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    • 3. 发明授权
    • Semiconductor devices having vertical device and non-vertical device and methods of forming the same
    • 具有垂直装置和非垂直装置的半导体装置及其形成方法
    • US09087922B2
    • 2015-07-21
    • US13412760
    • 2012-03-06
    • Min-Chul SunByung-Gook Park
    • Min-Chul SunByung-Gook Park
    • H01L29/78H01L21/8238H01L21/8234H01L27/092H01L27/11
    • H01L27/1104H01L21/823487H01L21/823885H01L27/092H01L29/7827
    • In a semiconductor device, a vertical transistor comprises: a first diffusion region on a substrate; a channel region on the first diffusion region and extending in a vertical direction; a second diffusion region on the channel region; and a gate electrode at a sidewall of, and insulated from, the channel region. A horizontal transistor is positioned on the substrate, the horizontal transistor comprising: a first diffusion region and a second diffusion region on the substrate and spaced apart from each other; a channel region on the substrate between the first diffusion region and the second diffusion region; and a gate electrode on the channel region and isolated from the channel region. A portion of a gate electrode of the vertical transistor and a portion of the gate electrode of the horizontal transistor are at a same vertical position in the vertical direction relative to the substrate.
    • 在半导体器件中,垂直晶体管包括:衬底上的第一扩散区; 在所述第一扩散区域上的沿垂直方向延伸的沟道区域; 沟道区上的第二扩散区; 以及在沟道区的侧壁处和绝缘的栅电极。 水平晶体管位于衬底上,水平晶体管包括:在衬底上的第一扩散区和第二扩散区,彼此间隔开; 在所述第一扩散区域和所述第二扩散区域之间的衬底上的沟道区域; 以及沟道区上的栅极,并与沟道区隔离。 垂直晶体管的栅电极的一部分和水平晶体管的栅电极的一部分在垂直方向上相对于衬底处于相同的垂直位置。
    • 4. 发明授权
    • Method for manufacturing a semiconductor device
    • 半导体器件的制造方法
    • US08455309B2
    • 2013-06-04
    • US13347361
    • 2012-01-10
    • Song-Ju LeeJeong Soo ParkByung-Gook ParkHyun Woo Kim
    • Song-Ju LeeJeong Soo ParkByung-Gook ParkHyun Woo Kim
    • H01L33/08
    • H01L29/66356H01L29/7391
    • A technology is capable of simplifying a process of manufacturing an asymmetric device in forming a Tunneling Field Effect Transistor (TFET) structure. A method for manufacturing a semiconductor device comprises forming a conductive pattern over a semiconductor substrate, implanting impurity ions with the conductive pattern as a mask to form a first junction region in the semiconductor substrate, forming a first insulating film planarized with the conductive pattern over the first junction region, etching the top of the conductive pattern to expose a sidewall of the first insulating film, forming a spacer at the sidewall of the first insulating film disposed over the conductive pattern, etching the conductive pattern with the spacer as an etching mask to form a gate pattern, and forming a second junction region in the semiconductor substrate with the gate pattern as a mask.
    • 一种技术能够简化在形成隧道场效应晶体管(TFET)结构中制造非对称器件的工艺。 一种制造半导体器件的方法,包括在半导体衬底上形成导电图案,将导电图案作为掩模注入杂质离子,以在半导体衬底中形成第一结区,在导电图案上形成平坦化的第一绝缘膜, 第一接合区域,蚀刻导电图案的顶部以暴露第一绝缘膜的侧壁,在布置在导电图案上的第一绝缘膜的侧壁处形成间隔物,用间隔物蚀刻导电图案作为蚀刻掩模, 形成栅极图案,并且以栅极图案作为掩模在半导体衬底中形成第二结区域。
    • 6. 发明授权
    • NAND flash memory array having pillar structure and fabricating method of the same
    • 具有柱结构的NAND闪存阵列及其制造方法
    • US08324060B2
    • 2012-12-04
    • US13222246
    • 2011-08-31
    • Byung Gook ParkSeong Jae Cho
    • Byung Gook ParkSeong Jae Cho
    • H01L21/336
    • H01L27/115H01L27/11521H01L27/11524
    • A method is provided for fabricating a NAND flash memory array having vertical channels and sidewall gate structure and a fabricating method of the same. The NAND flash memory array has insulator strip structure and one or more semiconductor strips are next to the both sides of the insulator strip. The NAND flash memory array allows for an improvement of the integrity by decreasing the memory cell area by half and less, and solves the problems of the conventional three-dimensional structure regarding isolation between not only channels but also source/drain regions at the bottom of trenches. The method for fabricating the NAND flash memory array having a pillar structure uses the conventional CMOS process and an etching process with minimum masks, enables to cut down costs.
    • 提供了一种用于制造具有垂直沟道和侧壁栅极结构的NAND快闪存储器阵列的方法及其制造方法。 NAND闪存阵列具有绝缘体带结构,并且一个或多个半导体条紧邻绝缘体条的两侧。 NAND闪存阵列允许通过将存储器单元面积减小一半或更少来提高整体性,并且解决了传统的三维结构关于不仅仅是通道之间的隔离的问题,而且解决了底部的源极/漏极区域 沟渠 制造具有柱状结构的NAND快闪存储器阵列的方法使用传统的CMOS工艺和具有最小掩模的蚀刻工艺,能够降低成本。
    • 9. 发明授权
    • Methods of fabricating nonvolatile semiconductor memory devices including a plurality of stripes having impurity layers therein
    • 制造包括其中具有杂质层的多个条纹的非易失性半导体存储器件的方法
    • US07906397B2
    • 2011-03-15
    • US12410010
    • 2009-03-24
    • Ki-whan SongByung-Gook Park
    • Ki-whan SongByung-Gook Park
    • H01L21/336
    • H01L27/115H01L27/11519H01L27/11568H01L29/792H01L29/7926
    • A nonvolatile semiconductor memory device includes a plurality of pillars protruding upward from a semiconductor substrate and having respective top surfaces and opposing sidewalls, a bit line on the top surfaces of the pillars and connecting a row of the pillars along a first direction, a pair of word lines on the opposing sidewalls of one of the plurality of pillars and crossing beneath the bit line, and a pair of memory layers interposed between respective ones of the pair of word lines and the one of the plurality of pillars. Methods of fabricating a nonvolatile semiconductor memory device include selectively etching a semiconductor substrate to form pluralities of stripes having opposing sidewalls and being arranged along a direction, forming memory layers and word lines along the sidewalls of the stripes selectively etching the stripes to form a plurality of pillars, and forming a bit line connecting the pillars and crossing above the word lines.
    • 非易失性半导体存储器件包括从半导体衬底向上突出并具有相应顶表面和相对侧壁的多个柱,在柱的顶表面上的位线,并沿着第一方向连接一排柱,一对 在多个柱中的一个柱的相对的侧壁上并且在位线下方交叉的字线以及插入在该对字线中的相应一个字线和多个柱之一之间的一对存储层。 制造非易失性半导体存储器件的方法包括选择性地蚀刻半导体衬底以形成具有相对侧壁并沿着方向布置的多个条纹,沿着条纹的侧壁形成存储层和字线,选择性地蚀刻条纹以形成多个 并且形成连接柱子并跨越字线上方的位线。