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    • 3. 发明授权
    • Defect review SEM with automatically switchable detector
    • 缺陷检查扫描仪具有自动切换检测器
    • US06300629B1
    • 2001-10-09
    • US09164230
    • 1998-09-30
    • Bradley Lawrence
    • Bradley Lawrence
    • G01N23225
    • H01J37/28G01N23/225H01J37/244H01J2237/24475H01J2237/2448H01J2237/24485
    • A method and apparatus is provided for imaging of topographic and material features of defects on the surface of a semiconductor wafer with simultaneous display of multiple SEM images generated by a single detector of backscattered and secondary electrons. A primary beam is directed at a specimen to release secondary electrons therefrom and to backscatter electrons of the particle beam therefrom, which electrons are detected by a single detector, while an imager produces and displays images responsive to the detector, and an electrode directs the path of the secondary electrons. A charge controller controls the charge placed on the electrode such that the imager produces a plurality of different images desired by the user, which are displayed substantially simultaneously by the imager. This enables inspection of a location of interest on the surface of a wafer using several images, each image possibly having different attributes, thereby facilitating comparison of images of defect sites and reference sites, identification of defects, and classification of defects.
    • 提供了一种方法和装置,用于对半导体晶片的表面上的缺陷的地形和材料特征进行成像,同时显示由单一的反向散射和二次电子检测器产生的多个SEM图像。 主光束被引导到样本以从其中释放二次电子并且从其中反射散射电子的粒子束,电子由单个检测器检测,而成像器产生并显示响应于检测器的图像,并且电极引导路径 的二次电子。 充电控制器控制放置在电极上的电荷,使得成像器产生用户所期望的多个不同的图像,这些图像基本上由成像器同时显示。 这使得可以使用几个图像来检查晶片表面上的感兴趣的位置,每个图像可能具有不同的属性,从而便于比较缺陷位点和参考位置的图像,缺陷的识别和缺陷的分类。