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    • 2. 发明授权
    • Prime field elliptic curve cryptography processor
    • 主场椭圆曲线加密处理器
    • US08358779B1
    • 2013-01-22
    • US12713297
    • 2010-02-26
    • Fei SunChang Shu
    • Fei SunChang Shu
    • G06F21/00
    • G06F21/72G06F7/725H04L9/0861H04L9/28H04L9/3066H04L2209/12
    • Prime field elliptic curve cryptography processors are provided, having corresponding methods and computer-readable media. The processors comprise a prime field circuit comprising a first memory configured to store data, and an arithmetic logic unit (ALU) circuit configured to perform prime field operations upon the data; and a curve operation processor comprising a second memory configured to store instructions, and a controller configured to execute the instructions; wherein the instructions include instructions for performing curve operations upon the data, wherein the curve operations require performing the prime field operations upon the data; and wherein the instructions for performing the curve operations cause the ALU circuit to perform the prime field operations.
    • 提供了主场椭圆曲线加密处理器,具有相应的方法和计算机可读介质。 所述处理器包括:主场电路,包括被配置为存储数据的第一存储器;以及被配置为对所述数据进行主场操作的算术逻辑单元(ALU)电路; 以及曲线运算处理器,包括被配置为存储指令的第二存储器和被配置为执行所述指令的控制器; 其中所述指令包括用于对所述数据执行曲线操作的指令,其中所述曲线操作要求对所述数据执行所述主场操作; 并且其中用于执行曲线操作的指令使得ALU电路执行主场操作。
    • 5. 发明授权
    • Method for fabricating low cost integrated resistor capacitor
combinations
    • 制造低成本集成电阻电容器组合的方法
    • US5893731A
    • 1999-04-13
    • US862796
    • 1997-05-23
    • Chang-Shu LeeTsung-Yao Chu
    • Chang-Shu LeeTsung-Yao Chu
    • H01L21/02H01L27/06H01L21/8234
    • H01L28/20H01L27/0688H01L28/40
    • A low cost method for forming an integrated resistor capacitor combination using only three masks and three mask exposure steps is described. A layer of resistor material is formed on a substrate and patterned forming a resistor and a first capacitor plate. A photoresist mask is then formed covering the resistor and a contact region of the first capacitor plate. The substrate is then immersed in an anodization solution and that part of the first capacitor plate not covered by the photoresist mask is anodized forming a capacitor dielectric. The photoresist mask is then stripped. A layer of conductor material is then formed and patterned to form contacts to the resistor, a contact to the first capacitor plate, and a second capacitor plate.
    • 描述了仅使用三个掩模和三个掩模曝光步骤形成集成电阻器电容器组合的低成本方法。 在基板上形成电阻材料层,并形成电阻器和第一电容器板。 然后形成覆盖电阻器和第一电容器板的接触区域的光致抗蚀剂掩模。 然后将衬底浸入阳极氧化溶液中,并且未被光致抗蚀剂掩模覆盖的部分第一电容器板被阳极氧化形成电容器电介质。 然后剥离光致抗蚀剂掩模。 然后形成导体材料层并构图以形成与电阻器的接触,与第一电容器板的接触以及第二电容器板。
    • 7. 发明授权
    • LED package for uniform color emission
    • LED封装,均匀发光
    • US08373183B2
    • 2013-02-12
    • US13031629
    • 2011-02-22
    • Shan Mei WanChang Shu LeeMing Lu
    • Shan Mei WanChang Shu LeeMing Lu
    • H01L33/48H01L33/50H01L33/00F21S2/00
    • H01L33/504H01L33/505H01L51/5036H01L51/524H01L51/5253H01L2224/48091H01L2924/00014
    • A light emitting diode package for one or more light emitting diodes mounted on a substrate. A frame is disposed on at least a portion of the substrate and substantially surrounds, but does not contact, the light emitting diode. The frame is substantially transparent to light emitted from the light emitting diode and includes one or more first wavelength converting materials. The wavelength converting materials, which may be one or more phosphors, convert at least a portion of light emitted at the emission wavelength to different wavelength. A cover covers the light emitting diode within the frame. The cover layer includes one or more second wavelength converting materials differing from the first one or more wavelength converting materials in wavelength converting material concentration or in converted light wavelength or in combinations of wavelength converting materials.
    • 一种用于安装在基板上的一个或多个发光二极管的发光二极管封装。 框架设置在基板的至少一部分上并基本上包围但不接触发光二极管。 该框架对于从发光二极管发出的光基本上是透明的,并且包括一个或多个第一波长转换材料。 可以是一种或多种荧光体的波长转换材料将在发射波长处发射的光的至少一部分转换成不同的波长。 盖子覆盖框架内的发光二极管。 覆盖层包括与波长转换材料浓度或转换光波长中的第一或多个波长转换材料不同的一个或多个第二波长转换材料或波长转换材料的组合。