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    • 1. 发明申请
    • Erase Operation With Controlled Select Gate Voltage For 3D Non-Volatile Memory
    • 通过控制选择栅极电压擦除操作,用于3D非易失性存储器
    • US20130163336A1
    • 2013-06-27
    • US13332844
    • 2011-12-21
    • Haibo LiXiying CostaChenfeng Zhang
    • Haibo LiXiying CostaChenfeng Zhang
    • G11C16/04
    • G11C16/16G11C16/0483G11C16/344
    • An erase process for a 3D stacked memory device controls a drain-side select gate (SGD) and a source-side select gate (SGS) of a NAND string. In one approach, SGD and SGS are driven to provide a predictable drain-to-gate voltage across the select gates while an erase voltage is applied to a bit line or source line. A more consistent gate-induced drain leakage (GIDL) at the select gates can be generated to charge up the body of the NAND string. Further, the select gate voltage can be stepped up with the erase voltage to avoid an excessive drain-to-gate voltage across the select gates which causes degradation. The step up in the select gate voltage can begin with the first erase-verify iteration of an erase operation, or at a predetermined or adaptively determined erase-verify iteration, such as based on a number of program-erase cycles.
    • 用于3D堆叠存储器件的擦除处理控制NAND串的漏极侧选择栅极(SGD)和源极选择栅极(SGS)。 在一种方法中,驱动SGD和SGS以在选择栅极上提供可预测的漏极到栅极电压,同时将擦除电压施加到位线或源极线。 可以产生在选择栅极处更一致的栅极引起的漏极漏极(GIDL),以对NAND串的体进行充电。 此外,可以用擦除电压来升高选择栅极电压,以避免导致退化的选择栅极之间的过多的漏极 - 栅极电压。 选择栅极电压的升高可以从擦除操作的第一次擦除验证迭代开始,或者以预定或自适应确定的擦除验证迭代(例如基于编程擦除周期的数量)开始。