专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08367190B2 At low temperature, fast hardening composition for preparing protecting film, protecting film prepared therefrom, and substrate comprising the same 有权
标题翻译：在低温下，用于制备保护膜的快速硬化组合物，由其制备的保护膜和包含该膜的基材
公开(公告)号：US08367190B2
公开(公告)日：2013-02-05
申请号：US12311023
申请日：2007-09-18
申请人： Jeong-Man Son , Minjin Ko , Myungsun Moon , Byung-Ro Kim , Jaeho Cheong
发明人： Jeong-Man Son , Minjin Ko , Myungsun Moon , Byung-Ro Kim , Jaeho Cheong
IPC分类号： B32B7/02
CPC分类号： C09D183/04 , Y10T428/24942 , Y10T428/31504
摘要： The present invention relates to a composition for preparing an excellent protecting film with high strength, wear resistance, and excellent barrier property by low temperature hardening, a protecting film prepared therefrom, a substrate comprising the same, and a component or device comprising the same. The composition comprises an organosiloxane polymer a), a photobase generator b), and an organic solvent c).
摘要翻译：本发明涉及通过低温硬化制备具有高强度，耐磨性和优异的阻隔性的优异保护膜的组合物，由其制备的保护膜，包含该保护膜的基材，以及包含该保护膜的组分或装置。组合物包含有机硅氧烷聚合物a），光碱产生剂b）和有机溶剂c）。

2. 发明申请

US20080161523A1 Radially multi-branched polymer and porous film using the same 有权
标题翻译：径向多支化聚合物和多孔膜使用相同
公开(公告)号：US20080161523A1
公开(公告)日：2008-07-03
申请号：US11905294
申请日：2007-09-28
申请人： Jae Ho Cheong , Gwi Gwon Kang , Min Jin Ko , Jung Won Kang , Myung Sun Moon , Byung Ro Kim , Bum Gyu Choi , Dae Ho Kang , Jeong Man Son
发明人： Jae Ho Cheong , Gwi Gwon Kang , Min Jin Ko , Jung Won Kang , Myung Sun Moon , Byung Ro Kim , Bum Gyu Choi , Dae Ho Kang , Jeong Man Son
IPC分类号： C08F20/06 , C07C33/00
CPC分类号： C08G65/32 , C08G63/08 , C08G83/003 , H01B3/421 , H05K3/4676
摘要： Disclosed is a novel radially multi-branched polymer. The radially multi-branched polymer includes a central molecule to which side-branches are bonded in at least three positions and has an average molecular weight of 500 to 100,000, the side-branch being selected from the group consisting of a polyalkylene oxide, a polyacrylate, a polyester, a polyamide and derivatives thereof. The radially multi-branched polymer is used for manufacturing a low dielectric insulating film to provide a low dielectric insulating film having easily controllable micropores.
摘要翻译：公开了一种新型的径向多支化聚合物。所述径向多支链聚合物包括中心分子，侧分支在至少三个位置键合，平均分子量为500至100,000，所述侧枝选自聚环氧烷，聚丙烯酸酯聚酯，聚酰胺及其衍生物。径向多分支聚合物用于制造低介电绝缘膜，以提供具有容易控制的微孔的低介电绝缘膜。

3. 发明申请

US20070088144A1 Organic silicate polymer and insulation film comprising the same 有权
标题翻译：有机硅酸盐聚合物和包含其的绝缘膜
公开(公告)号：US20070088144A1
公开(公告)日：2007-04-19
申请号：US10511639
申请日：2003-03-28
申请人： Jung-Won Kang , Min-Jin Ko , Dong-Seok Shin , Gwi-Gwon Kang , Myung-Sun Moon , Hye-Yeong Nam , Bum-Gyu Choi , Young-Duk Kim , Byung-Ro Kim , Won-Jong Kwon , Sang-Min Park
发明人： Jung-Won Kang , Min-Jin Ko , Dong-Seok Shin , Gwi-Gwon Kang , Myung-Sun Moon , Hye-Yeong Nam , Bum-Gyu Choi , Young-Duk Kim , Byung-Ro Kim , Won-Jong Kwon , Sang-Min Park
IPC分类号： C08G77/06 , C08G77/12 , C08L83/04
CPC分类号： C09D183/04 , C08G77/06 , H01L23/296 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to an organic silicate polymer prepared by mixing silane compound with organic solvent to prepare a first mixture, and hydrolyzing and condensing the first mixture by adding water and catalyst, the first mixture being selected from a group consisting of oxidized hydrosilane, cyclic siloxane, a second mixture of oxidized hydrosilane and silane or silane oligomer, and a third mixture of cyclic siloxane and silane or silane oligomer, a composition for forming an insulation film of semiconductor devices prepared by using the organic silicate polymer, a method for preparing an insulation film using the composition, and a semiconductor device comprising the insulation film.
摘要翻译：本发明涉及通过将硅烷化合物与有机溶剂混合以制备第一混合物并通过加入水和催化剂水解和缩合第一混合物制备的有机硅酸盐聚合物，第一混合物选自氧化氢硅烷，环状硅氧烷，氧化氢硅烷和硅烷或硅烷低聚物的第二混合物，以及环状硅氧烷和硅烷或硅烷低聚物的第三混合物，用于形成通过使用有机硅酸酯聚合物制备的半导体器件的绝缘膜的组合物，使用该组合物的绝缘膜，以及包含绝缘膜的半导体器件。

4. 发明授权

US07345351B2 Coating composition for insulating film production, preparation method of insulation film by using the same, insulation film for semi-conductor device prepared therefrom, and semi-conductor device comprising the same 有权
公开(公告)号：US07345351B2
公开(公告)日：2008-03-18
申请号：US10516493
申请日：2004-03-31
申请人： Myung-Sun Moon , Min-Jin Ko , Hye-Yeong Nam , Jung-Won Kang , Bum-Gyu Choi , Byung-Ro Kim , Gwi-Gwon Kang , Young-Duk Kim , Sang-Min Park
发明人： Myung-Sun Moon , Min-Jin Ko , Hye-Yeong Nam , Jung-Won Kang , Bum-Gyu Choi , Byung-Ro Kim , Gwi-Gwon Kang , Young-Duk Kim , Sang-Min Park
IPC分类号： H01L21/31
CPC分类号： C09D183/04 , C09D183/14 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/3122 , Y10T428/31663
摘要： The present invention relates to a coating composition for insulating film production, a preparation method of a low dielectric insulating film using the same, a low dielectric insulating film for a semiconductor device prepared therefrom, and a semiconductor device comprising the same, and more particularly to a coating composition for insulating film production having a low dielectric constant and that is capable of producing an insulating film with superior mechanical strength (elasticity), a preparation method of a low dielectric insulating film using the same, a low dielectric insulating film for a semiconductor device prepared therefrom, and a semiconductor device comprising the same. The coating composition of the present invention comprises an organic siloxane resin having a small molecular weight, and water, and significantly improves low dielectricity and mechanical strength of an insulating film.

5. 发明申请

US20060127587A1 Organic silicate polymer and insulation film comprising the same 审中-公开
标题翻译：有机硅酸盐聚合物和包含其的绝缘膜
公开(公告)号：US20060127587A1
公开(公告)日：2006-06-15
申请号：US10516494
申请日：2003-06-27
申请人： Jung-won Kang , Myung-Sun Moon , Min-Jin Ko , Gwi-Gwon Kang , Dong-Seok Shin , Hye-Yeong Nam , Young-Duk Kim , Bum-Gyu Choi , Byung-Ro Kim , Sang-Min Park
发明人： Jung-won Kang , Myung-Sun Moon , Min-Jin Ko , Gwi-Gwon Kang , Dong-Seok Shin , Hye-Yeong Nam , Young-Duk Kim , Bum-Gyu Choi , Byung-Ro Kim , Sang-Min Park
IPC分类号： B05D3/02 , C08G77/60 , C07F7/18
CPC分类号： H01L21/3121 , C08G77/48 , C09D183/14 , H01L21/02126 , H01L21/02203 , H01L21/02216 , H01L21/02282 , H01L21/3122 , H01L21/31695 , H01L23/5222 , H01L23/5329 , H01L2924/0002 , H01L2924/12044 , H01L2924/00
摘要： The present invention relates to a composition for forming a low dielectric insulating film for a semiconductor device, particularly to an organosilicate polymer prepared by mixing a thermally decomposable organic silane compound that is capped with a silane compound at both its ends, and a common silane compound or silane oligomer, and then adding water and a catalyst to conduct hydrolysis and condensation, as well as to a coating composition for an insulating film for a semiconductor device comprising the same, a coating composition for an insulating film for a semiconductor device further comprising a pore-forming organic substance, a method for preparing an insulating film for a semiconductor device by coating the composition and curing, and a semiconductor device comprising a low dielectric insulating film prepared by the method. The organosilicate polymer prepared according to the present invention has superior thermal stability and mechanical strength; an insulating film-forming composition comprising the same can be used for an interlayer insulating film for low dielectric wiring that can contribute to a high speed semiconductor, reduce power consumption, and remarkably decrease cross-talk between metal wiring; and a film obtained by applying the composition to an insulating film has superior coating properties, inhibits phase-separation, can easily control minute pores because organic substances are thermally decomposed to form pores during a curing process, and has superior insulating properties and a remarkably decreased film density.
摘要翻译：本发明涉及一种用于形成用于半导体器件的低介电绝缘膜的组合物，特别涉及通过将两端封装有硅烷化合物的可热分解有机硅烷化合物和普通硅烷化合物混合而制备的有机硅酸盐聚合物或硅烷低聚物，然后加入水和催化剂进行水解和缩合，以及用于包含该组合物的半导体器件的绝缘膜用涂料组合物，用于半导体器件的绝缘膜用涂料组合物，还包含成孔有机物质，通过涂布组合物和固化来制备用于半导体器件的绝缘膜的方法，以及包括通过该方法制备的低介电绝缘膜的半导体器件。根据本发明制备的有机硅酸盐聚合物具有优异的热稳定性和机械强度; 可以使用包含该绝缘膜的绝缘膜形成用组合物用于低电介质布线的层间绝缘膜，其可有助于高速半导体，降低功耗，并显着降低金属布线之间的串扰; 并且通过将该组合物施加到绝缘膜上获得的膜具有优异的涂布性能，抑制相分离，可以容易地控制微孔，因为有机物质在固化过程中被热分解形成孔隙，并且具有优异的绝缘性能并显着降低胶片密度。

6. 发明授权

US07910664B2 Radially multi-branched polymer and porous film using the same 有权
标题翻译：径向多支化聚合物和多孔膜使用相同
公开(公告)号：US07910664B2
公开(公告)日：2011-03-22
申请号：US11905294
申请日：2007-09-28
申请人： Jae Ho Cheong , Gwi Gwon Kang , Min Jin Ko , Jung Won Kang , Myung Sun Moon , Byung Ro Kim , Bum Gyu Choi , Dae Ho Kang , Jeong Man Son
发明人： Jae Ho Cheong , Gwi Gwon Kang , Min Jin Ko , Jung Won Kang , Myung Sun Moon , Byung Ro Kim , Bum Gyu Choi , Dae Ho Kang , Jeong Man Son
IPC分类号： C08G61/12
CPC分类号： C08G65/32 , C08G63/08 , C08G83/003 , H01B3/421 , H05K3/4676
摘要： Disclosed is a novel radially multi-branched polymer. The radially multi-branched polymer includes a central molecule to which side-branches are bonded in at least three positions and has an average molecular weight of 500 to 100,000, the side-branch being selected from the group consisting of a polyalkylene oxide, a polyacrylate, a polyester, a polyamide and derivatives thereof. The radially multi-branched polymer is used for manufacturing a low dielectric insulating film to provide a low dielectric insulating film having easily controllable micropores.
摘要翻译：公开了一种新型的径向多支化聚合物。所述径向多支链聚合物包括中心分子，侧分支在至少三个位置键合，平均分子量为500至100,000，所述侧枝选自聚环氧烷，聚丙烯酸酯聚酯，聚酰胺及其衍生物。径向多分支聚合物用于制造低介电绝缘膜，以提供具有容易控制的微孔的低介电绝缘膜。

7. 发明申请

US20080145677A1 Coating composition for insulating film production, preparation method of insulation film by using the same, insulation film for semi-conductor device prepared therefrom, and semi-conductor device comprising the same 有权
标题翻译：用于绝缘膜生产的涂料组合物，使用它的绝缘膜的制备方法，由其制备的半导体器件的绝缘膜和包含该半导体器件的半导体器件
公开(公告)号：US20080145677A1
公开(公告)日：2008-06-19
申请号：US12010541
申请日：2008-01-25
申请人： Myung-Sun Moon , Min-Jin Ko , Hye-Yeong Nam , Jung-Won Kang , Bum-Gyu Choi , Byung-Ro Kim , Gwi-Gwon Kang , Young-Duk Kim , Sang-Min Park
发明人： Myung-Sun Moon , Min-Jin Ko , Hye-Yeong Nam , Jung-Won Kang , Bum-Gyu Choi , Byung-Ro Kim , Gwi-Gwon Kang , Young-Duk Kim , Sang-Min Park
IPC分类号： B32B27/00 , C08G77/00 , H01L21/31
CPC分类号： C09D183/04 , C09D183/14 , H01L21/02126 , H01L21/02216 , H01L21/02282 , H01L21/3122 , Y10T428/31663
摘要： The present invention relates to a coating composition for insulating film production, a preparation method of a low dielectric insulating film using the same, a low dielectric insulating film for a semiconductor device prepared therefrom, and a semiconductor device comprising the same, and more particularly to a coating composition for insulating film production having a low dielectric constant and that is capable of producing an insulating film with superior mechanical strength (elasticity), a preparation method of a low dielectric insulating film using the same, a low dielectric insulating film for a semiconductor device prepared therefrom, and a semiconductor device comprising the same. The coating composition of the present invention comprises an organic siloxane resin having a small molecular weight, and water, and significantly improves low dielectricity and mechanical strength of an insulating film.
摘要翻译：本发明涉及一种用于制造绝缘膜的涂料组合物，使用该涂料的低介电绝缘膜的制备方法，由其制备的用于半导体器件的低介电绝缘膜，以及包含该半导体装置的半导体器件，更具体地涉及具有低介电常数的绝缘膜制造用涂料组合物，能够制造具有优良机械强度（弹性）的绝缘膜，使用其的低介电绝缘膜的制备方法，半导体用低介电绝缘膜由其制备的器件，以及包含该器件的半导体器件。本发明的涂料组合物包含具有小分子量的有机硅氧烷树脂和水，并显着地改善绝缘膜的低介电性和机械强度。

8. 发明申请

US20100080973A1 LOW TEMPERATURE, FAST HARDENING COMPOSITION FOR PREPARING PROTECTING FILM, PROTECTING FILM PREPARED THEREFROM, AND SUBSTRATE COMPRISING THE SAME 有权
标题翻译：低温，制备保护膜的快速硬化组合物，保护膜的保护膜和包含其的基材
公开(公告)号：US20100080973A1
公开(公告)日：2010-04-01
申请号：US12311023
申请日：2007-09-18
申请人： Jeong-man Son , Minjin Ko , Myungsun Moon , Byung-Ro Kim , Jaeho Cheong
发明人： Jeong-man Son , Minjin Ko , Myungsun Moon , Byung-Ro Kim , Jaeho Cheong
IPC分类号： C08F299/08 , C08F2/50 , C08F2/46 , C08J7/04 , B32B27/00
CPC分类号： C09D183/04 , Y10T428/24942 , Y10T428/31504
摘要： The present invention relates to a composition for preparing an excellent protecting film with high strength, wear resistance, and excellent barrier property by low temperature hardening, a protecting film prepared therefrom, a substrate comprising the same, and a component or device comprising the same. The composition comprises an organosiloxane polymer a), a photobase generator b), and an organic solvent c).
摘要翻译：本发明涉及通过低温硬化制备具有高强度，耐磨性和优异的阻隔性的优异保护膜的组合物，由其制备的保护膜，包含该保护膜的基材，以及包含该保护膜的组分或装置。组合物包含有机硅氧烷聚合物a），光碱产生剂b）和有机溶剂c）。

9. 发明授权

US07297722B2 Radially multi-branched polymer and porous film using the same 有权
标题翻译：径向多支化聚合物和多孔膜使用相同
公开(公告)号：US07297722B2
公开(公告)日：2007-11-20
申请号：US10960040
申请日：2004-10-08
申请人： Jae Ho Cheong , Gwi Gwon Kang , Min Jin Ko , Jung Won Kang , Myung Sun Moon , Byung Ro Kim , Bum Gyu Choi , Dae Ho Kang , Jeong Man Son
发明人： Jae Ho Cheong , Gwi Gwon Kang , Min Jin Ko , Jung Won Kang , Myung Sun Moon , Byung Ro Kim , Bum Gyu Choi , Dae Ho Kang , Jeong Man Son
IPC分类号： C08G61/12 , C08G63/91 , C08J9/00
CPC分类号： C08G65/32 , C08G63/08 , C08G83/003 , H01B3/421 , H05K3/4676
摘要： Described is a radially multi-branched polymer represented by the following formula (I): ABi (I), which includes a central molecule (A) to which side-branches (B) are bonded in at least three positions (i≧3). Also described are methods for preparing a multi-branched polymer as well as a porous insulating film including a multi-branched polymer.
摘要翻译：描述的是由下式（I）表示的径向多支链聚合物：ABi（I），其包含侧链（B）在至少三个位置（i> = 3）上键合的中心分子（A））。还描述了制备多支化聚合物的方法以及包含多支化聚合物的多孔绝缘膜。

10. 发明授权

US07834119B2 Organic silicate polymer and insulation film comprising the same 有权
标题翻译：有机硅酸盐聚合物和包含其的绝缘膜
公开(公告)号：US07834119B2
公开(公告)日：2010-11-16
申请号：US10511639
申请日：2003-03-28
申请人： Jung-Won Kang , Min-Jin Ko , Dong-Seok Shin , Gwi-Gwon Kang , Myung-Sun Moon , Hye-Yeong Nam , Bum-Gyu Choi , Young-Duk Kim , Byung-Ro Kim , Won-Jong Kwon , Sang-Min Park
发明人： Jung-Won Kang , Min-Jin Ko , Dong-Seok Shin , Gwi-Gwon Kang , Myung-Sun Moon , Hye-Yeong Nam , Bum-Gyu Choi , Young-Duk Kim , Byung-Ro Kim , Won-Jong Kwon , Sang-Min Park
IPC分类号： C08G77/04
CPC分类号： C09D183/04 , C08G77/06 , H01L23/296 , H01L2924/0002 , H01L2924/00
摘要： The present invention relates to an organic silicate polymer prepared by mixing silane compound with organic solvent to prepare a first mixture, and hydrolyzing and condensing the first mixture by adding water and catalyst, the first mixture being selected from a group consisting of oxidized hydrosilane, cyclic siloxane, a second mixture of oxidized hydrosilane and silane or silane oligomer, and a third mixture of cyclic siloxane and silane or silane oligomer, a composition for forming an insulation film of semiconductor devices prepared by using the organic silicate polymer, a method for preparing an insulation film using the composition, and a semiconductor device comprising the insulation film.
摘要翻译：本发明涉及通过将硅烷化合物与有机溶剂混合以制备第一混合物并通过加入水和催化剂水解和缩合第一混合物制备的有机硅酸盐聚合物，第一混合物选自氧化氢硅烷，环状硅氧烷，氧化氢硅烷和硅烷或硅烷低聚物的第二混合物，以及环状硅氧烷和硅烷或硅烷低聚物的第三混合物，用于形成通过使用有机硅酸酯聚合物制备的半导体器件的绝缘膜的组合物，使用该组合物的绝缘膜，以及包含绝缘膜的半导体器件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式