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    • 2. 发明授权
    • Semiconductor device with a structure to protect alignment marks from damage in a planarization process
    • 具有用于保护对准标记免受平坦化处理中的损伤的结构的半导体器件
    • US08324743B2
    • 2012-12-04
    • US12814228
    • 2010-06-11
    • Chiao-Wen YehChih-Hao Huang
    • Chiao-Wen YehChih-Hao Huang
    • H01L21/76
    • H01L23/544H01L2223/54426H01L2223/54453H01L2924/0002H01L2924/00
    • A method of protecting alignment marks from damage in a planarization process includes providing a substrate including a surface, forming trenches in the substrate from the surface, forming a first dielectric layer on the substrate, forming a second dielectric layer on the first dielectric layer, forming a patterned second dielectric layer by removing second dielectric over the trenches, resulting in openings defined by the trenches and the patterned second dielectric layer, forming a third dielectric layer on the patterned second dielectric layer, the third dielectric layer filling the openings, and planarizing the third dielectric layer by using the patterned second dielectric layer as a stop layer, resulting in residual third dielectric in the openings that includes a first portion in the substrate and a second portion above the surface of the substrate.
    • 在平坦化工艺中保护对准标记免受损伤的方法包括提供包括表面的衬底,从表面在衬底中形成沟槽,在衬底上形成第一介电层,在第一介电层上形成第二介电层,形成 图案化的第二介电层,通过在沟槽上去除第二电介质,导致由沟槽和图案化的第二介电层限定的开口,在图案化的第二介电层上形成第三电介质层,填充开口的第三电介质层, 通过使用图案化的第二介电层作为阻挡层,在开口中产生残留的第三电介质,其包括衬底中的第一部分和衬底表面上的第二部分。
    • 3. 发明申请
    • METHOD OF ALIGNMENT MARK PROTECTION AND SEMICONDUCTOR DEVICE FORMED THEREBY
    • 对准标记保护和形成的半导体器件的方法
    • US20110304006A1
    • 2011-12-15
    • US12814228
    • 2010-06-11
    • Chiao-Wen YehChih-Hao Huang
    • Chiao-Wen YehChih-Hao Huang
    • H01L23/544H01L21/71
    • H01L23/544H01L2223/54426H01L2223/54453H01L2924/0002H01L2924/00
    • A method of protecting alignment marks from damage in a planarization process includes providing a substrate including a surface, forming trenches in the substrate from the surface, forming a first dielectric layer on the substrate, forming a second dielectric layer on the first dielectric layer, forming a patterned second dielectric layer by removing second dielectric over the trenches, resulting in openings defined by the trenches and the patterned second dielectric layer, forming a third dielectric layer on the patterned second dielectric layer, the third dielectric layer filling the openings, and planarizing the third dielectric layer by using the patterned second dielectric layer as a stop layer, resulting in residual third dielectric in the openings that includes a first portion in the substrate and a second portion above the surface of the substrate.
    • 在平坦化工艺中保护对准标记免受损伤的方法包括提供包括表面的衬底,从表面在衬底中形成沟槽,在衬底上形成第一介电层,在第一介电层上形成第二介电层,形成 图案化的第二介电层,通过在沟槽上去除第二电介质,导致由沟槽和图案化的第二介电层限定的开口,在图案化的第二介电层上形成第三电介质层,填充开口的第三电介质层, 通过使用图案化的第二介电层作为阻挡层,在开口中产生残留的第三电介质,其包括衬底中的第一部分和衬底表面上的第二部分。
    • 8. 发明授权
    • Mask for controlling line end shortening and corner rounding arising from proximity effects
    • 用于控制线端缩短和由邻近效应产生的角圆角的面具
    • US07939225B2
    • 2011-05-10
    • US11971900
    • 2008-01-09
    • Chin-Cheng YangChiao-Wen YehChih-Haw Huang
    • Chin-Cheng YangChiao-Wen YehChih-Haw Huang
    • G03F1/00G03C5/00
    • G03F1/36Y10T428/24802
    • A mask for producing an image feature on an image surface during a semiconductor fabrication process is provided, the mask comprising a main feature having opaque areas and transmissive areas arranged in the form of the image feature, wherein each end of the main feature includes at least one of an opaque edge and a transmissive edge, wherein the opaque edge includes a set of transmissive assist features arranged therein such that the set of transmissive assist features align alternately with the transmissive areas of the main feature, and the transmissive edge includes a set of opaque assist features arranged therein such that the set of opaque assist features align alternately with the opaque areas of the main feature.
    • 提供了一种用于在半导体制造工艺期间在图像表面上产生图像特征的掩模,所述掩模包括具有以图像特征形式布置的不透明区域和透射区域的主要特征,其中主要特征的每个端部至少包括 不透明边缘和透射边缘之一,其中不透明边缘包括布置在其中的一组透射辅助特征,使得该组透射辅助特征与主要特征的透射区域交替地对准,并且透射边缘包括一组 不透明辅助特征被布置在其中,使得该组不透明辅助特征与主要特征的不透明区域交替地对准。