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1. 发明授权

US08357286B1 Versatile workpiece refining 有权
标题翻译：多功能工件精制
公开(公告)号：US08357286B1
公开(公告)日：2013-01-22
申请号：US11978346
申请日：2007-10-29
申请人： Charles J. Molnar
发明人： Charles J. Molnar
IPC分类号： C25F3/15
CPC分类号： B24B37/042 , B24B37/005 , H01L21/31053 , H01L21/3212 , H01L22/12 , H01L22/26 , H01L2924/0002 , H01L2924/00
摘要： Versatile methods of refining a first and a second layer of a workpiece are discussed. New refining methods and refining apparatus are disclosed. The new refining methods can help improve yield and appreciably change the cost of manufacture for refining of workpieces. The methods can be applied to workpieces having extremely close tolerances such as semiconductor wafers. New methods of control are also discussed. Methods use controllers, processors, computers, and processor readable memory devices are discussed. Use of stored information is to make changes in process control are discussed. Use of process models are discussed for refining. Determining a changed process control with stored information from first and second layers of a workpiece is disclosed. A changed process control can make an appreciable changes to the cost of manufacture of a workpiece.
摘要翻译：讨论了对工件的第一层和第二层进行精制的通用方法。公开了新的精炼方法和精炼装置。新的精炼方法可以帮助提高产量并明显地改变制造工艺的成本。这些方法可以应用于具有非常接近公差的工件，例如半导体晶片。还讨论了新的控制方法。讨论了使用控制器，处理器，计算机和处理器可读存储器件的方法。使用存储信息是对过程控制的变更进行讨论。讨论使用过程模型进行改进。公开了利用来自工件的第一层和第二层的存储信息确定改变的过程控制。改变的过程控制可以对工件的制造成本做出明显的改变。

2. 发明授权

US08269154B2 Ovenware for microwave oven 有权
标题翻译：微波炉烤箱
公开(公告)号：US08269154B2
公开(公告)日：2012-09-18
申请号：US11438518
申请日：2006-05-22
申请人： Michael Robert Samuels , Marion Glen Waggoner , Joel D. Citron , Roger Moons , Charles J. Molnar
发明人： Michael Robert Samuels , Marion Glen Waggoner , Joel D. Citron , Roger Moons , Charles J. Molnar
IPC分类号： H05B6/80
CPC分类号： C08L101/12 , A47J36/027 , Y10T428/2918
摘要： Ovenware for microwave ovens which contain a composition comprising a susceptor and a thermoplastic or thermoset polymer are improved when the composition also has a thermal conductivity of about 0.7 W/m° K. or more. Heat generated by absorption of microwave radiation by the susceptor is more readily conducted to the food being cooked when the thermal conductivity of the composition is high, particularly when the part containing the susceptor is relatively thick. Also described are designs for various pieces of ovenware containing this composition.
摘要翻译：当组合物还具有约0.7W / m°K.或更高的热导率时，含有包含感受器和热塑性或热固性聚合物的组合物的微波炉的烤箱得到改进。当组合物的导热性高时，特别是当包含感受体的部分相对较厚时，由感受器吸收微波辐射产生的热量更容易被传导到被烹饪的食物。还描述了包含该组合物的各种烤箱的设计。

3. 发明授权

US07572169B1 Advanced finishing control 失效
标题翻译：高级整理控制
公开(公告)号：US07572169B1
公开(公告)日：2009-08-11
申请号：US11801031
申请日：2007-05-08
申请人： Charles J. Molnar
发明人： Charles J. Molnar
IPC分类号： B24B49/00
CPC分类号： B24B37/042 , B24B37/013
摘要： A factory, an apparatus, and methods of using an in situ finishing information for finishing workpieces and semiconductor wafers are described. Changes or improvements to cost of manufacture of a workpiece using in-process cost of manufacture information, tracked in-process cost of manufacture information, or cost of manufacture parameters are discussed. Appreciable changes to quality or cost of manufacture of a workpiece using tracking, using in-process tracked information, networks including a multiplicity of apparatus, and using in situ finishing information are discussed. A factory, apparatus, and methods to change or improve process control are discussed. A factory, apparatus, and methods to change or improve real-time process control are discussed. A factory, apparatus, and methods to change or improve predictive control are discussed. The workpieces can be tracked individually or by process group such as a process batch.
摘要翻译：描述了使用原位精加工信息来完成工件和半导体晶片的工厂，设备和方法。讨论了使用制造信息的在制成本，跟踪制造信息的在制造成本或制造参数成本来改变或改进制造成本的工件。讨论了使用跟踪，使用过程中跟踪的信息，包括多种设备的网络和使用原位整理信息的工件的质量或制造成本的可观察的变化。讨论了改变或改进过程控制的工厂，设备和方法。讨论了改变或改进实时过程控制的工厂，设备和方法。讨论了改变或改进预测控制的工厂，设备和方法。工件可以单独跟踪，也可以由工艺组进行跟踪，例如工艺批次。

4. 发明授权

US07131890B1 In situ finishing control 有权
标题翻译：原位整理控制
公开(公告)号：US07131890B1
公开(公告)日：2006-11-07
申请号：US10730631
申请日：2003-12-08
申请人： Charles J Molnar
发明人： Charles J Molnar
IPC分类号： B24B49/14
CPC分类号： B24B37/013 , B24B49/16 , H01L21/30625 , H01L21/67253 , H01L21/67288
摘要： An apparatus and method of using a in situ finishing information for finishing semiconductor wafers is described. The method uses operative sensors such as friction sensors for detecting and improving control during finishing. The method can aid control of finishing while using in situ finishing information and cost of manufacture information. The method can aid control of finishing while using organic lubricants, lubricating films, and lubricating boundary layers in the operative finishing interface. The method can generally aid control of differential finishing such as when using differential lubricating films such as lubricating boundary layers. Control can generally aid improvement of differential finishing of semiconductor wafers. Planarization and localized finishing can used with in situ finishing information such as differential lubricating boundary layer for finishing. Defects can generally be reduced using the in situ friction finishing information method. Real time improvements to cost of manufacture semiconductor wafer manufacture can be made by tracking and using current in process cost of manufacture information and cost of manufacture parameters. The semiconductor wafers can be tracked individually or by process group such as a process batch. Abrasive finishing surfaces can be used. Tribochemical finishing can generally be improved.
摘要翻译：描述了一种使用原位整理信息来完成半导体晶片的设备和方法。该方法使用诸如摩擦传感器的操作传感器来检测和改善精加工时的控制。该方法可以帮助控制整理，同时使用原位整理信息和制造成本信息。该方法可以在操作完成界面中使用有机润滑剂，润滑膜和润滑边界层的同时控制整理。该方法通常可以帮助控制差速精加工，例如当使用诸如润滑边界层的差分润滑膜时。控制通常有助于改善半导体晶片的差速精加工。平面化和局部精加工可以与原位精加工信息一起使用，如精加工的润滑边界层差。通常可以使用原位摩擦整理信息方法来减少缺陷。可以通过跟踪和使用当前的制造过程成本信息和制造参数成本来实时制造半导体晶圆制造的成本。半导体晶片可以单独跟踪或通过工艺组进行跟踪，例如工艺批次。可以使用磨料整理表面。摩擦整理通常可以改善。

5. 发明授权

US06790542B2 Transparent paramagnetic polymer 失效
标题翻译：透明顺磁聚合物
公开(公告)号：US06790542B2
公开(公告)日：2004-09-14
申请号：US10050286
申请日：2002-01-16
申请人： David M. Dean , Charles J. Molnar
发明人： David M. Dean , Charles J. Molnar
IPC分类号： G11B566
CPC分类号： G02B6/3572 , C08F8/44 , C08F220/14 , C08K5/0091 , C08L33/10 , C08L57/00 , G02B6/02033 , G02B6/3502 , G02B6/3524 , G02B6/355 , G02B6/3582 , H01F1/42 , C08L57/06 , C08F220/06
摘要： This invention provides a transparent, paramagnetic polymer composition in which a polymer is complexed with sufficient rare earth ions, particularly ions selected from ions in the group of elements 64-69, to provide a polymer with a magnetic mass susceptibility greater than 20×10−6 emu/g measured at 298° K. This invention provides optically responsive devices that employ these transparent, paramagnetic polymers as an element that is responsive to a magnetic field and a means for providing magnetic field. This invention provides transparent labels or markings employing these transparent, paramagnetic polymers.
摘要翻译：本发明提供了一种透明的顺磁聚合物组合物，其中聚合物与足够的稀土离子，特别是选自元素64-69组中的离子的离子络合，以提供具有大于20×10 -6的磁性质量敏感性的聚合物 > emu / g。本发明提供了使用这些透明的顺磁性聚合物作为响应于磁场的元件的光学响应性装置和用于提供磁场的装置。本发明提供了采用这些的透明标签或标记透明，顺磁聚合物。

6. 发明授权

US06346202B1 Finishing with partial organic boundary layer 有权
标题翻译：完成部分有机边界层
公开(公告)号：US06346202B1
公开(公告)日：2002-02-12
申请号：US09533473
申请日：2000-03-23
申请人： Charles J. Molnar
发明人： Charles J. Molnar
IPC分类号： C03C1500
CPC分类号： B24B37/013 , B24B37/042 , B24B37/11
摘要： A method of using a finishing element having a fixed abrasive finishing surface including organic boundary lubricants for finishing semiconductor wafers is described. The organic lubricants form an organic lubricating boundary layer in the operative finishing interface in a preferred coefficient of friction range. The selected coefficient of friction helps improve finishing and reduces unwanted surface defects. Differential lubricating boundary layer methods are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing.
摘要翻译：描述了一种使用具有固定的研磨精加工表面的精加工元件的方法，其包括用于整理半导体晶片的有机边界润滑剂。有机润滑剂在优选的摩擦系数范围内在操作完成界面中形成有机润滑边界层。所选择的摩擦系数有助于改善精加工并减少不必要的表面缺陷。差示润滑边界层方法被描述为差别地完成半导体晶片。使用差速润滑边界层整理方法可以提高平面化和局部精加工。

7. 发明授权

US06204181B1 Finishing method for semiconductor wafers using a lubricating boundary layer 有权
标题翻译：使用润滑边界层的半导体晶圆的整理方法
公开(公告)号：US06204181B1
公开(公告)日：2001-03-20
申请号：US09435180
申请日：1999-11-05
申请人： Charles J Molnar
发明人： Charles J Molnar
IPC分类号： H01L2100
CPC分类号： H01L21/3212 , B24B37/11
摘要： A method of using lubricating boundary layers for finishing semiconductor wafers is described. The lubricating boundary layer thickness is controlled to improve finishing and reduce unwanted surface defects. Differential lubricating boundary layer methods are described to differentially finish semiconductor wafers. Planarization and localized finishing can be improved using differential lubricating boundary layer methods of finishing.
摘要翻译：描述了使用润滑边界层来完成半导体晶片的方法。控制润滑边界层厚度以改善整理并减少不需要的表面缺陷。差示润滑边界层方法被描述为差别地完成半导体晶片。使用差速润滑边界层整理方法可以提高平面化和局部精加工。

8. 发明授权

US5507845A Plant sod mats 失效
标题翻译：植物草席
公开(公告)号：US5507845A
公开(公告)日：1996-04-16
申请号：US321311
申请日：1994-10-11
申请人： Charles J. Molnar , William H. Mitchell
发明人： Charles J. Molnar , William H. Mitchell
IPC分类号： A01G1/00 , E01C13/08 , A01L1/04
CPC分类号： E01C13/083 , A01G1/005
摘要： This invention relates to sod and turf having modified planting mediums and a synthetic sod reinforcement. The sod mats are propagated quickly and are very effective in use. The sod mats are especially effective for soil stabilization and sports fields.
摘要翻译：本发明涉及具有改良种植介质的草皮和草皮以及合成草皮增强物。草席快速传播，使用非常有效。草地垫对土壤稳定和运动场特别有效。

9. 发明申请

US20110294399A1 Advanced finishing control 有权
标题翻译：高级整理控制
公开(公告)号：US20110294399A1
公开(公告)日：2011-12-01
申请号：US13136437
申请日：2011-08-01
申请人： Charles J. Molnar
发明人： Charles J. Molnar
IPC分类号： B24B51/00
CPC分类号： B24B37/042 , G05B19/41865 , G05B2219/31265 , G05B2219/31415 , G05B2219/45031 , G06Q10/06 , G06Q50/04 , H01L21/67248 , H01L21/68785 , Y02P90/18 , Y02P90/20 , Y02P90/22 , Y02P90/30 , Y02P90/86
摘要： Methods of using in situ finishing information for finishing workpieces and semiconductor wafers are described. Methods of using yield information at least in part related to cost of manufacture for finishing workpieces and semiconductor wafers are described. Changes or improvements to cost of manufacture of a workpiece using current in-process cost of manufacture information, tracked current in-process cost of manufacture information, or current cost of manufacture parameters are discussed. Appreciable changes to quality or cost of manufacture of a workpiece using tracking, using in-process tracked information, networks including a multiplicity of apparatus, and using in situ finishing information are discussed. A factory, apparatus, and methods to change or improve process control are discussed. A factory, apparatus, and methods to change or improve real-time process control are discussed. A factory, apparatus, and methods to change or improve feedforward and feedback control are discussed. The workpieces can be tracked individually or by process group such as a process batch.
摘要翻译：描述了使用原位精加工信息来完成工件和半导体晶片的方法。描述了至少部分地与完成工件和半导体晶片的制造成本相关的产量信息的方法。讨论了使用当前的制造过程成本信息，跟踪电流在制造信息的过程成本或制造参数的当前成本来改变或改进制造工件的成本。讨论了使用跟踪，使用过程中跟踪信息，包括多种设备的网络和使用原位整理信息的工件的质量或制造成本的可观察的变化。讨论了改变或改进过程控制的工厂，设备和方法。讨论了改变或改进实时过程控制的工厂，设备和方法。讨论了改变或改进前馈和反馈控制的工厂，设备和方法。工件可以单独跟踪，也可以由工艺组进行跟踪，例如工艺批次。

10. 发明授权

US07991499B2 Advanced finishing control 有权
标题翻译：高级整理控制
公开(公告)号：US07991499B2
公开(公告)日：2011-08-02
申请号：US11978347
申请日：2007-10-29
申请人： Charles J. Molnar
发明人： Charles J. Molnar
IPC分类号： G06F19/00 , B24B49/14
CPC分类号： G05B19/41875 , G05B2219/32182 , G05B2219/32201 , Y02P90/18 , Y02P90/22 , Y02P90/86
摘要： A factory, an apparatus, and methods of using an in situ finishing information for finishing workpieces and semiconductor wafers are described. Changes or improvements to cost of manufacture of a workpiece using current in-process cost of manufacture information, tracked current in-process cost of manufacture information, or current cost of manufacture parameters are discussed. Appreciable changes to quality or cost of manufacture of a workpiece using tracking, using in-process tracked information, networks including a multiplicity of apparatus, and using in situ finishing information are discussed. A factory, apparatus, and methods to change or improve process control are discussed. A factory, apparatus, and methods to change or improve real-time process control are discussed. A factory, apparatus, and methods to change or improve feedforward and feedback control are discussed. The workpieces can be tracked individually or by process group such as a process batch.
摘要翻译：描述了使用原位精加工信息来完成工件和半导体晶片的工厂，设备和方法。讨论了使用当前的制造过程成本信息，跟踪电流在制造信息的过程成本或制造参数的当前成本来改变或改进制造工件的成本。讨论了使用跟踪，使用过程中跟踪信息，包括多种设备的网络和使用原位整理信息的工件的质量或制造成本的可观察的变化。讨论了改变或改进过程控制的工厂，设备和方法。讨论了改变或改进实时过程控制的工厂，设备和方法。讨论了改变或改进前馈和反馈控制的工厂，设备和方法。工件可以单独跟踪，也可以由工艺组进行跟踪，例如工艺批次。

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