. 发明授权

US08724852B2 Method for sensing motion and device for implementing the same 有权
标题翻译：用于感测运动的方法和用于实现其的装置
公开(公告)号：US08724852B2
公开(公告)日：2014-05-13
申请号：US13470466
申请日：2012-05-14
申请人： Meng-Kun Chen , Chih-Hao Chen
发明人： Meng-Kun Chen , Chih-Hao Chen
IPC分类号： G06K9/00
CPC分类号： G06F3/005 , G06T7/136 , G06T7/246 , G06T2207/10152
摘要： A method for sensing a motion of an object is to be implemented by a motion recognition device that includes an image acquiring unit and a processor. In the method, the image acquiring unit is configured to acquire a series of image frames by detecting intensity of light received thereby. The processor is configured to receive at least one of the image frames and to determine whether an object is detected in the at least one of the image frames. When an object is detected, the processor is further configured to receive the image frames from the image acquiring unit, and to determine a motion of the object with respect to a three-dimensional coordinate system according to the image frames thus received.
摘要翻译：用于感测物体的运动的方法将由包括图像获取单元和处理器的运动识别装置来实现。在该方法中，图像获取单元被配置为通过检测由此接收的光的强度来获取一系列图像帧。处理器被配置为接收至少一个图像帧并且确定在所述至少一个图像帧中是否检测到对象。当检测到对象时，处理器还被配置为从图像获取单元接收图像帧，并且根据如此接收的图像帧来确定对象相对于三维坐标系的运动。

9. 发明授权

US08576550B2 Keyboard fixing structure for fixing a keyboard and portable electronic device therewith 有权
标题翻译：用于固定键盘和便携式电子设备的键盘固定结构
公开(公告)号：US08576550B2
公开(公告)日：2013-11-05
申请号：US13343722
申请日：2012-01-05
申请人： Yu-Hsien Huang , Chi-Chun Chiang , Chih-Hao Chen , Chia-Hsiung Hsueh
发明人： Yu-Hsien Huang , Chi-Chun Chiang , Chih-Hao Chen , Chia-Hsiung Hsueh
IPC分类号： G06F1/16
CPC分类号： G06F1/1662
摘要： A keyboard fixing structure for fixing a keyboard in an opening of a housing is disclosed. The keyboard fixing structure includes an engaging portion, a first fixing portion, a first flexible connecting portion, a second fixing portion and a second flexible connecting portion. The engaging portion presses a first side of the keyboard in the opening. The first fixing portion is fixed on the housing, and the first flexible connecting portion is connected to the first fixing portion and the engaging portion. The second fixing portion is fixed on the housing, and the second flexible connecting portion is connected to the second fixing portion and the engaging portion. The first flexible connecting portion and the second flexible connecting portion cooperatively provide resilient force to the engaging portion in a first direction for driving the engaging portion to press the first side of the keyboard.
摘要翻译：公开了一种用于将键盘固定在壳体的开口中的键盘固定结构。键盘固定结构包括接合部分，第一固定部分，第一柔性连接部分，第二固定部分和第二柔性连接部分。接合部在开口部中按压键盘的第一侧。第一固定部分固定在壳体上，第一柔性连接部分连接到第一固定部分和接合部分。第二固定部分固定在壳体上，第二柔性连接部分连接到第二固定部分和接合部分。第一柔性连接部分和第二柔性连接部分在第一方向上协同地向接合部分提供弹性力，用于驱动接合部分按压键盘的第一侧。

10. 发明申请

US20070060657A1 Method of preparing a copolymer and using such as a dispersing agent for titanate-based ceramic colloids 有权
标题翻译：共聚物的制备方法，使用分散剂等钛酸系陶瓷胶体
公开(公告)号：US20070060657A1
公开(公告)日：2007-03-15
申请号：US11397579
申请日：2006-04-05
申请人： Kung-Chung Hsu , Chih-Hao Chen , Yu-Ping Tsai , Wen-Cheng Wei
发明人： Kung-Chung Hsu , Chih-Hao Chen , Yu-Ping Tsai , Wen-Cheng Wei
IPC分类号： B01F3/12 , B01F17/00 , B22F1/00
CPC分类号： B01F17/0057 , B01J13/0056 , C04B35/4682 , C04B35/63424 , C04B35/6344 , C04B35/63444 , C04B35/63488 , C04B2235/3236 , C04B2235/5445 , C04B2235/608
摘要： This invention relates to the preparation of a copolymer which is used as a dispersing agent for titanate-based ceramic colloids. This copolymer has the following structure: Wherein R1 is H, NH4, alkali metals; R2 is H, NH4, alkali metals; R3 is H, NH4, alkali metals; a is an integer from 1 to 2000; b is an integer from 1 to 5000; and c is an integer from 1 to 1000; n is an integer from 1 to 500.
摘要翻译：本发明涉及一种用作钛酸盐系陶瓷胶体分散剂的共聚物的制备方法。该共聚物具有以下结构：其中R 1是H，NH 4，碱金属; R 2是H，NH 4，碱金属; R 3是H，NH 4，碱金属; a是从1到2000的整数; b为1〜5000的整数; 且c为1至1000的整数; n为1〜500的整数。

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