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1. 发明申请

US20060238274A1 Surface acoustic wave device 审中-公开
标题翻译：表面声波装置
公开(公告)号：US20060238274A1
公开(公告)日：2006-10-26
申请号：US11111938
申请日：2005-04-22
申请人： Sheng-Nan Huang , Wen-Long Leu , Chien-Heng Cheng , Yu-Ching Huang
发明人： Sheng-Nan Huang , Wen-Long Leu , Chien-Heng Cheng , Yu-Ching Huang
IPC分类号： H03H9/00
CPC分类号： H03H9/1071
摘要： A SAW device includes: a SAW chip having a piezoelectric substrate and transmitting and receiving transducers; a circuit board formed with conductive inner contacts, each of which is connected electrically to a respective one of the transmitting and receiving transducers; a first adhesive-confining curb interconnecting the circuit board and the transmitting and receiving transducers and cooperating with the circuit board and the SAW chip to define an enclosed cavity thereamong; a second adhesive-confining curb surrounding the first adhesive-confining curb to define a sealing space therebetween; an adhesive body filling the sealing space; and a molding compound covering the SAW chip and connected sealingly to the second adhesive-confining curb.
摘要翻译： SAW器件包括：SAW芯片，具有压电基片和发射和接收换能器; 形成有导电内触点的电路板，每个导电内触点电连接到发射和接收换能器中的相应一个; 连接电路板和发射和接收换能器的第一粘合约束路缘，并与电路板和SAW芯片配合以在其中限定封闭腔; 围绕所述第一粘合约束路缘的第二粘合约束路缘，以在其间限定密封空间; 填充密封空间的粘合体; 以及覆盖所述SAW芯片并且密封地连接到所述第二粘合约束路缘的模制化合物。

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