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1. 发明申请

US20120298625A1 NANOPOROUS MEMBRANE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：纳米膜及其制造方法
公开(公告)号：US20120298625A1
公开(公告)日：2012-11-29
申请号：US13371838
申请日：2012-02-13
申请人： Dae Sik Lee , Jun Bo Yoon , Dong Hoon Choi , Byung Kee Lee , Moon Youn Jung , Seung Hwan Kim
发明人： Dae Sik Lee , Jun Bo Yoon , Dong Hoon Choi , Byung Kee Lee , Moon Youn Jung , Seung Hwan Kim
IPC分类号： C23C16/56 , C23C16/44
CPC分类号： C23C14/06 , B01D67/0062 , B82Y30/00 , B82Y40/00 , C23C14/024 , C23C16/56 , C23F1/02
摘要： In the present invention, a nanoporous membrane having a columnar structure is manufactured through a deposition technology used in a semiconductor process, and the size of a nanopore is adjusted by etching the lower surface of the manufactured nanoporous membrane or using a seed layer and a nanobead layer so that scaling up is available at a lowered process temperature and the size of the nanopore can be easily adjusted when manufacturing the nanoporous membrane having a columnar structure.
摘要翻译：在本发明中，通过在半导体工艺中使用的沉积技术制造具有柱状结构的纳米多孔膜，并且通过蚀刻制造的纳米多孔膜的下表面或使用种子层和纳米棒来调整纳米孔的尺寸使得在降低的工艺温度下可以进行放大，并且当制造具有柱状结构的纳米多孔膜时，可以容易地调整纳米孔的尺寸。

2. 发明申请

US20110233737A1 METHOD FOR MANUFACTURING 3-DIMENSIONAL STRUCTURES USING THIN FILM WITH COLUMNAR NANO PORES AND MANUFACTURE THEREOF 有权
标题翻译：使用薄膜与三角纳米孔制造三维结构的方法及其制造方法
公开(公告)号：US20110233737A1
公开(公告)日：2011-09-29
申请号：US12992555
申请日：2010-05-28
申请人： Jun-Bo Yoon , Byung-Kee Lee , Dong-Hoon Choi , Hyun-Ho Yang
发明人： Jun-Bo Yoon , Byung-Kee Lee , Dong-Hoon Choi , Hyun-Ho Yang
IPC分类号： H01L23/58 , H01L21/56 , B05D5/12
CPC分类号： B81C1/00333 , B81C2203/0145
摘要： Disclosed is a method for manufacturing 3-dimensional structure using a thin film with a columnar nano pores and a manufacture thereof. A method for packaging an MEMS device or an NEMS device in accordance with an embodiment of the present invention includes: forming a sacrificial layer; forming a thin film having columnar nano pores formed therein by depositing one of a metallic material, an oxide, a nitride and a fluoride on the sacrificial layer; forming a support layer on the thin film and patterning the support layer; removing the sacrificial layer through use of the nano pores of the thin film parts of which are exposed by patterning the support layer; and forming a shielding layer on the thin film and the support layer.
摘要翻译：公开了使用具有柱状纳米孔的薄膜及其制造的三维结构的制造方法。根据本发明的实施例的用于封装MEMS器件或NEMS器件的方法包括：形成牺牲层; 通过在牺牲层上沉积金属材料，氧化物，氮化物和氟化物中的一种，形成其中形成有柱状纳米孔的薄膜; 在薄膜上形成支撑层并图案化支撑层; 通过利用其薄膜部分的纳米孔通过图案化载体层而去除牺牲层; 以及在所述薄膜和所述支撑层上形成屏蔽层。

3. 发明授权

US08445305B2 Method for manufacturing 3-dimensional structures using thin film with columnar nano pores and manufacture thereof 有权
标题翻译：使用具有柱状纳米孔的薄膜制造三维结构的方法及其制造方法
公开(公告)号：US08445305B2
公开(公告)日：2013-05-21
申请号：US12992555
申请日：2010-05-28
申请人： Jun-Bo Yoon , Byung-Kee Lee , Dong-Hoon Choi , Hyun-Ho Yang
发明人： Jun-Bo Yoon , Byung-Kee Lee , Dong-Hoon Choi , Hyun-Ho Yang
IPC分类号： H01L23/053 , H01L21/311
CPC分类号： B81C1/00333 , B81C2203/0145
摘要： Disclosed is a method for manufacturing 3-dimensional structure using a thin film with a columnar nano pores and a manufacture thereof. A method for packaging an MEMS device or an NEMS device in accordance with an embodiment of the present invention includes: forming a sacrificial layer; forming a thin film having columnar nano pores formed therein by depositing one of a metallic material, an oxide, a nitride and a fluoride on the sacrificial layer; forming a support layer on the thin film and patterning the support layer; removing the sacrificial layer through use of the nano pores of the thin film parts of which are exposed by patterning the support layer; and forming a shielding layer on the thin film and the support layer.
摘要翻译：公开了使用具有柱状纳米孔的薄膜及其制造的三维结构的制造方法。根据本发明的实施例的用于封装MEMS器件或NEMS器件的方法包括：形成牺牲层; 通过在牺牲层上沉积金属材料，氧化物，氮化物和氟化物中的一种，形成其中形成有柱状纳米孔的薄膜; 在薄膜上形成支撑层并图案化支撑层; 通过利用其薄膜部分的纳米孔通过图案化载体层而去除牺牲层; 以及在所述薄膜和所述支撑层上形成屏蔽层。

4. 发明授权

US08834730B2 Nanoporous membrane and manufacturing method thereof 有权
标题翻译：纳米多孔膜及其制造方法
公开(公告)号：US08834730B2
公开(公告)日：2014-09-16
申请号：US13371838
申请日：2012-02-13
申请人： Dae Sik Lee , Jun Bo Yoon , Dong Hoon Choi , Byung Kee Lee , Moon Youn Jung , Seung Hwan Kim
发明人： Dae Sik Lee , Jun Bo Yoon , Dong Hoon Choi , Byung Kee Lee , Moon Youn Jung , Seung Hwan Kim
IPC分类号： B31D3/00 , B82Y30/00 , C23C14/02 , C23C14/06 , B82Y40/00 , C23C16/56 , C23F1/02
CPC分类号： C23C14/06 , B01D67/0062 , B82Y30/00 , B82Y40/00 , C23C14/024 , C23C16/56 , C23F1/02
摘要： In the present invention, a nanoporous membrane having a columnar structure is manufactured through a deposition technology used in a semiconductor process, and the size of a nanopore is adjusted by etching the lower surface of the manufactured nanoporous membrane or using a seed layer and a nanobead layer so that scaling up is available at a lowered process temperature and the size of the nanopore can be easily adjusted when manufacturing the nanoporous membrane having a columnar structure.
摘要翻译：在本发明中，通过在半导体工艺中使用的沉积技术制造具有柱状结构的纳米多孔膜，并且通过蚀刻制造的纳米多孔膜的下表面或使用种子层和纳米棒来调整纳米孔的尺寸使得在降低的工艺温度下可以进行放大，并且当制造具有柱状结构的纳米多孔膜时，可以容易地调整纳米孔的尺寸。

5. 发明申请

US20090243063A1 PACKAGING METHOD OF MICRO ELECTRO MECHANICAL SYSTEM DEVICE AND PACKAGE THEREOF 审中-公开
标题翻译：微电子机械系统装置的包装方法及其包装
公开(公告)号：US20090243063A1
公开(公告)日：2009-10-01
申请号：US12404743
申请日：2009-03-16
申请人： Jun-Bo Yoon , Byung-Kee Lee , Weon-Wi Jang
发明人： Jun-Bo Yoon , Byung-Kee Lee , Weon-Wi Jang
IPC分类号： H01L23/02 , H01L21/50
CPC分类号： B81C1/00333 , B81C2201/0149 , B81C2203/0136 , B81C2203/0145 , B82Y30/00
摘要： Disclosed are a micro electro mechanical system (MEMS) device and a package thereof. The packaging method of a MEMS device comprises: sequentially forming a sacrificial layer, a support layer, and a block copolymer layer on a substrate on which the MEMS device is formed; self-assembling the block copolymer layer formed on the support layer; selectively etching a part of the self-assembled block copolymer layer to form a plurality of nano-pores; forming a plurality of etching holes in the support layer corresponding to the plurality of nano-pores using the block copolymer layer in which the plurality of nano-pores are formed as a mask; removing the sacrificial layer using the etching holes formed in the support layer; and forming a shielding layer on the support layer.
摘要翻译：公开了一种微机电系统（MEMS）装置及其封装。 MEMS器件的封装方法包括：在其上形成MEMS器件的衬底上顺序形成牺牲层，支撑层和嵌段共聚物层; 自组装形成在支撑层上的嵌段共聚物层; 选择性地蚀刻部分自组装嵌段共聚物层以形成多个纳米孔; 使用其中形成有多个纳米孔作为掩模的嵌段共聚物层，在与多个纳米孔相对应的支撑层中形成多个蚀刻孔; 使用形成在支撑层中的蚀刻孔去除牺牲层; 并在支撑层上形成屏蔽层。

6. 发明授权

US06358464B1 Method for making BaTiO3-based dielectric 失效
标题翻译：制备BaTiO3基电介质的方法
公开(公告)号：US06358464B1
公开(公告)日：2002-03-19
申请号：US09693930
申请日：2000-10-23
申请人： Byung Kee Lee , Yang Il Jung , Ho Yong Lee , Suk-Joong Kang , Sung Yoon Chung
发明人： Byung Kee Lee , Yang Il Jung , Ho Yong Lee , Suk-Joong Kang , Sung Yoon Chung
IPC分类号： C04B3332
CPC分类号： H01G4/1227 , C04B35/4682 , C04B35/626
摘要： A method for making a BaTiO3-based dielectric having a high dielectric constant and a low dielectric loss wherein, a BaTiO3-based body is subjected to a pre-heat treatment in a hydrogen (H2) atmosphere or a reducing atmosphere containing mixed gas of hydrogen and nitrogen in a ratio of hydrogen:nitrogen=5 to 100%:0 to 95% prior to a sintering process in the manufacture of dielectrics, in order to obtain a reduced average grain size of BaTiO3. By virtue of the reducing average grain size of BaTiO3, a BaTiO3-based dielectric having a high dielectric constant and a low dielectric loss is obtained. This method provides an advantage in that it is possible to make a BaTiO3-based dielectric having a very small average grain size while having a high relative density in accordance with a simple heat treatment conducted for pure BaTiO3 or even for BaTiO3 added with an additive in a reducing atmosphere at a temperature less than a liquid phase forming temperature, prior to a sintering process for sintering the BaTiO3.
摘要翻译：一种制备具有高介电常数和低介电损耗的BaTiO3基电介质的方法，其中将BaTiO 3基体在氢（H 2）气氛或含有氢气混合气体的还原气氛中进行预热处理并且在制造电介质的烧结过程之前，氮：氮= 5〜100％：0〜95％的氮，以获得BaTiO 3的平均粒径的降低。由于BaTiO 3的平均粒径减小，得到介电常数高，介电损耗低的BaTiO3系电介质。该方法的优点在于，可以根据纯BaTiO 3或甚至添加添加剂的BaTiO 3的简单热处理，制造具有非常小的平均晶粒尺寸的BaTiO 3基电介质，同时具有高的相对密度在烧结BaTiO 3的烧结工艺之前，在低于液相形成温度的温度下还原气氛。

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