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1. 发明授权

US07679382B2 Stepped PCB for probe card, probe card having the same and method for clamping the probe card 失效
标题翻译：用于探针卡的步进PCB，探针卡具有相同的夹持探针卡的方法
公开(公告)号：US07679382B2
公开(公告)日：2010-03-16
申请号：US11512368
申请日：2006-08-30
申请人： Fu-Chin Lu , Chi-Chong Chien
发明人： Fu-Chin Lu , Chi-Chong Chien
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , H05K1/117
摘要： A stepped printed circuit board for a probe card and for clamping by a testing machine is disclosed. The stepped printed circuit board includes a main body and a protruding body. The main body has a conductive circuit pattern arranged therein and a border area for the clamping of the testing machine. The protruding body is joined to a bottom side of the main body beyond the border area and defines with the bottom side of the main body an elevational difference. The protruding body has a conductive circuit pattern arranged therein and electrically connected to the conductive circuit pattern of the main body.
摘要翻译：公开了一种用于探针卡并用于由测试机夹紧的阶梯式印刷电路板。台阶印刷电路板包括主体和突出体。主体具有布置在其中的导电电路图案和用于夹紧测试机器的边界区域。突出体连接到主体的底部超出边界区域，并且与主体的底侧形成高度差。突出体具有布置在其中并与主体的导电电路图案电连接的导电电路图案。

2. 发明申请

US20070090847A1 Stepped PCB for probe card, probe card having the same and method for clamping the probe card 失效
标题翻译：用于探针卡的步进PCB，探针卡具有相同的夹持探针卡的方法
公开(公告)号：US20070090847A1
公开(公告)日：2007-04-26
申请号：US11512368
申请日：2006-08-30
申请人： Fu-Chin Lu , Chi-Chong Chien
发明人： Fu-Chin Lu , Chi-Chong Chien
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , H05K1/117
摘要： A stepped printed circuit board for a probe card and for clamping by a testing machine is disclosed. The stepped printed circuit board includes a main body and a protruding body. The main body has a conductive circuit pattern arranged therein and a border area for the clamping of the testing machine. The protruding body is joined to a bottom side of the main body beyond the border area and defines with the bottom side of the main body an elevational difference. The protruding body has a conductive circuit pattern arranged therein and electrically connected to the conductive circuit pattern of the main body.
摘要翻译：公开了一种用于探针卡并用于由测试机夹紧的阶梯式印刷电路板。台阶印刷电路板包括主体和突出体。主体具有布置在其中的导电电路图案和用于夹紧测试机器的边界区域。突出体连接到主体的底部超出边界区域，并且与主体的底侧形成高度差。突出体具有布置在其中并与主体的导电电路图案电连接的导电电路图案。

3. 发明授权

US07007252B2 Method and apparatus for characterizing the propagation of noise through a cell in an integrated circuit 有权
标题翻译：用于表征通过集成电路中的单元的噪声传播的方法和装置
公开(公告)号：US07007252B2
公开(公告)日：2006-02-28
申请号：US10410903
申请日：2003-04-09
申请人： Alexander Gyure , Jindrich Zejda , Peivand Fallah-Tehrani , Wenyuan Wang , Chi-Chong Lo , Mahmoud Shahram , Yansheng Luo , William Chiu-Ting Shu , Seyed Alireza Kasnavi
发明人： Alexander Gyure , Jindrich Zejda , Peivand Fallah-Tehrani , Wenyuan Wang , Chi-Chong Lo , Mahmoud Shahram , Yansheng Luo , William Chiu-Ting Shu , Seyed Alireza Kasnavi
IPC分类号： G06F17/50 , G06F19/00 , G01R31/28 , G01R27/28 , G01R29/00
CPC分类号： G06F17/5036
摘要： One embodiment of the invention provides a system that characterizes cells within an integrated circuit. During operation, the system obtains a number of input noise signals to be applied to the cell. The system then simulates responses of the cell to each of the input noise signals, and stores a representation of the responses. This allows a subsequent analysis operation to access the stored representation to determine a response of the cell instead of having to perform a time-consuming simulation operation.
摘要翻译：本发明的一个实施例提供了表征集成电路内的单元的系统。在操作期间，系统获得要应用于单元的多个输入噪声信号。然后，系统模拟单元对每个输入噪声信号的响应，并存储响应的表示。这允许随后的分析操作访问存储的表示以确定单元的响应，而不必执行耗时的模拟操作。

4. 发明申请

US20050034577A1 Apparatus and method for indexing and severing film 审中-公开
标题翻译：用于分选和切断胶片的设备和方法
公开(公告)号：US20050034577A1
公开(公告)日：2005-02-17
申请号：US10642835
申请日：2003-08-14
申请人： Yuk Au , Siu Lau , Yiu Cheung , Chi Chong , Wan Lo
发明人： Yuk Au , Siu Lau , Yiu Cheung , Chi Chong , Wan Lo
IPC分类号： B65H7/02 , B65H20/18 , B65H35/06 , H01L21/00 , H01L21/50 , H01L23/50 , B26D1/00 , B26D7/06
CPC分类号： H01L21/67144 , H01L21/67132 , Y10T83/04 , Y10T83/207
摘要： The invention provides an apparatus and method for indexing a length of film for severance. The apparatus comprises a linear feeding device operative to hold the film and to feed a predetermined amount of film to a trimming device by moving linearly between an initial position and another position towards the trimming device. A film holder located between the linear feeding device and the trimming device is operable between a first position wherein a gap is provided for the film to pass through during feeding to the trimming device, and a second position for clamping the film when severing the film with the trimming device.
摘要翻译：本发明提供一种用于分离胶片长度的分离装置和方法。该装置包括线性进给装置，其可操作地保持胶片，并通过在初始位置和另一位置之间线性地移动至修剪装置，将预定量的胶片馈送到修剪装置。位于线性进给装置和修剪装置之间的胶片保持器可在第一位置和第二位置之间操作，在第一位置和第二位置之间，该第一位置在胶片进给到修剪装置期间通过，修剪装置。

5. 发明申请

US20060175377A1 CAPILLARY HOLDER 有权
标题翻译：毛巾架
公开(公告)号：US20060175377A1
公开(公告)日：2006-08-10
申请号：US11052551
申请日：2005-02-07
申请人： Bao Zhai , Ka Kwan , Man Chan , Chi Chong , Yam Wong , Hing Li
发明人： Bao Zhai , Ka Kwan , Man Chan , Chi Chong , Yam Wong , Hing Li
IPC分类号： B23K37/00
CPC分类号： H01L24/85 , B23K20/005 , B23K20/10 , H01L24/45 , H01L24/78 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/78301 , H01L2224/78302 , H01L2224/78308 , H01L2224/85205 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2224/48 , H01L2924/00 , H01L2924/00015
摘要： A capillary holder for mounting a capillary onto a horn is provided that comprises a mounting hole formed in the horn that has a first width along a first axis that is smaller than a width of the capillary and a second width along a second axis perpendicular to the first axis that is larger than the width of the capillary. In particular, the mounting hole is configured such that application of a flexion force to reduce the second width simultaneously expands the first width so as to fit the capillary when the first width is larger than the width of the capillary, and removal of said flexion force contracts the first width whereby to grip the capillary using an elastic force of the horn.
摘要翻译：提供了一种用于将毛细管安装在喇叭上的毛细管支架，其包括形成在喇叭中的安装孔，沿着第一轴线具有小于毛细管宽度的第一宽度，以及沿垂直于毛细管的第二轴线的第二宽度第一轴比毛细管的宽度大。特别地，安装孔被构造成使得施加屈曲力以减小第二宽度同时地扩大第一宽度，以便当第一宽度大于毛细管的宽度时适合毛细管，并且去除所述弯曲力收缩第一宽度，从而使用喇叭的弹力来夹紧毛细管。

6. 发明申请

US20070199972A1 Transducer assembly for a bonding apparatus 有权
标题翻译：用于粘合装置的传感器组件
公开(公告)号：US20070199972A1
公开(公告)日：2007-08-30
申请号：US11363763
申请日：2006-02-28
申请人： Chi Chong , Hing Li , Wing Lam
发明人： Chi Chong , Hing Li , Wing Lam
IPC分类号： B23K1/06 , B32B37/00
CPC分类号： B06B3/00 , B23K20/10 , H01L24/75
摘要： A transducer assembly for a bonding apparatus is provided that comprises a horn having first and second base ends and a bonding tool attached to the horn between the first and second base ends. First and second ultrasonic generators are secured to the first and second base ends respectively. A first fastening mechanism is located on the horn between the bonding tool and the first ultrasonic generator and a second fastening mechanism is located on the horn between the bonding tool and the second ultrasonic generator such that the horn is releasably attachable to a mounting interface using the first and second fastening mechanisms. There are also transducer mounting positions disposed on the mounting interface for mounting the mounting interface to a bond head.
摘要翻译：提供了一种用于粘合装置的传感器组件，其包括具有第一和第二基端的喇叭和在第一和第二基端之间附接到喇叭的接合工具。第一和第二超声波发生器分别固定到第一和第二基端。第一紧固机构位于接合工具和第一超声波发生器之间的喇叭上，并且第二紧固机构位于接合工具和第二超声波发生器之间的喇叭上，使得喇叭可释放地附接到安装界面，使用第一和第二紧固机构。传感器安装位置也安装在安装界面上，用于将安装界面安装到粘结头。

7. 发明授权

US07263676B2 Method and apparatus for detecting and analyzing the propagation of noise through an integrated circuit 有权
标题翻译：通过集成电路检测和分析噪声传播的方法和装置
公开(公告)号：US07263676B2
公开(公告)日：2007-08-28
申请号：US10410919
申请日：2003-04-09
申请人： Alexander Gyure , Jindrich Zejda , Peivand Fallah-Tehrani , Wenyuan Wang , Chi-Chong Lo , Seyed Alireza Kasnavi , Mahmoud Shahram , Yansheng Luo , William Chiu-Ting Shu
发明人： Alexander Gyure , Jindrich Zejda , Peivand Fallah-Tehrani , Wenyuan Wang , Chi-Chong Lo , Seyed Alireza Kasnavi , Mahmoud Shahram , Yansheng Luo , William Chiu-Ting Shu
IPC分类号： G06F17/50 , G06F9/45
CPC分类号： G06F17/5036
摘要： One embodiment of the invention provides a system that analyzes the propagation of noise through an integrated circuit. During operation, the system obtains an input noise signal to be applied to a cell within the integrated circuit. The system then looks up parameters specifying how noise affects the cell, and then uses the parameters to determine how the input noise signal affects the cell. This can involve determining if the input noise signal will cause the cell to fail and/or determining a propagated noise signal that emanates from the cell.
摘要翻译：本发明的一个实施例提供了一种通过集成电路分析噪声传播的系统。在操作期间，系统获得要施加到集成电路内的单元的输入噪声信号。然后，系统查找指定噪声如何影响单元格的参数，然后使用参数来确定输入噪声信号如何影响单元。这可以涉及确定输入噪声信号是否会导致小区故障和/或确定从小区发出的传播噪声信号。

8. 发明申请

US20050255673A1 Apparatus and method for semicondutor chip detachment 有权
标题翻译：半导体芯片拆卸的装置和方法
公开(公告)号：US20050255673A1
公开(公告)日：2005-11-17
申请号：US10843826
申请日：2004-05-11
申请人： Yiu Cheung , Chou Liu , Ching Yiu , Chi Chong
发明人： Yiu Cheung , Chou Liu , Ching Yiu , Chi Chong
IPC分类号： H01L21/67 , H01L21/00 , H01L21/301 , H01L21/52 , H01L21/78
CPC分类号： H01L21/6838 , H01L21/67132 , H01L21/67144 , H01L2221/68322 , Y10S156/943 , Y10T29/4913 , Y10T29/49815 , Y10T29/53091 , Y10T29/53191 , Y10T29/53274 , Y10T156/1978 , Y10T156/1983
摘要： An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved.
摘要翻译：提供一种用于将半导体芯片从其上安装有的胶带分离的装置和方法。该装置包括适于在芯片的位置处接触粘合带的平台和联接到平台的保持力发生器，用于沿远离芯片的方向拉伸胶带。升降装置可从平台投射，该平台可横向跨越平台的表面并相对于平台垂直地移动以升高芯片。通过在提升芯片的同时将升降装置移动跨越芯片的宽度，可以实现芯片的控制提升和芯片与胶带之间的分层传播。

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