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1. 发明授权

US07763959B2 Heat slug for package structure 有权
标题翻译：散热片用于封装结构
公开(公告)号：US07763959B2
公开(公告)日：2010-07-27
申请号：US11834863
申请日：2007-08-07
申请人： Cheng-cheng Liu , Jun-cheng Liu , Hsin-hao Chen , Chi-ming Chen
发明人： Cheng-cheng Liu , Jun-cheng Liu , Hsin-hao Chen , Chi-ming Chen
IPC分类号： H01L23/495 , H01L23/34
CPC分类号： H01L23/4334 , H01L23/3142 , H01L2224/48247
摘要： A heat slug is provided for a package structure, including a main body and a plurality of protrusions. The main body has a surface in which at least one ditch is defined. Each protrusion is connected to and extends from the main body and has a surface in which a plurality of dimples is defined.
摘要翻译：针对包括主体和多个突起的包装结构提供热塞。主体具有限定了至少一个沟的表面。每个突起连接到主体并从主体延伸并具有限定多个凹坑的表面。

2. 发明授权

US07081678B2 Multi-chip package combining wire-bonding and flip-chip configuration 有权
标题翻译：多芯片封装组合引线键合和倒装芯片配置
公开(公告)号：US07081678B2
公开(公告)日：2006-07-25
申请号：US10781876
申请日：2004-02-20
申请人： Cheng-Cheng Liu
发明人： Cheng-Cheng Liu
IPC分类号： H01L23/48
CPC分类号： H01L23/3121 , H01L24/48 , H01L25/0655 , H01L2224/05599 , H01L2224/16225 , H01L2224/16227 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/85399 , H01L2924/00014 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2224/45015 , H01L2924/207 , H01L2924/00 , H01L2924/00012
摘要： A multi-chip package combining wire-bonding and flip-chip configuration includes a plurality of chips, a substrate and a molding compound. Chip(s) with wire-bonding type and a flip-chip type electrical device are mounted on an upper surface of the substrate. A plurality of contact pads of the substrate are formed on the upper surface of the substrate that are not covered by the molding compound, so the flip-chip type electrical device can be electrically connected to these contact pads. The molding compound has recession(s) from a molding tool and seals the chip(s) with wire-bonding type without damaging the contact pads during molding process.
摘要翻译：组合引线键合和倒装芯片配置的多芯片封装包括多个芯片，基板和模塑料。具有引线接合型芯片和倒装芯片型电气装置安装在基板的上表面上。在基板的上表面上形成多个基板的接触焊盘，未被模塑料覆盖，因此倒装芯片型电气装置可以电连接到这些接触焊盘。模塑料具有来自模制工具的凹陷，并且在引线接合型下密封芯片，而不会在模制过程中损坏接触垫。

3. 发明申请

US20060103021A1 BGA package having substrate with exhaust hole 审中-公开
标题翻译： BGA封装具有带排气孔的基板
公开(公告)号：US20060103021A1
公开(公告)日：2006-05-18
申请号：US11272740
申请日：2005-11-15
申请人： Cheng-Cheng Liu , Yu-Lung Wen , Shi-Yuan Fu
发明人： Cheng-Cheng Liu , Yu-Lung Wen , Shi-Yuan Fu
IPC分类号： H01L23/48
CPC分类号： H01L23/3128 , H01L21/565 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/10162 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a BGA package having a substrate with an exhaust hole. The BGA package comprises the substrate, a chip and a molding compound. The substrate comprises a plurality of plated through holes electrically connecting an upper surface and a lower surface of the substrate. At least one of the plated through holes located at a predetermined location of the substrate is selected to be formed as an exhaust hole. The exhaust hole passes through the upper surface and the lower surface. When the molding compound is formed to seal the chip, the air inside a mold cavity can be exhausted through the exhaust hole in the selected plated through hole.
摘要翻译：本发明涉及具有排气孔的基板的BGA封装。 BGA封装包括基板，芯片和模塑料。基板包括电连接基板的上表面和下表面的多个电镀通孔。选择位于基板的预定位置的电镀通孔中的至少一个形成为排气孔。排气孔穿过上表面和下表面。当形成模塑料以密封芯片时，模腔内的空气可以通过所选电镀通孔中的排气孔排出。

4. 发明授权

US08800638B2 Heatsink and heatsink-positioning system 有权
标题翻译：散热器和散热器定位系统
公开(公告)号：US08800638B2
公开(公告)日：2014-08-12
申请号：US11514878
申请日：2006-09-05
申请人： Jun-Cheng Liu , Cheng-Cheng Liu
发明人： Jun-Cheng Liu , Cheng-Cheng Liu
IPC分类号： F28F7/00
CPC分类号： H01L23/3672 , F28D2021/0029 , H01L23/04 , H01L23/3675 , H01L2924/0002 , H01L2924/00
摘要： A heatsink and a heatsink-positioning system. The heatsink-positioning system includes a heatsink and a positioning device. The heatsink includes a circular top, a ring-shaped sidewall and a plurality of foot portions. The ring-shaped sidewall connects to the circular top and extends away from the circular top. The ring-shaped sidewall has at least one first positioning portion used for fixing the heatsink. The foot portions connect to the ring-shaped sidewall and extend away from the ring-shaped sidewall. Each foot portion has an opening. The positioning device has at least one second positioning portion corresponding to the first positioning portion and is used for fixing the first positioning portion. By utilizing the heatsink-positioning system, the problem of displacement of the heatsink can be improved.
摘要翻译：散热器和散热器定位系统。散热器定位系统包括散热器和定位装置。散热器包括圆形顶部，环形侧壁和多个脚部。环形侧壁连接到圆形顶部并远离圆形顶部延伸。环形侧壁具有用于固定散热器的至少一个第一定位部分。脚部连接到环形侧壁并远离环形侧壁延伸。每个脚部都有一个开口。定位装置具有与第一定位部对应的至少一个第二定位部，并且用于固定第一定位部。通过利用散热器定位系统，可以提高散热器的位移问题。

5. 发明申请

US20070240848A1 Heatsink and heatsink-positioning system 有权
标题翻译：散热器和散热器定位系统
公开(公告)号：US20070240848A1
公开(公告)日：2007-10-18
申请号：US11514878
申请日：2006-09-05
申请人： Jun-Cheng Liu , Cheng-Cheng Liu
发明人： Jun-Cheng Liu , Cheng-Cheng Liu
IPC分类号： F28F9/00 , F28F7/00
CPC分类号： H01L23/3672 , F28D2021/0029 , H01L23/04 , H01L23/3675 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to a heatsink and a heatsink-positioning system. The heatsink-positioning system comprises a heatsink and a positioning device. The heatsink comprises a circular top, a ring-shaped sidewall and a plurality of foot portions. The ring-shaped sidewall connects to the circular top and extends away from the circular top. The ring-shaped sidewall has at least one first positioning portion used for fixing the heatsink. The foot portions connect to the ring-shaped sidewall and extend away from the ring-shaped sidewall. Each foot portion has an opening. The positioning device has at least one second positioning portion corresponding to the first positioning portion and is used for fixing the first positioning portion. By utilizing the heatsink-positioning system of the invention, the problem of displacement of the heatsink can be improved.
摘要翻译：本发明涉及一种散热器和散热器定位系统。散热器定位系统包括散热器和定位装置。散热器包括圆形顶部，环形侧壁和多个脚部。环形侧壁连接到圆形顶部并远离圆形顶部延伸。环形侧壁具有用于固定散热器的至少一个第一定位部分。脚部连接到环形侧壁并远离环形侧壁延伸。每个脚部都有一个开口。定位装置具有与第一定位部对应的至少一个第二定位部，并且用于固定第一定位部。通过利用本发明的散热器定位系统，可以提高散热器的位移问题。

6. 发明申请

US20080048304A1 HEAT SLUG FOR PACKAGE STRUCTURE 有权
标题翻译：用于包装结构的加热片
公开(公告)号：US20080048304A1
公开(公告)日：2008-02-28
申请号：US11834863
申请日：2007-08-07
申请人： Cheng-cheng Liu , Jun-cheng Liu , Hsin-hao Chen , Chi-ming Chen
发明人： Cheng-cheng Liu , Jun-cheng Liu , Hsin-hao Chen , Chi-ming Chen
IPC分类号： H01L23/495 , H01L23/34
CPC分类号： H01L23/4334 , H01L23/3142 , H01L2224/48247
摘要： A heat slug is provided for a package structure, including a main body and a plurality of protrusions. The main body has a surface in which at least one ditch is defined. Each protrusion is connected to and extends from the main body and has a surface in which a plurality of dimples is defined.
摘要翻译：针对包括主体和多个突起的包装结构提供热塞。主体具有限定了至少一个沟的表面。每个突起连接到主体并从主体延伸并具有限定多个凹坑的表面。

7. 发明授权

US06816030B2 Impedance matching circuit for rejecting an image signal via a microstrip structure 失效
标题翻译：用于通过微带结构拒绝图像信号的阻抗匹配电路
公开(公告)号：US06816030B2
公开(公告)日：2004-11-09
申请号：US10065290
申请日：2002-10-01
申请人： Sheng-Fuh Chang , Jia-Liang Chen , Cheng-Cheng Liu
发明人： Sheng-Fuh Chang , Jia-Liang Chen , Cheng-Cheng Liu
IPC分类号： H01P1203
CPC分类号： H01P5/02
摘要： An impedance matching circuit for providing a lossless target signal transmission and rejecting image signals of heterodyne and super-heterodyne transceiver. The impedance matching circuit includes a grounded metal membrane, a first microstrip line connected with an input circuit, a second microstrip line connected with an output circuit, and a third microstrip line connected with either the first microstrip line or the second microstrip line. The first microstrip line is not connected with the second microstrip line, and the length of the third microstrip line is equal to a quarter wavelength of an image signal. When the target signal and the image signal transmit to the impedance matching circuit, the image signal will bypass to a grounded metal membrane, and the target signal will transmit to the output circuit without signal decay through electromagnetic coupling of the first microstrip line and the second microstrip line.

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