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1. 发明公开

US20230185795A1 METHOD AND SYSTEM FOR PROCESSING DATABASE TRANSACTIONS IN A DISTRIBUTED ONLINE TRANSACTION PROCESSING (OLTP) DATABASE 审中-公开
公开(公告)号：US20230185795A1
公开(公告)日：2023-06-15
申请号：US17550547
申请日：2021-12-14
申请人： Yuk Kuen CHAN , Ronen GROSMAN , Seyyed Mohammad Hadi SAJJADPOUR , Hoi leng LAO , Wen Hao ZHANG , Chung Yin Alan WONG
发明人： Yuk Kuen CHAN , Ronen GROSMAN , Seyyed Mohammad Hadi SAJJADPOUR , Hoi leng LAO , Wen Hao ZHANG , Chung Yin Alan WONG
IPC分类号： G06F16/23 , G06F16/245
CPC分类号： G06F16/2379 , G06F16/245
摘要： A method and system of processing database transactions in a distributed online transaction processing (OLTP) database is provided. Overhead and network bandwidth associated with a global transaction manager are reduced and scalability improved by determining whether incoming statements are single-shard or multi-shard. For single-shard statements, a local transaction identifier (TXID) stored and associated with a data record reference by the statement is retrieved. The retrieved TXID is compared against a copy of a list of prepared transactions that are pending in a respective data node. If the TXID is in the copy of the prepared list, the statement is caused to await until the previous transaction has been committed or aborted. The visibility of a change committed by the previous is then determined, and the statement is processed.

2. 发明申请

US20140054132A1 VIBRATION FEEDING APPARATUS AND METHOD 有权
标题翻译：振动送料装置及方法
公开(公告)号：US20140054132A1
公开(公告)日：2014-02-27
申请号：US13593606
申请日：2012-08-24
申请人： Ho Chi WONG , Ping Kong CHOY , Chung Yin LAU , Xiao Feng LI
发明人： Ho Chi WONG , Ping Kong CHOY , Chung Yin LAU , Xiao Feng LI
IPC分类号： B65G47/256
CPC分类号： B65G47/256 , B65G27/04 , B65G47/1421
摘要： A vibration feeding apparatus comprises an alignment track that is operative to receive electronic components and to arrange the electronic components in a desired orientation by vibrating and accelerating the electronic components located on the alignment track. An inspection station rejects electronic components that are not in the desired orientation onto a reject track for reintroduction to the alignment track. A spreading unit adjacent to the alignment track then transfers rejected electronic components from the reject track to the alignment track for arranging the electronic components in the desired orientation.
摘要翻译：振动给料装置包括对准轨道，其可操作以接收电子部件并且通过振动和加速位于对准轨道上的电子部件来将电子部件布置成期望的取向。检查站拒绝不在期望方向上的电子部件到拒收轨道上以重新引入对准轨道。与对准轨道相邻的扩展单元然后将被拒绝的电子部件从拒绝轨道传送到对准轨道，用于将电子部件布置在期望的方位。

3. 发明授权

US08247689B2 Ruthenium complex and photoelectric component using the same 失效
标题翻译：钌络合物和光电组件使用相同
公开(公告)号：US08247689B2
公开(公告)日：2012-08-21
申请号：US12318207
申请日：2008-12-23
申请人： Ching-Lin Chen , Ta-Chung Yin , Der-Gun Chou
发明人： Ching-Lin Chen , Ta-Chung Yin , Der-Gun Chou
IPC分类号： H01L31/042
CPC分类号： C07F15/0053 , C07D213/20 , C07D213/71 , C07D213/79 , C07D215/10 , C09B57/10 , C09B69/04 , H01G9/2031 , H01G9/2059 , H01L51/0086 , Y02E10/542 , Y02E10/549 , Y02P70/521
摘要： The present invention relates to a ruthenium complex and a photoelectric component using the same, and the ruthenium complex is represented by the following formula (I): RuL2(NCS)2Am (I) wherein L, A and m are defined the same as the specification. The ruthenium complex of the present invention is suitable for Dye-Sensitized Solar Cell (DSSC). Hence, the photoelectric characteristics of the DSSC manufactured with the ruthenium complex of the present invention can be improved.
摘要翻译：本发明涉及钌络合物和使用该钌络合物的光电部件，钌络合物由下式（I）表示：RuL 2（NCS）2Am（I）其中L，A和m定义与规范。本发明的钌络合物适用于染料敏化太阳能电池（DSSC）。因此，可以提高用本发明的钌络合物制造的DSSC的光电特性。

4. 发明授权

US08162699B2 Vertical cable manager 有权
标题翻译：垂直电缆管理器
公开(公告)号：US08162699B2
公开(公告)日：2012-04-24
申请号：US12954974
申请日：2010-11-29
申请人： Michael J. McGrath , Max W. Hibner , Thomas Chung Yin Wong
发明人： Michael J. McGrath , Max W. Hibner , Thomas Chung Yin Wong
IPC分类号： H01R13/50
CPC分类号： H04Q1/062 , H02G3/0406 , H02G3/045 , H04Q2201/02 , H05K7/186
摘要： Certain embodiments of the present invention provide a bracket for mounting a vertical cable manager to a rack. The bracket includes a first portion extending in a first direction, a second portion extending from the first portion in a second direction substantially perpendicular to the first direction, and a third portion extending from the second portion in a third direction substantially perpendicular to the second direction and substantially parallel to the first direction. The first portion of the bracket is adapted to snap-fit to the vertical cable manager.
摘要翻译：本发明的某些实施例提供一种用于将垂直电缆管理器安装到机架的支架。支架包括沿第一方向延伸的第一部分，第二部分从基本上垂直于第一方向的第二方向从第一部分延伸;以及第三部分，其从第二部分沿基本垂直于第二方向的第三方向延伸并且基本上平行于第一方向。支架的第一部分适于卡扣配合到垂直电缆管理器。

5. 发明申请

US20090029537A1 Method for forming semiconductor package and mold cast used for the same 审中-公开
标题翻译：用于形成半导体封装和模铸件的方法
公开(公告)号：US20090029537A1
公开(公告)日：2009-01-29
申请号：US11878731
申请日：2007-07-26
申请人： Chih Tai Hsu , Chung Ju Wu , Chung Yin Fang
发明人： Chih Tai Hsu , Chung Ju Wu , Chung Yin Fang
IPC分类号： H01L21/20
CPC分类号： H01L23/3128 , H01L21/565 , H01L23/4334 , H01L24/48 , H01L2224/48227 , H01L2924/00014 , H01L2924/14 , H01L2924/16152 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A method for fabricating a thermally enhanced semiconductor package including the steps of providing a substrate having a first surface and a second surface; providing a die on the first surface of the substrate and electrically connecting the die with the substrate; placing the die, the substrate, and a heat slug in a mold cavity defined by a mold cast, the mold cast having a protruding portion that touches the periphery on the surface of the heat slug, wherein the contact area is defined as a periphery region and the non-contact area enclosed by the periphery region is defined as a central region; and encapsulating the die and the heat slug by molding materials, wherein the periphery region and the central region of the heat slug are exposed to the ambient air.
摘要翻译：一种制造热增强半导体封装的方法，包括以下步骤：提供具有第一表面和第二表面的衬底; 在所述基板的所述第一表面上提供模具并将所述管芯与所述基板电连接; 将模具，基板和热芯块放置在由模铸件限定的模腔中，模铸件具有接触热芯块表面周边的突出部分，其中接触区域被定义为周边区域并且由周边区域包围的非接触区域被定义为中心区域; 并且通过模制材料封装模具和热块，其中热块的周边区域和中心区域暴露于环境空气中。

6. 发明申请

US20090014566A1 PAPER SHREDDING TOOL 审中-公开
标题翻译：纸制工具
公开(公告)号：US20090014566A1
公开(公告)日：2009-01-15
申请号：US11776344
申请日：2007-07-11
申请人： King Biu MAK , Chung Ming MAK , Ronald Chung Yin MAK
发明人： King Biu MAK , Chung Ming MAK , Ronald Chung Yin MAK
IPC分类号： B02C1/08
CPC分类号： B02C18/0007
摘要： A paper shredding tool is disclosed as including a first pair of cutters partly abutting each other along a first cutting plane; a second pair of cutters adjacent to the first pair of cutters, the second pair of cutters partly abutting each other along a second cutting plane; a third pair of cutters partly abutting each other along a third cutting plane; and a fourth pair of cutters adjacent to the third pair of cutters, the fourth pair of cutters partly abutting each other along a fourth cutting plane; in which each pair of cutters are rotatable relative to each other to cut a piece of paper passing between the pair of cutters along their respective cutting plane; and the distance between the first cutting plane and the second cutting plane is different from the distance between the third cutting plane and the fourth cutting plane.
摘要翻译：公开了一种切碎工具，其包括沿着第一切割平面彼此部分地邻接的第一对切割器; 与所述第一对切割器相邻的第二对切割器，所述第二对切割器沿着第二切割平面彼此部分地邻接; 第三对切割器沿着第三切割平面彼此部分地邻接; 以及与所述第三对切割器相邻的第四对切割器，所述第四对切割器沿着第四切割平面彼此部分地邻接; 其中每对切割器可相对于彼此旋转以沿着它们各自的切割平面切割通过所述一对切割器之间的一张纸; 并且第一切割平面与第二切割平面之间的距离与第三切割平面与第四切割平面之间的距离不同。

7. 发明授权

US07236033B2 System and method for detecting processing speed of integrated circuit 有权
标题翻译：用于检测集成电路处理速度的系统和方法
公开(公告)号：US07236033B2
公开(公告)日：2007-06-26
申请号：US11340755
申请日：2006-01-27
申请人： Ying Jyh Yeh , Chung Yin Fang
发明人： Ying Jyh Yeh , Chung Yin Fang
IPC分类号： H03H11/26
CPC分类号： H03H11/265 , G01R31/3016 , G01R31/31703 , G01R31/31725 , H03K2005/00058
摘要： A system for detecting the processing speed of an integrated circuit (IC) includes a flip-flop, a delay module, and a judge unit. The flip-flop receives a clock signal as a trigger signal and generates an inverted output signal. The delay module receives the inverted output signal, adjusts the delay time of the inverted output signal according to a selection signal, and outputs a delay signal to the flip-flop to have the flip-flop generate the output signal. The judge unit receives the output signal and generates a judge signal, which is enabled when the clock period of the output signal is longer than that of the clock signal.
摘要翻译：用于检测集成电路（IC）的处理速度的系统包括触发器，延迟模块和判断单元。触发器接收时钟信号作为触发信号并产生反相输出信号。延迟模块接收反相输出信号，根据选择信号调整反相输出信号的延迟时间，并向触发器输出延迟信号，使触发器产生输出信号。判断单元接收输出信号并产生判断信号，该判断信号在输出信号的时钟周期比时钟信号的时钟周期长的时间内使能。

8. 发明申请

US20070115960A1 De-interleaver for data decoding 审中-公开
标题翻译：去交织器用于数据解码
公开(公告)号：US20070115960A1
公开(公告)日：2007-05-24
申请号：US11267752
申请日：2005-11-04
申请人： Shih-Chung Yin
发明人： Shih-Chung Yin
IPC分类号： H04L12/56
CPC分类号： H04L1/0045 , H04L1/0059 , H04L1/0071 , H04L27/2601
摘要： A de-interleaver for data decoding. Two memory banks are configured to store data in column order and output the data in row order. A de-interleaving encoder receives a stream of interleaved data values, generates an input address for both the two memory banks contingent upon a modulation mode and based on a count value, and sequentially writes the interleaved data values to either of the memory banks according to the input address. Additionally, a de-interleaving decoder generates respective output addresses for the two memory banks based on a second count value and contingent upon the modulation mode, and a dummy insertion indicator. The de-interleaving decoder reads the interleaved data values from the two memory banks according to the respective output address, and extracts decision metrics from the read data according to relevant output indicators.
摘要翻译：用于数据解码的解交织器。两个存储体被配置为以列顺序存储数据，并以行顺序输出数据。解交织编码器接收交织数据流的流，根据调制模式生成两个存储体两者的输入地址，并根据计数值，依次按顺序将交错数据值写入存储体输入地址。此外，解交织解码器基于第二计数值并且根据调制模式生成两个存储体的相应输出地址，以及虚拟插入指示符。解交织解码器根据相应的输出地址从两个存储体读取交织的数据值，并根据相关的输出指示符从读取的数据中提取决策度量。

9. 发明申请

US20070076683A1 Low power module for a station of a wireless communication system and related method 审中-公开
标题翻译：用于无线通信系统站的低功率模块及相关方法
公开(公告)号：US20070076683A1
公开(公告)日：2007-04-05
申请号：US11241743
申请日：2005-09-30
申请人： Ching Chung , Shih-Chung Yin
发明人： Ching Chung , Shih-Chung Yin
IPC分类号： H04J3/06
CPC分类号： H04W52/0216 , H04W52/0293 , Y02D70/142
摘要： The invention relates to a low power module, and in particular, to a low power module applied in a station of a wireless communication system. A low power module includes a first MAC module, a second MAC module, a low power switch register, a control register unit, a slow clock generator, and a multiplexer (MUX) The first and second MAC module transmits and receives packets in a normal operational mode and a power save mode, respectively. The low power switch register switches a current mode to another mode. The control register unit controls the RF/BB module and the clock generator under the control of the low power switch register. The slow clock generator generates a slow operational clock for the second MAC module in the power save mode. The MUX chooses the normal operational or the slow operational clock periodically as a clock of the second MAC module according to the control register unit.
摘要翻译：本发明涉及一种低功率模块，特别涉及应用于无线通信系统的站中的低功率模块。低功率模块包括第一MAC模块，第二MAC模块，低功率开关寄存器，控制寄存器单元，慢时钟发生器和多路复用器（MUX）。第一和第二MAC模块以正常的方式发送和接收分组操作模式和省电模式。低功率开关寄存器将当前模式切换到另一种模式。控制寄存器单元在低功率开关寄存器的控制下控制RF / BB模块和时钟发生器。在省电模式下，慢时钟发生器为第二个MAC模块生成一个缓慢的工作时钟。 MUX根据控制寄存器单元周期性地选择正常操作或慢操作时钟作为第二MAC模块的时钟。

10. 发明申请

US20060226534A1 Structure and assembly method of integrated circuit package 审中-公开
标题翻译：集成电路封装的结构和组装方法
公开(公告)号：US20060226534A1
公开(公告)日：2006-10-12
申请号：US11378283
申请日：2006-03-20
申请人： Kuei-Chen Liang , Chung-Ju Wu , Chung-Yin Fang
发明人： Kuei-Chen Liang , Chung-Ju Wu , Chung-Yin Fang
IPC分类号： H01L23/04 , H01L21/44
CPC分类号： H01L24/29 , H01L23/3128 , H01L23/50 , H01L23/552 , H01L23/60 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L2223/6611 , H01L2224/05554 , H01L2224/27013 , H01L2224/2919 , H01L2224/32225 , H01L2224/45144 , H01L2224/4554 , H01L2224/45565 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2224/49175 , H01L2224/73265 , H01L2224/83051 , H01L2224/83192 , H01L2224/8385 , H01L2224/8592 , H01L2224/92 , H01L2224/92247 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/10161 , H01L2924/14 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/16152 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/3511 , H01L2924/00012 , H01L2924/00 , H01L2224/43
摘要： A packaging structure and an assembly method are disclosed. A packaging structure includes a substrate, a die, conductive wires, and conductively filled material. The substrate includes a conductive structure, and the conductive wires are insulator-coated. The die is mounted on the substrate, and the conductive wires are connected between the die and the conductive structure. The conductively filled material is formed among the conductive wires. In the assembly method, the die is firstly mounted on the substrate, followed by connecting the conductive wires between the die and the conductive structure, and finally forming the conductively filled material among the conductive wires.
摘要翻译：公开了一种包装结构和装配方法。封装结构包括基片，裸片，导线和导电填充材料。衬底包括导电结构，并且导电线被绝缘体涂覆。芯片安装在基板上，并且导线连接在管芯和导电结构之间。导电填充材料形成在导线之间。在组装方法中，首先将模具安装在基板上，然后将导线连接在管芯和导电结构之间，最后在导线之间形成导电填充材料。

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