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1. 发明授权

US08497151B2 Photovoltaic device 有权
标题翻译：光伏装置
公开(公告)号：US08497151B2
公开(公告)日：2013-07-30
申请号：US12709858
申请日：2010-02-22
申请人： Gang Xiong , Ricky C. Powell , Aaron Roggelin , Kuntal Kumar , Arnold Allenic , Kenneth M. Ring , Charles Wickersham
发明人： Gang Xiong , Ricky C. Powell , Aaron Roggelin , Kuntal Kumar , Arnold Allenic , Kenneth M. Ring , Charles Wickersham
IPC分类号： H01L21/00
CPC分类号： H01L31/02963 , H01L31/073 , Y02E10/543 , Y02P70/521
摘要： A method to improve CdTe-based photovoltaic device efficiency is disclosed. The CdTe-based photovoltaic device can include oxygen or silicon in semiconductor layers.
摘要翻译：公开了一种改善CdTe基光伏器件效率的方法。 CdTe基光伏器件可以包括半导体层中的氧或硅。

2. 发明申请

US20100288359A1 Photovoltaic Device 有权
标题翻译：光伏器件
公开(公告)号：US20100288359A1
公开(公告)日：2010-11-18
申请号：US12709858
申请日：2010-02-22
申请人： Gang Xiong , Ricky C. Powell , Aaron Roggelin , Kuntal Kumar , Arnold Allenic , Kenneth M. Ring , Charles Wickersham
发明人： Gang Xiong , Ricky C. Powell , Aaron Roggelin , Kuntal Kumar , Arnold Allenic , Kenneth M. Ring , Charles Wickersham
IPC分类号： H01L31/00 , H01L31/0264 , H01L31/0352
CPC分类号： H01L31/02963 , H01L31/073 , Y02E10/543 , Y02P70/521
摘要： A method to improve CdTe-based photovoltaic device efficiency is disclosed. The CdTe-based photovoltaic device can include oxygen or silicon in semiconductor layers.
摘要翻译：公开了一种改善CdTe基光伏器件效率的方法。 CdTe基光伏器件可以包括半导体层中的氧或硅。

3. 发明申请

US20050247386A1 Sputter targets and methods of forming same by rotary axial forging 有权
标题翻译：溅射靶和通过旋转轴向锻造成型的方法
公开(公告)号：US20050247386A1
公开(公告)日：2005-11-10
申请号：US11121440
申请日：2005-05-04
申请人： John Matera , Robert Ford , Charles Wickersham
发明人： John Matera , Robert Ford , Charles Wickersham
IPC分类号： C22C14/00 , C22C16/00 , C22C27/02 , C22F1/16 , C22F1/18 , C23C14/34
CPC分类号： C22C5/06 , C22C5/02 , C22C9/00 , C22C14/00 , C22C16/00 , C22C19/07 , C22C21/00 , C22C27/00 , C22F1/16 , C22F1/18 , C23C14/3414
摘要： A method of making sputter targets using rotary axial forging is described. Other thermomechanical working steps can be used prior to and/or after the forging step. Sputter targets are further described which can have unique grain size and/or crystal structures.
摘要翻译：描述了使用旋转轴向锻造制造溅射靶的方法。在锻造步骤之前和/或之后可以使用其它热机械加工步骤。进一步描述可以具有独特的晶粒尺寸和/或晶体结构的溅射靶。

4. 发明申请

US20070144623A1 Ultrasonic method for detecting banding in metals 审中-公开
标题翻译：用于检测金属条带的超声波检测方法
公开(公告)号：US20070144623A1
公开(公告)日：2007-06-28
申请号：US11059212
申请日：2005-02-16
申请人： Charles Wickersham
发明人： Charles Wickersham
IPC分类号： C22C27/02
CPC分类号： G01N29/4427 , C22C27/02 , G01N29/06 , G01N29/07 , G01N29/11 , G01N29/265 , G01N29/28 , G01N29/343 , G01N29/348 , G01N29/48 , G01N2291/0231 , G01N2291/044 , G01N2291/101 , G01N2291/2632 , G01N2291/2697
摘要： A method for non-destructively detecting the presence of banded regions in a metal is described. The method involves sending an ultrasonic wave into the metal and obtaining reflected signals. The reflected signals are compared with each other to determine variations in signal intensity. A banded region within the metal can be observed as a weaker reflected signal than a reflected backwall signal, thus accurately identifying a location of banding within the metal. Metal articles with a low percent of banding are also described.
摘要翻译：描述了用于非破坏性地检测金属中带状区域的存在的方法。该方法包括将超声波发送到金属中并获得反射信号。将反射信号相互比较以确定信号强度的变化。金属内的带状区域可以被观察为比反射的后壁信号更弱的反射信号，从而准确地识别金属内的条带位置。还描述了具有低百分比条带的金属制品。

5. 发明申请

US20070089815A1 Tantalum sputtering target and method of fabrication 有权
标题翻译：钽溅射靶和制造方法
公开(公告)号：US20070089815A1
公开(公告)日：2007-04-26
申请号：US11055535
申请日：2005-02-10
申请人： Charles Wickersham , Vladimir Levit , P. Alexander
发明人： Charles Wickersham , Vladimir Levit , P. Alexander
IPC分类号： C22F1/18
CPC分类号： C22C27/02 , B21B1/02 , B21H1/02 , C22F1/18 , C23C14/3414 , Y10T428/12243
摘要： A process is described for processing metal which includes clock rolling a metal plate until the desired thickness is achieved to form a rolled plate. Sputtering targets and other metal articles are further described.
摘要翻译：描述了一种处理金属的方法，其包括时钟滚动金属板，直到达到所需厚度以形成轧制板。进一步描述溅射靶和其它金属制品。

6. 发明申请

US20050236266A1 Sputter target monitoring system 审中-公开
标题翻译：溅射目标监测系统
公开(公告)号：US20050236266A1
公开(公告)日：2005-10-27
申请号：US10518293
申请日：2003-06-10
申请人： John Poole , Charles Wickersham
发明人： John Poole , Charles Wickersham
IPC分类号： C23C14/32 , C23C14/34 , C23C14/54 , H01J37/34
CPC分类号： H01J37/32935 , C23C14/34 , C23C14/54 , H01J37/34 , H01J37/3444 , H01J37/3482
摘要： A sputtering target monitoring system (20) for monitoring the status of a sputtering source target (22) during the sputtering process. The collection of data is initiated based on measured voltages in the sputtering source target (22), whereas the arcing count is determined based on current spikes or interruptions to the current in the sputtering source target (22) during the sputtering process. The real time data collected during the sputtering process is recorded and displayed in table or graphical format at any time during the sputtering process. Thus, problems in the sputtering process, or in the sputtering source (22), including an approaching end of life of the target may be easily ascertained. Alarms, messages or other indicators may be used to alert operators to problems or conditions during the sputtering process.
摘要翻译：一种用于在溅射过程中监测溅射源靶（22）的状态的溅射靶监测系统（20）。基于溅射源目标（22）中的测量电压来启动数据的收集，而基于溅射过程期间溅射源目标（22）中的电流的电流尖峰或中断来确定电弧计数。在溅射过程中随时记录和显示溅射过程中收集的实时数据，并以表格或图形格式显示。因此，可以容易地确定溅射工艺或溅射源（22）中包括目标寿命终止的问题。报警，消息或其他指示器可用于提醒操作员在溅射过程中的问题或条件。

7. 发明申请

US20050155456A1 Sputter targets and methods of manufacturing same to reduce particulate emission during sputtering 审中-公开
标题翻译：溅射靶及其制造方法，以减少溅射过程中的颗粒物排放
公开(公告)号：US20050155456A1
公开(公告)日：2005-07-21
申请号：US11063508
申请日：2005-02-23
申请人： Charles Wickersham , John Poole , Alexander Leybovich , Lin Zhu
发明人： Charles Wickersham , John Poole , Alexander Leybovich , Lin Zhu
IPC分类号： C22B21/06 , C22C21/02 , C22C21/14 , C23C14/34 , C23C14/56 , C22B9/02
CPC分类号： C22C21/14 , C22B21/06 , C22B21/066 , C22C21/02 , C23C14/3414 , C23C14/564
摘要： Methods for reducing inclusion content of sputter targets and targets so produced are disclosed. Inclusions may be reduced by adding a small amount of Si to the molten Al or molten Al alloy followed by filtering of the molten metals through a filter medium. Targets having substantially no inclusions therein of greater than about 400 μm are especially useful in the sputtering of large flat panel displays and result, upon sputtering, in a reduction in the amount of macroparticles sputtered onto the substrate.
摘要翻译：公开了减少如此制造的溅射靶和靶的夹杂物含量的方法。可以通过向熔融的Al或熔融的Al合金中加入少量的Si，然后通过过滤介质过滤熔融金属来减少夹杂物。基本上不具有大于约400μm的夹杂物的靶材在大平板显示器的溅射中是特别有用的，并且在溅射时导致溅射到衬底上的大颗粒量的减少。

8. 发明申请

US20070084719A1 Inertial bonding method of forming a sputtering target assembly and assembly made therefrom 审中-公开
标题翻译：形成溅射靶组件的惯性接合方法和由其制成的组件
公开(公告)号：US20070084719A1
公开(公告)日：2007-04-19
申请号：US11527766
申请日：2006-09-26
申请人： Charles Wickersham , Jason Haag
发明人： Charles Wickersham , Jason Haag
IPC分类号： C23C14/00
CPC分类号： C23C14/3407
摘要： A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method can include bonding a sputtering target to a backing plate with the use of solder, braze metal, or alloys thereof, and reflowing the solder or braze metal after bonding the sputtering target to the backing plate.
摘要翻译：描述形成溅射靶组件的方法和由其制成的溅射靶组件。该方法可以包括使用焊料，钎焊金属或其合金将溅射靶材接合到背板上，以及在将溅射靶材粘合到背板上之后回流焊料或钎焊金属。

9. 发明申请

US20050155677A1 Tantalum and other metals with (110) orientation 审中-公开
标题翻译：钽和其他具有（110）取向的金属
公开(公告)号：US20050155677A1
公开(公告)日：2005-07-21
申请号：US11030260
申请日：2005-01-06
申请人： Charles Wickersham
发明人： Charles Wickersham
IPC分类号： C22C27/02 , C22F1/18 , C23C14/34 , C30B11/00 , C30B29/02
CPC分类号： C22F1/18 , C22C27/02 , C23C14/3414 , C30B11/00 , C30B29/02
摘要： Tantalum metal, niobium metal, alloys thereof and other bcc metals and alloys thereof having a texture of primary or mixed (110) on the surface and/or throughout the thickness of the metal is described. Also described are the processes for making the tantalum metal and other bcc metal with a texture of primary or mixed (110) and the process of making a sputtering target from the tantalum metal or other bcc metal with a texture of primary or mixed (110).
摘要翻译：描述了在金属的表面和/或整个厚度上具有初级或混合（110）质地的钽金属，铌金属，其合金和其它bcc金属及其合金。还描述了制造具有初级或混合组织（110）的钽金属和其他bcc金属的方法以及由具有初级或混合（110）的织构的钽金属或其他bcc金属制造溅射靶的工艺，。

10. 发明申请

US20050147150A1 Thermography test method and apparatus for bonding evaluation in sputtering targets 失效
标题翻译：用于溅射靶中接合评估的热成像测试方法和设备
公开(公告)号：US20050147150A1
公开(公告)日：2005-07-07
申请号：US10890378
申请日：2004-07-13
申请人： Charles Wickersham , Zhiguo Zhang , Larry Ellison , Mikhail Kachalov , John White
发明人： Charles Wickersham , Zhiguo Zhang , Larry Ellison , Mikhail Kachalov , John White
IPC分类号： C23C14/34 , G01J5/00 , G01K1/16 , G01N25/72 , G06T7/00 , H01J37/34
CPC分类号： H01J37/3497 , C23C14/3407 , G01J5/0003 , G06T7/0004 , G06T2207/30152 , H01J37/3435
摘要： A method and apparatus for thermographically evaluating the bond integrity of a sputtering target assembly is described. The method includes applying a heating or cooling medium or energy to one surface of the assembly and acquiring a graphic recording of a corresponding temperature change on the opposing surface of the assembly using an imaging device. Also described is a method of mathematically analyzing the pixel data recorded in each frame to produce an integrated normalized temperature map that represents the bond integrity of the assembly.
摘要翻译：描述了用于热成像评估溅射靶组件的结合完整性的方法和装置。该方法包括将加热或冷却介质或能量施加到组件的一个表面，并且使用成像装置获得在组件的相对表面上的相应温度变化的图形记录。还描述了一种数学分析记录在每个帧中的像素数据以产生表示组件的粘合完整性的积分归一化温度图的方法。

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