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    • 1. 发明授权
    • LED package for uniform color emission
    • LED封装,均匀发光
    • US08373183B2
    • 2013-02-12
    • US13031629
    • 2011-02-22
    • Shan Mei WanChang Shu LeeMing Lu
    • Shan Mei WanChang Shu LeeMing Lu
    • H01L33/48H01L33/50H01L33/00F21S2/00
    • H01L33/504H01L33/505H01L51/5036H01L51/524H01L51/5253H01L2224/48091H01L2924/00014
    • A light emitting diode package for one or more light emitting diodes mounted on a substrate. A frame is disposed on at least a portion of the substrate and substantially surrounds, but does not contact, the light emitting diode. The frame is substantially transparent to light emitted from the light emitting diode and includes one or more first wavelength converting materials. The wavelength converting materials, which may be one or more phosphors, convert at least a portion of light emitted at the emission wavelength to different wavelength. A cover covers the light emitting diode within the frame. The cover layer includes one or more second wavelength converting materials differing from the first one or more wavelength converting materials in wavelength converting material concentration or in converted light wavelength or in combinations of wavelength converting materials.
    • 一种用于安装在基板上的一个或多个发光二极管的发光二极管封装。 框架设置在基板的至少一部分上并基本上包围但不接触发光二极管。 该框架对于从发光二极管发出的光基本上是透明的,并且包括一个或多个第一波长转换材料。 可以是一种或多种荧光体的波长转换材料将在发射波长处发射的光的至少一部分转换成不同的波长。 盖子覆盖框架内的发光二极管。 覆盖层包括与波长转换材料浓度或转换光波长中的第一或多个波长转换材料不同的一个或多个第二波长转换材料或波长转换材料的组合。