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1. 发明授权

US06409930B1 Lamination of circuit sub-elements while assuring registration 失效
标题翻译：电路子元件的层叠，同时确保注册
公开(公告)号：US06409930B1
公开(公告)日：2002-06-25
申请号：US09432475
申请日：1999-11-01
申请人： Donald A. Whitehurst , Paul D. Wyatt , Jose F. Brenes , Jeffrey M. Borning , Bruce A. Finger
发明人： Donald A. Whitehurst , Paul D. Wyatt , Jose F. Brenes , Jeffrey M. Borning , Bruce A. Finger
IPC分类号： H01B1300
CPC分类号： H05K3/067 , C23F1/02 , C23F1/36 , C23F1/44 , H01L21/32134 , H05K3/061 , H05K3/4685 , H05K2201/0338 , H05K2203/0361 , H05K2203/0384 , H05K2203/1476
摘要： A process for the formation of an article having multiple electrical circuits comprises: providing a first sub-element comprising in sequence a first metal layer of copper in electrical contact with a second metal layer of aluminum in electrical contact with a third metal layer of copper; etching an electrical circuit design in the first metal layer and in a separate etch step, etching away at least 10%, but less than 100% of the second metal layer to provide electrical connections between the first metal layer and the third metal layer; etching an electrical circuit design into the third metal layer; adhering an etched surface comprising the circuit design of the first or third metal layer to a first surface of a support layer to form a circuit board. The process may etch the first and third metal layers simultaneously or sequentially. After adhering an etched surface comprising the circuit design of the first or third metal layer in registration to a support layer to form a circuit board, an additional step may be performed, which additional step is selected from the group consisting of: a) adhering an etched surface of a second tri-metal subelement to a second surface of the support layer and b) adhering a second support layer to said third or first metal layer, respectively, and adhering an etched surface of a second tri-metal subelement to the second support layer. The registration between layers may be effected by visual, mechanical, optical or electronic systems with visually or mechanically readable registration marks, radiation through holes, and/or posts used for identifying positions of desired registration between layers.
摘要翻译：用于形成具有多个电路的制品的方法包括：提供第一子元件，其顺序地包括与第三金属铜层电接触的与铝的第二金属层电接触的第一金属铜层; 在第一金属层中蚀刻电路设计，并且在单独的蚀刻步骤中，蚀刻掉第二金属层的至少10％但小于100％，以提供第一金属层和第三金属层之间的电连接;蚀刻将电路设计成第三金属层;将包含第一或第三金属层的电路设计的蚀刻表面粘附到支撑层的第一表面以形成电路板。该方法可以同时或顺序蚀刻第一和第三金属层。在将包括第一或第三金属层的电路设计的蚀刻表面粘附到支撑层以形成电路板之后，可以执行附加步骤，该附加步骤选自以下组中：a）将第二三金属子元件的蚀刻表面分别提供到支撑层的第二表面，b）分别将第二支撑层粘附到所述第三或第一金属层，并将第二三金属子元件的蚀刻表面粘附到第二支撑层之间的配准可以通过视觉，机械，光学或电子系统实现，其具有用于识别层之间期望的配准位置的视觉或机械可读配准标记，辐射通孔和/或柱。

2. 发明授权

US06365057B1 Circuit manufacturing using etched tri-metal media 失效
标题翻译：使用蚀刻三金属介质的电路制造
公开(公告)号：US06365057B1
公开(公告)日：2002-04-02
申请号：US09431445
申请日：1999-11-01
申请人： Donald A. Whitehurst , Dennis D. Mattson , Paul D. Wyatt , Charles Ring , Michael J. Dufresne , Jose F. Brenes , Bruce A. Finger , David R. Zeipelt
发明人： Donald A. Whitehurst , Dennis D. Mattson , Paul D. Wyatt , Charles Ring , Michael J. Dufresne , Jose F. Brenes , Bruce A. Finger , David R. Zeipelt
IPC分类号： H05K300
CPC分类号： C23F1/36 , C23F1/02 , C23F1/44 , H01L21/32134 , H05K3/061 , H05K3/067 , H05K3/4685 , H05K2201/0338 , H05K2203/0361 , H05K2203/0384 , H05K2203/1476
摘要： A process for the formation of an article having multiple electrical circuits comprises: providing a first sub-element comprising in sequence a first metal layer of copper in electrical contact with a second metal layer of aluminum in electrical contact with a third metal layer of copper; etching an electrical circuit design in the first metal layer and in a separate etch step, etching away at least 10%, but less than 100% of the second metal layer to provide electrical connections between the first metal layer and the third metal layer; etching an electrical circuit design into the third metal layer; adhering an etched surface comprising the circuit design of the first or third metal layer to a first surface of a support layer to form a circuit board. The process may etch the first and third metal layers simultaneously or sequentially. After adhering an etched surface comprising the circuit design of the first or third metal layer to a support layer to form a circuit board, an additional step may be performed, which additional step is selected from the group consisting of; a) adhering an etched surface of a second tri-metal subelement to a second surface of the support layer and b) adhering a second support layer to said third or first metal layer, respectively, and adhering an etched surface of a second tri-metal subelement to the second support layer.
摘要翻译：用于形成具有多个电路的制品的方法包括：提供第一子元件，其顺序地包括与第三金属铜层电接触的与铝的第二金属层电接触的第一金属铜层; 在第一金属层中蚀刻电路设计，并且在单独的蚀刻步骤中，蚀刻掉第二金属层的至少10％但小于100％，以提供第一金属层和第三金属层之间的电连接;蚀刻将电路设计成第三金属层;将包含第一或第三金属层的电路设计的蚀刻表面粘附到支撑层的第一表面以形成电路板。该工艺可以同时蚀刻第一和第三金属层或顺序地。在将包括第一或第三金属层的电路设计的蚀刻表面粘附到支撑层以形成电路板之后，可以执行附加步骤，该附加步骤选自由以下组成的组：a）将蚀刻表面的第二三金属子元件分别连接到支撑层的第二表面，b）分别将第二支撑层粘附到所述第三或第一金属层，并将第二三金属子元件的蚀刻表面粘附到第二支撑层。

3. 发明授权

US06468439B1 Etching of metallic composite articles 失效
标题翻译：金属复合制品的蚀刻
公开(公告)号：US06468439B1
公开(公告)日：2002-10-22
申请号：US09431649
申请日：1999-11-01
申请人： Donald A. Whitehurst , Paul D. Wyatt , Charles Ring , Michael J. Dufresne , Jose F. Brenes , Bruce A. Finger , Dave R. Zeipelt
发明人： Donald A. Whitehurst , Paul D. Wyatt , Charles Ring , Michael J. Dufresne , Jose F. Brenes , Bruce A. Finger , Dave R. Zeipelt
IPC分类号： C23F100
CPC分类号： H01L21/32134 , C23F1/02 , C23F1/36 , C23F1/44 , H05K3/061 , H05K3/067 , H05K3/4685 , H05K2201/0338 , H05K2203/0361 , H05K2203/0384 , H05K2203/1476
摘要： A process for the etching of multiple layers of at least two different metals comprisies: forming a resist pattern over a first layer of metal, said resist pattern having a pattern of openings therein, applying a first etch solution onto said resist pattern so that at least some etch solution contacts exposed areas of the first layer of metal, etching away the majority of the depth of the first metal in exposed areas of metal in the first layer of metal, applying a second etch solution onto the resist pattern the second etch solution having a rate of etch towards the first metal as compared to the first etch solution that is at least 20% less than the millimeter/minute rate of etch of the first etch solution at the same etch solution temperature, removing the second etch solution from said resist pattern after at least the first metal layer has been etched sufficiently to expose areas of a second metal layer underlying the first metal layer by forming an etched first metal layer, and applying a third etch solution to said etched first metal layer, the third etch solution having a faster rate of etch towards the second metal than towards the first metal to etch into said second metal layer without destroying the etched first metal layer.
摘要翻译：用于蚀刻多层至少两种不同金属的方法包括：在第一金属层上形成抗蚀剂图案，所述抗蚀剂图案具有其中的开口图案，将第一蚀刻溶液施加到所述抗蚀剂图案上，使得至少一些蚀刻溶液接触第一金属层的暴露区域，在第一金属层的暴露的金属区域蚀刻掉第一金属的大部分深度，将第二蚀刻溶液施加到抗蚀剂图案上，该第二蚀刻溶液具有与第一蚀刻溶液相比，第一蚀刻溶液的蚀刻速率比在相同蚀刻溶液温度下的第一蚀刻溶液的毫米/分钟蚀刻速率小至少20％，从所述抗蚀剂去除第二蚀刻溶液在至少第一金属层已经被充分蚀刻以通过形成蚀刻的第一金属层来暴露第一金属层下面的第二金属层的区域之后的图案，并且ap 对所述蚀刻的第一金属层施加第三蚀刻溶液，所述第三蚀刻溶液具有比朝向所述第一金属蚀刻到所述第二金属层中更快的朝向所述第二金属的蚀刻速率，而不破坏所蚀刻的第一金属层。

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