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1. 发明授权

US09666547B2 Method of refining solder materials 有权
公开(公告)号：US09666547B2
公开(公告)日：2017-05-30
申请号：US12769130
申请日：2010-04-28
申请人： Martin W. Weiser , Nancy F. Dean , Brett M. Clark , Michael J. Bossio , Ronald H. Fleming , James P. Flint
发明人： Martin W. Weiser , Nancy F. Dean , Brett M. Clark , Michael J. Bossio , Ronald H. Fleming , James P. Flint
IPC分类号： H01L21/44 , H01L23/00 , B23K35/02 , C25C1/18 , H01L23/498 , B23K35/26 , C22B13/06 , H01L23/31 , H05K3/34
CPC分类号： H01L24/10 , B23K35/025 , B23K35/26 , B23K35/268 , C22B13/06 , C25C1/18 , H01L23/3128 , H01L23/49816 , H01L24/13 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/16225 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01088 , H01L2924/01092 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/3463 , H05K3/3484 , H01L2924/00 , H01L2224/05599
摘要： The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.

2. 发明申请

US20100206133A1 METHOD OF REFINING SOLDER MATERIALS 有权
标题翻译：精炼金属材料的方法
公开(公告)号：US20100206133A1
公开(公告)日：2010-08-19
申请号：US12769130
申请日：2010-04-28
申请人： Martin W. Weiser , Nancy F. Dean , Brett M. Clark , Michael J. Bossio , Ronald H. Fleming , James P. Flint
发明人： Martin W. Weiser , Nancy F. Dean , Brett M. Clark , Michael J. Bossio , Ronald H. Fleming , James P. Flint
IPC分类号： C22B9/00
CPC分类号： H01L24/10 , B23K35/025 , B23K35/26 , B23K35/268 , C22B13/06 , C25C1/18 , H01L23/3128 , H01L23/49816 , H01L24/13 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/16225 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01088 , H01L2924/01092 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/3463 , H05K3/3484 , H01L2924/00 , H01L2224/05599
摘要： The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
摘要翻译：本发明包括具有低浓度α粒子发射体的焊料材料，并且包括纯化材料以降低材料内的α粒子发射体浓度的方法。本发明包括通过纯化材料来减少各种含铅和无铅材料中的α粒子通量的方法。本发明还包括在纯化材料期间估计低浓度的一种或多种α粒子发射体的分馏的方法。

3. 发明授权

US07521286B2 Methods of refining lead-containing materials 有权
标题翻译：含铅材料的精炼方法
公开(公告)号：US07521286B2
公开(公告)日：2009-04-21
申请号：US11418668
申请日：2006-05-05
申请人： Martin W. Weiser , Nancy F. Dean , Brett M. Clark , Michael J. Bossio , Ronald H. Fleming , James P. Flint
发明人： Martin W. Weiser , Nancy F. Dean , Brett M. Clark , Michael J. Bossio , Ronald H. Fleming , James P. Flint
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L24/10 , B23K35/025 , B23K35/26 , B23K35/268 , C22B13/06 , C25C1/18 , H01L23/3128 , H01L23/49816 , H01L24/13 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/13099 , H01L2224/16225 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/01088 , H01L2924/01092 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H05K3/3463 , H05K3/3484 , H01L2924/00 , H01L2224/05599
摘要： The invention includes solder materials having low concentrations of alpha particle emitters, and includes methods of purification of materials to reduce a concentration of alpha particle emitters within the materials. The invention includes methods of reducing alpha particle flux in various lead-containing and lead-free materials through purification of the materials. The invention also includes methods of estimating the fractionation of a low concentration of one or more alpha particle emitters during purification of a material.
摘要翻译：本发明包括具有低浓度α粒子发射体的焊料材料，并且包括纯化材料以降低材料内的α粒子发射体浓度的方法。本发明包括通过纯化材料来减少各种含铅和无铅材料中的α粒子通量的方法。本发明还包括在纯化材料期间估计低浓度的一种或多种α粒子发射体的分馏的方法。

4. 发明申请

US20080197017A1 Target/Backing Plate Constructions, and Methods of Forming Them 审中-公开
标题翻译：目标/背板结构及其形成方法
公开(公告)号：US20080197017A1
公开(公告)日：2008-08-21
申请号：US10556174
申请日：2004-08-10
申请人： Wuwen Yi , Ravi Rastogi , Jaeyoon Kim , Brett M. Clark
发明人： Wuwen Yi , Ravi Rastogi , Jaeyoon Kim , Brett M. Clark
IPC分类号： C23C14/34
CPC分类号： H01J37/3435 , C23C14/3407
摘要： The Invention includes target/backing plate constructions and methods of forming target/backing plate constructions. The targets and backing plates can be bonded to one another through an appropriate interlayer. The targets can comprise one or more of aluminum, copper, tantalum and titanium. The interlayer can comprise one or more of silver, copper, nickel, tin, titanium and indium. Target/backing plate constructions of the present invention can have bond strengths of at least 20 ksi and an average grain size within the target of less than 80 microns.
摘要翻译：本发明包括目标/背板结构以及形成靶/背板结构的方法。靶材和背板可以通过适当的中间层彼此粘结。靶可以包括铝，铜，钽和钛中的一种或多种。中间层可以包括银，铜，镍，锡，钛和铟中的一种或多种。本发明的靶/背板结构可以具有至少20ksi的键合强度和小于80微米的目标内的平均晶粒尺寸。

5. 发明授权

US08030082B2 Liquid-particle analysis of metal materials 有权
标题翻译：金属材料的液 - 液分析
公开(公告)号：US08030082B2
公开(公告)日：2011-10-04
申请号：US11331489
申请日：2006-01-13
申请人： Susan D. Strothers , Janine K. Kardokus , Brett M. Clark
发明人： Susan D. Strothers , Janine K. Kardokus , Brett M. Clark
IPC分类号： G01N33/20 , G01N33/53
CPC分类号： G01N33/20
摘要： The invention includes a method of detecting impurities in a metal-containing article. A portion of metal material is removed from a metal article and is solubilized in an acid or base-comprising liquid to produce a liquid sample. The liquid sample is subjected to an incident laser beam and light scattered from the sample is detected. The invention includes a method of analyzing a physical vapor deposition target material. A portion of target material is removed from the target and is rinsed with an acid-comprising solution. The portion of target material is dissolved to produce a liquid sample. The sample is subjected to an incident laser beam and scatter of the laser beam is detected to determine the number of particles present in the sample within a particular size range.
摘要翻译：本发明包括检测含金属物品中的杂质的方法。将一部分金属材料从金属制品中除去并溶解在含酸或碱的液体中以产生液体样品。对液体样品进行入射的激光束，并且检测从样品散射的光。本发明包括分析物理气相沉积靶材料的方法。将目标材料的一部分从靶上除去并用含酸溶液冲洗。将目标材料的部分溶解以产生液体样品。对样品进行入射激光束，并且检测激光束的散射以确定在特定尺寸范围内存在于样品中的颗粒的数量。

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