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    • 2. 发明授权
    • Position sensor and position sensing method
    • 位置传感器和位置检测方法
    • US07477051B2
    • 2009-01-13
    • US11480385
    • 2006-07-05
    • Celement Chiu Sing TseChi Keung TangKenny Chi Ken LeePeter On Bon ChanChun Ching LeeChi Pui Ho
    • Celement Chiu Sing TseChi Keung TangKenny Chi Ken LeePeter On Bon ChanChun Ching LeeChi Pui Ho
    • G01R11/02
    • G06F3/046G06F3/0362
    • A position sensor includes a first part having several electrically conductive elements, a second part having an electrical conductor, and holding device holding the first part and the second part together with the conductive elements and the conductor being spaced apart and permitting relative movement between the conductive elements and the conductor. Included is a signal generator for generating and supplying different electrical signals to one of the first part and the second part for reception in a contactless manner by the other of the first part and the second part with a magnitude that is dependent upon the relative position between the conductive elements and the conductor. There is also a signal detector connected to the other of the first part and the second part for differentiating the electrical signals received thereby to determine the relative position between the conductive elements and the conductor.
    • 位置传感器包括具有多个导电元件的第一部分,具有电导体的第二部分,以及将导电元件与导电元件保持在一起的第一部分和第二部分的保持装置,导体间隔开并允许导电 元素和导体。 包括一个信号发生器,用于产生和提供不同的电信号到第一部分和第二部分中的一个,用于以非接触方式接收第一部分和第二部分中的另一个,其大小取决于第一部分和第二部分之间的相对位置 导电元件和导体。 还存在连接到第一部分和第二部分中的另一个的信号检测器,用于区分由此接收的电信号,以确定导电元件和导体之间的相对位置。
    • 4. 发明申请
    • Position sensor and position sensing method
    • 位置传感器和位置检测方法
    • US20080007276A1
    • 2008-01-10
    • US11480385
    • 2006-07-05
    • Celement Chiu Sing TseChi Keung TangKenny Chi Ken LeePeter On Bon ChanChun Ching LeeChi Pui Ho
    • Celement Chiu Sing TseChi Keung TangKenny Chi Ken LeePeter On Bon ChanChun Ching LeeChi Pui Ho
    • G01R27/08
    • G06F3/046G06F3/0362
    • A position sensor comprises a first part having several electrically conductive elements, a second part having an electrical conductor, and holding means holding the first part and the second part together with the conductive elements and the conductor being spaced apart and permitting relative movement between the conductive elements and the conductor. Included is a signal generator for generating and supplying different electrical signals to one of the first part and the second part for reception in a contactless manner by the other of the first part and the second part with a magnitude that is dependent upon the relative position between the conductive elements and the conductor. There is also a signal detector connected to the other of the first part and the second part for differentiating the electrical signals received thereby to determine the relative position between the conductive elements and the conductor.
    • 位置传感器包括具有多个导电元件的第一部分,具有电导体的第二部分,以及将导电元件与导电元件保持在一起的第一部分和第二部分的保持装置,导体间隔开并允许导电 元素和导体。 包括一个信号发生器,用于产生和提供不同的电信号到第一部分和第二部分中的一个,用于以非接触方式接收第一部分和第二部分中的另一个,其大小取决于第一部分和第二部分之间的相对位置 导电元件和导体。 还存在连接到第一部分和第二部分中的另一个的信号检测器,用于区分由此接收的电信号,以确定导电元件和导体之间的相对位置。
    • 6. 发明授权
    • Multiple access simplex mode communication systems and methods therefor
    • 多路访问单工模式通信系统及其方法
    • US5982742A
    • 1999-11-09
    • US985857
    • 1997-12-05
    • Tai-che LeungKwok-viu LeungChi-keung TangMoun-lun TaiMing-lam Ng
    • Tai-che LeungKwok-viu LeungChi-keung TangMoun-lun TaiMing-lam Ng
    • H04B7/26H04J13/00H04J13/02H04L12/28H04J3/10
    • H04B7/2612
    • An asynchronous time-hopping multiple access "(ATHMA") protocol and a simplex mode communication system utilizing the same requires no synchronization between transmitting stations, no handshaking between transmitters and receivers and no system manager to coordinate data message transmission. The ATHMA protocol ensures that for an n-channel asynchronous simplex mode communication system, each transmitter repeatedly sends each unique data message n successive times according to its own time-hopping schedule. In the preferred embodiment the time-hopping schedules are coordinated such that at least one duplication of each unique message will not collide with any other messages over a given period. Thus, at most n-1 transmissions out of the total n transmissions of each unique data message will be collided and lost. The ATHMA protocol and communication system of the present invention is ideally suited for applications requiring a low throughput rate and channel capacity. The ATHMA protocol can be applied to various transmissions media such as radio, infrared optics and wired media with little or no modification.
    • 异步跳时多址“(ATHMA”)协议和使用该异步跳频多址通信系统的单工模式通信系统不需要发送站之间的同步,发射机和接收机之间没有握手,也没有系统管理员协调数据消息传输。 ATHMA协议确保对于n信道异步单工模式通信系统,每个发射机根据其自身的跳频计划重复地连续发送每个唯一的数据消息。 在优选实施例中,时间跳跃计划被协调,使得每个唯一消息的至少一个重复将不会在给定时间段内与任何其他消息冲突。 因此,在每个唯一数据消息的总共n个传输中,至多n-1个传输将被冲突和丢失。 本发明的ATHMA协议和通信系统理想地适用于需要低吞吐率和信道容量的应用。 ATHMA协议可以应用于各种传输介质,如无线电,红外光学和有线介质,很少或没有修改。
    • 7. 发明授权
    • Fabrication method for encapsulated micromachined structures
    • 封装微加工结构的制造方法
    • US6146917A
    • 2000-11-14
    • US810387
    • 1997-03-03
    • Xia ZhangDavid G. McIntyreWilliam Chi-Keung Tang
    • Xia ZhangDavid G. McIntyreWilliam Chi-Keung Tang
    • B81B3/00B81B7/00H01L29/82
    • B81C1/00333
    • A process for the preparation of hermetically sealed electronically active microstructures involves the preparation of a plurality of microstructures and associated conductive paths and lead bond areas on a single wafer such that areas surrounding the microstructures are maintained in a planar condition. A second wafer having a plurality of microstructure-receiving cavities is placed atop the first wafer and fusion or anodically bonded. The microstructures are preferably connected to lead bond pads which lie outside the surround, the second wafer also having bond pad accessing through-holes to facilitate bonding electrical leads to the devices after sawing from the wafer. The lead-connected devices may be further encapsulated by injection molding, potting, or other conventional encapsulative packaging techniques.
    • 用于制备密封电子活性微结构的方法涉及在单个晶片上制备多个微结构和相关联的导电路径和引线接合区域,使得围绕微结构的区域保持在平坦状态。 将具有多个微结构接收腔的第二晶片放置在第一晶片顶部并进行熔融或阳极结合。 微结构优选地连接到位于环绕的外部的引线接合焊盘,第二晶片还具有接合焊盘进入通孔,以便于在从晶片锯切之后将电引线连接到器件。 引线连接的器件可以通过注塑,封装或其它常规的封装封装技术进一步封装。