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1. 发明申请

US20120202598A1 WEBSITE CONSTRUCTION FOR COMBINING ACTIVITIES IN VIRTUAL NETWORK WORLD WITH ACTIVITIES REAL WORLD AND THE METHOD FOR PERFORMING THE SAME 审中-公开
标题翻译：虚拟网络世界与活动组合活动的网站建设实际世界及其执行方法
公开(公告)号：US20120202598A1
公开(公告)日：2012-08-09
申请号：US13023552
申请日：2011-02-09
申请人： Chi-Chuen Lo
发明人： Chi-Chuen Lo
IPC分类号： A63F9/24
CPC分类号： G06Q10/00 , H04L67/38
摘要： A website construction combining a virtual network world with real world includes a network station including a main server, a memory, and a communication network; a plurality of databases, at least one play and software being stored in the memory; a play database, a gamer database and a business provider database being stored in the memory; at least one gamer I/O unit being connected to the main server for registration and data communication; at least one business I/O unit being connected to the main server for registration and data communication; at least one business provider connected to the main server through the business I/O unit for registering a profile of the business provider to the business provider database; the main serves further comprising: a classifier; a role assigning unit; a play control unit; and a business communication unit.
摘要翻译：将虚拟网络世界与现实世界相结合的网站构造包括：包括主服务器，存储器和通信网络的网络站; 多个数据库，至少一个播放和软件被存储在存储器中; 存储在存储器中的播放数据库，玩家数据库和商业提供者数据库; 至少一个玩家I / O单元连接到主服务器用于注册和数据通信; 至少一个业务I / O单元连接到主服务器用于注册和数据通信; 至少一个业务提供商通过业务I / O单元连接到主服务器，用于向业务提供商数据库注册业务提供者的简档; 主要服务还包括：分类器; 角色分配单位; 播放控制单元; 和商业通信单元。

2. 发明授权

US08604603B2 Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers 有权
标题翻译：具有通过插入器通过硅的热增强和具有成本效益的3D IC集成结构的装置
公开(公告)号：US08604603B2
公开(公告)日：2013-12-10
申请号：US12709291
申请日：2010-02-19
申请人： Hon Shing Lau , Shi-Wei Lee , Matthew Ming Fai Yuen , Jingshen Wu , Chi Chuen Lo , Haibo Fan , Haibin Chen
发明人： Hon Shing Lau , Shi-Wei Lee , Matthew Ming Fai Yuen , Jingshen Wu , Chi Chuen Lo , Haibo Fan , Haibin Chen
IPC分类号： H01L29/72
CPC分类号： H01L23/5384 , H01L23/055 , H01L23/433 , H01L23/5385 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/18 , H01L2224/16225 , H01L2224/32 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48235 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06548 , H01L2225/06572 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/10253 , H01L2924/14 , H01L2924/1432 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/1461 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19106 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An apparatus having a three-dimensional integrated circuit structure is described herein. The apparatus include an interposer for carrying a plurality of high and low-power chips. The high-power chips are attached and connected to one side of the interposer, while the low-power chips are attached and connected to the other side of the interposer. In generally, the high-power chips produce more heat than does the low-power chip during their operations. The interposer further include through silicon vias and redistribution layers for connecting the chips on both surfaces. In addition, the interposer assembly is attached and connected to a substrate layer, which is in turn attached and connected to a printed circuit board. In order to provide improve thermal management, the interposer surface carrying the high-power chips are oriented away from the circuit board. A heat spreader is attached to the back sides of the high-power chips for dissipating the heat.
摘要翻译：本文描述了具有三维集成电路结构的装置。该装置包括用于承载多个高功率和低功率芯片的插入器。高功率芯片被连接并连接到插入器的一侧，而低功率芯片被附接并连接到插入器的另一侧。一般来说，高功率芯片在运行时产生比低功率芯片更多的热量。插入器还包括通过硅通孔和用于连接两个表面上的芯片的再分配层。此外，插入器组件附接并连接到衬底层，衬底层又连接并连接到印刷电路板。为了提供改进的热管理，承载大功率芯片的插入器表面远离电路板。散热器附着在大功率芯片的背面以散热。

3. 发明申请

US20100213600A1 Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers 有权
标题翻译：具有通过插入器通过硅的热增强和具有成本效益的3D IC集成结构的装置
公开(公告)号：US20100213600A1
公开(公告)日：2010-08-26
申请号：US12709291
申请日：2010-02-19
申请人： Hon Shing Lau , Shi-Wei Lee , Matthew Ming Fai Yuen , Jingshen Wu , Chi Chuen Lo , Haibo Fan , Haibin Chen
发明人： Hon Shing Lau , Shi-Wei Lee , Matthew Ming Fai Yuen , Jingshen Wu , Chi Chuen Lo , Haibo Fan , Haibin Chen
IPC分类号： H01L23/34 , H01L21/60 , H01L23/498
CPC分类号： H01L23/5384 , H01L23/055 , H01L23/433 , H01L23/5385 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/18 , H01L2224/16225 , H01L2224/32 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/48235 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06548 , H01L2225/06572 , H01L2225/06589 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/10253 , H01L2924/14 , H01L2924/1432 , H01L2924/1433 , H01L2924/14335 , H01L2924/1434 , H01L2924/1436 , H01L2924/1437 , H01L2924/1461 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19106 , H01L2924/00 , H01L2224/0401 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An apparatus having a three-dimensional integrated circuit structure is described herein. The apparatus include an interposer for carrying a plurality of high and low-power chips. The high-power chips are attached and connected to one side of the interposer, while the low-power chips are attached and connected to the other side of the interposer. In generally, the high-power chips produce more heat than does the low-power chip during their operations. The interposer further include through silicon vias and redistribution layers for connecting the chips on both surfaces. In addition, the interposer assembly is attached and connected to a substrate layer, which is in turn attached and connected to a printed circuit board. In order to provide improve thermal management, the interposer surface carrying the high-power chips are oriented away from the circuit board. A heat spreader is attached to the back sides of the high-power chips for dissipating the heat.
摘要翻译：本文描述了具有三维集成电路结构的装置。该装置包括用于承载多个高功率和低功率芯片的插入器。高功率芯片被连接并连接到插入器的一侧，而低功率芯片被附接并连接到插入器的另一侧。一般来说，高功率芯片在运行时产生比低功率芯片更多的热量。插入器还包括通过硅通孔和用于连接两个表面上的芯片的再分配层。此外，插入器组件附接并连接到衬底层，衬底层又连接并连接到印刷电路板。为了提供改进的热管理，承载大功率芯片的插入器表面远离电路板。散热器附着在大功率芯片的背面以散热。

4. 发明申请

US20100215314A1 Apparatus Having an Embedded 3D Hybrid Integration for Optoelectronic Interconnects 有权
标题翻译：具有用于光电互连的嵌入式3D混合集成的装置
公开(公告)号：US20100215314A1
公开(公告)日：2010-08-26
申请号：US12709279
申请日：2010-02-19
申请人： Hon Shing Lau , Shi-Wei Lee , Matthew Ming Fai Yuen , Jingshen Wu , Chi Chuen Lo , Haibo Fan , Haibin Chen
发明人： Hon Shing Lau , Shi-Wei Lee , Matthew Ming Fai Yuen , Jingshen Wu , Chi Chuen Lo , Haibo Fan , Haibin Chen
IPC分类号： G02B6/12 , G02B6/42
CPC分类号： G02B6/43 , G02B6/4214 , H05K1/0274 , H05K2201/10121
摘要： An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.
摘要翻译：本文描述了一种光电子器件，包括发射器，接收器和光波导，所有这些都嵌入在PCB中。发射机包括激光发生器和用于产生电信号和光信号的其它电路，其通过波导传输到接收器。接收器包括用于检测和将光信号转换成电信号的电路和检测器。发射器和接收器的电路和光学部件集成在3D混合芯片组中，其中芯片组件以3D结构堆叠。由于所有电路和光学元件均嵌入在PCB中，因此该设备非常紧凑，适用于便携式产品。

5. 发明授权

US09057853B2 Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects 有权
标题翻译：具有用于光电互连的嵌入式3D混合集成的装置
公开(公告)号：US09057853B2
公开(公告)日：2015-06-16
申请号：US12709279
申请日：2010-02-19
申请人： Hon Shing Lau , Shi-Wei Lee , Matthew Ming Fai Yuen , Jingshen Wu , Chi Chuen Lo , Haibo Fan , Haibin Chen
发明人： Hon Shing Lau , Shi-Wei Lee , Matthew Ming Fai Yuen , Jingshen Wu , Chi Chuen Lo , Haibo Fan , Haibin Chen
IPC分类号： G02B6/43 , H05K1/02 , G02B6/42
CPC分类号： G02B6/43 , G02B6/4214 , H05K1/0274 , H05K2201/10121
摘要： An optoelectronic apparatus is described herein, including a transmitter, a receiver, and an optical waveguide, all of which are embedded in a PCB. The transmitter includes a laser generator and other circuits for generating electrical and optical signals, which are transmitted through the waveguide to the receiver. The receiver includes circuits and detectors for detecting and converting the optical signals to electrical signals. The circuit and optical components of the transmitter and receiver are integrated in 3D hybrid chip sets where the chip components are stacked in a 3D structure. Because all of the circuit and optical components are embedded in the PCB, the apparatus is made very compact and suitable for implementation in portable products.
摘要翻译：这里描述了一种光电子器件，包括发射器，接收器和光波导，它们都嵌入在PCB中。发射机包括激光发生器和用于产生电信号和光信号的其它电路，其通过波导传输到接收器。接收器包括用于检测和将光信号转换成电信号的电路和检测器。发射器和接收器的电路和光学部件集成在3D混合芯片组中，其中芯片组件以3D结构堆叠。由于所有电路和光学元件均嵌入在PCB中，因此该设备非常紧凑，适用于便携式产品。

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