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    • 3. 发明授权
    • Method for implementing vibration suppression system under control from a remote site
    • 在远程站点控制下实现振动抑制系统的方法
    • US07373262B2
    • 2008-05-13
    • US11262070
    • 2005-10-27
    • Baruch PletnerGregory A. Zvonar
    • Baruch PletnerGregory A. Zvonar
    • G01F17/00
    • F16F15/02G05D19/02
    • A method of implementing vibration suppression at equipment residing at a local site includes the steps of transmitting a prompt from a remote site to the local site, automatically sensing vibration response information from the equipment in response to the prompt, and transmitting the sensed vibration response information to the remote site. The method further includes the steps of analyzing the sensed vibration response information at the remote site and creating a vibration suppression algorithm based on the analyzed information. Another prompt is then transferred from the remote site to the local site, and in response thereto, vibrations are induced within the equipment at the local site in accordance with the vibration suppression algorithm, and additional vibration response information from the equipment is sensed. The additional vibration response information is transmitted to and analyzed at the remote site where a modified suppression algorithm is created and transmitted to the local site for suppression of vibrations in the equipment.
    • 在驻留在当地的设备上实施振动抑制的方法包括以下步骤:从远程站点向当地站点发送提示,响应于提示自动地感测来自设备的振动响应信息,以及传送所感测到的振动响应信息 到远程站点。 该方法还包括以下步骤:在远程站点分析感测到的振动响应信息,并基于分析的信息创建振动抑制算法。 然后将另一个提示从远程站点传送到本地站点,并且响应于此,根据振动抑制算法在本地的设备内引起振动,并且感测到来自设备的附加的振动响应信息。 附加的振动响应信息被发送到远程站点,并在其中创建修改的抑制算法并将其传输到本地站点,以抑制设备中的振动。
    • 6. 发明授权
    • Unimorph/bimorph piezoelectric package
    • Unimorph /双压电晶片压电封装
    • US07656076B1
    • 2010-02-02
    • US12173696
    • 2008-07-15
    • Baruch PletnerGrace R. KessenichWesley T. Horth
    • Baruch PletnerGrace R. KessenichWesley T. Horth
    • H01L41/08
    • F16F15/005H01L41/0475H01L41/0973H01L41/312Y10T29/42
    • A piezoelectric package comprises an upper and lower piezoelectric plates, each having opposing electrodes. The piezoelectric package further comprises an electrically insulative structure encapsulating the piezoelectric plates. The piezoelectric package further comprises first and second external connectors mounted to the insulative structure. The connectors respectively have connector terminals that are electrically coupled to the electrodes in different orders, and have geometric arrangements that are identical, such that a single interface device can be selectively mated to either of the connectors. The piezoelectric package may be incorporated into a system that comprises electronic circuitry configured for operating the piezoelectric package, and a single interface device electrically coupled between the electronic circuitry and either of the external connectors of the piezoelectric package to selectively configure the package between a unimorph and a bimorph.
    • 压电封装包括上和下压电板,每个具有相对的电极。 压电封装还包括封装压电板的电绝缘结构。 压电封装还包括安装到绝缘结构的第一和第二外部连接器。 连接器分别具有以不同顺序电耦合到电极的连接器端子,并且具有相同的几何布置,使得单个接口装置可以选择性地配合到任一个连接器。 压电封装可以并入到包括被配置为用于操作压电封装的电子电路的系统中,以及电耦合在电子电路和压电封装的任一个外部连接器之间的单个接口装置,以选择性地将封装配置在单压电晶片和 双压电晶片
    • 7. 发明申请
    • UNIMORPH/BIMORPH PIEZOELECTRIC PACKAGE
    • UNIMORPH / BIMORPH压电封装
    • US20100013352A1
    • 2010-01-21
    • US12173696
    • 2008-07-15
    • Baruch PletnerGrace R. KessenichWesley T. Horth
    • Baruch PletnerGrace R. KessenichWesley T. Horth
    • H02N2/06H01L41/053H01L41/22
    • F16F15/005H01L41/0475H01L41/0973H01L41/312Y10T29/42
    • A piezoelectric package comprises an upper and lower piezoelectric plates, each having opposing electrodes. The piezoelectric package further comprises an electrically insulative structure encapsulating the piezoelectric plates. The piezoelectric package further comprises first and second external connectors mounted to the insulative structure. The connectors respectively have connector terminals that are electrically coupled to the electrodes in different orders, and have geometric arrangements that are identical, such that a single interface device can be selectively mated to either of the connectors. The piezoelectric package may be incorporated into a system that comprises electronic circuitry configured for operating the piezoelectric package, and a single interface device electrically coupled between the electronic circuitry and either of the external connectors of the piezoelectric package to selectively configure the package between a unimorph and a bimorph.
    • 压电封装包括上和下压电板,每个具有相对的电极。 压电封装还包括封装压电板的电绝缘结构。 压电封装还包括安装到绝缘结构的第一和第二外部连接器。 连接器分别具有以不同顺序电耦合到电极的连接器端子,并且具有相同的几何布置,使得单个接口装置可以选择性地配合到任一个连接器。 压电封装可以并入到包括被配置为用于操作压电封装的电子电路的系统中,以及电耦合在电子电路和压电封装的任一外部连接器之间的单个接口装置,以选择性地将封装配置在单压电晶片和 双压电晶片
    • 8. 发明授权
    • Kit and method for constructing vibration suppression and/or sensing units
    • 用于构造振动抑制和/或感测单元的套件和方法
    • US07482731B2
    • 2009-01-27
    • US11260956
    • 2005-10-27
    • Baruch PletnerGregory A. Zvonar
    • Baruch PletnerGregory A. Zvonar
    • H01L41/08
    • F16F15/00
    • Kits and methods for building devices for analyzing or suppressing vibrations in equipment are provided. An electrical-mechanical transducer is configured to be placed in operative contact with the equipment. The transducer may be directly mounted to a base plate that is configured for being mounted to the equipment. A first device (e.g., a printed circuit board) carrying electronic componentry is configured for transmitting vibration drive signals to the electrical-mechanical transducer. A second device (e.g., a printed circuit board) carrying electronic componentry is configured for receiving vibration sensing signals from the electrical-mechanical transducer. The first and second devices can be interchangeably mounted within a housing that can be mounted to the base plate. The housing may comprise an aperture for receiving the electrical-mechanical transducer.
    • 提供了用于构建设备分析或抑制设备振动的装置和方法。 电气机械换能器被配置成与设备操作地接触。 换能器可以直接安装到被配置为安装到设备的基板上。 承载电子组件的第一装置(例如,印刷电路板)被配置为将振动驱动信号传送到机电换能器。 承载电子组件的第二装置(例如,印刷电路板)被配置为用于接收来自机电换能器的振动感测信号。 第一和第二装置可以互换地安装在可以安装到基板的壳体内。 壳体可以包括用于接收机电换能器的孔。
    • 9. 发明申请
    • Method for implementing vibration suppression system under control from a remote site
    • 在远程站点控制下实现振动抑制系统的方法
    • US20060190197A1
    • 2006-08-24
    • US11262070
    • 2005-10-27
    • Baruch PletnerGregory Zvonar
    • Baruch PletnerGregory Zvonar
    • G01L7/00
    • F16F15/02G05D19/02
    • A method of implementing vibration suppression at equipment residing at a local site is provided. The method comprises transmitting a prompt from a remote site to the local site, automatically sensing vibration response information from the equipment in response to the prompt, and transmitting the sensed vibration response information to the remote site. The method further comprises analyzing the sensed vibration response information at the remote site, and creating a vibration suppression algorithm based on the analyzed information. Another prompt is then transmitted from the remote site to the local site, and in response thereto, vibrations are induced within the equipment at the local site in accordance with the vibration suppression algorithm, and additional vibration response information from the equipment is sensed. The additional vibration response information is transmitted to, and analyzed at, the remote site, where a modified vibration suppression algorithm is created and transmitted to the local site for suppression of vibrations in the equipment.
    • 提供了一种在驻留在当地场地的设备上实施振动抑制的方法。 该方法包括从远程站点向当地站点发送提示,响应于提示自动感测来自设备的振动响应信息,并将感测到的振动响应信息发送到远程站点。 该方法还包括分析在远程站点处感测的振动响应信息,以及基于分析的信息创建振动抑制算法。 然后将另一提示从远程站点发送到本地站点,并且响应于此,根据振动抑制算法在本地的设备内引起振动,并且感测到来自设备的附加振动响应信息。 附加的振动响应信息被发送到远程站点并在其中进行分析,其中创建修改的振动抑制算法并将其发送到局部位置以抑制设备中的振动。
    • 10. 发明授权
    • Kit and method for constructing vibration suppression and/or sensing units
    • 用于构造振动抑制和/或感测单元的套件和方法
    • US07701111B2
    • 2010-04-20
    • US12208119
    • 2008-09-10
    • Baruch PletnerGregory A. Zvonar
    • Baruch PletnerGregory A. Zvonar
    • H01L41/08
    • F16F15/00
    • Kits and methods for building devices for analyzing or suppressing vibrations in equipment are provided. An electrical-mechanical transducer is configured to be placed in operative contact with the equipment. The transducer may be directly mounted to a base plate that is configured for being mounted to the equipment. A first device (e.g., a printed circuit board) carrying electronic componentry is configured for transmitting vibration drive signals to the electrical-mechanical transducer. A second device (e.g., a printed circuit board) carrying electronic componentry is configured for receiving vibration sensing signals from the electrical-mechanical transducer. The first and second devices can be interchangeably mounted within a housing that can be mounted to the base plate. The housing may comprise an aperture for receiving the electrical-mechanical transducer.
    • 提供了用于构建设备分析或抑制设备振动的装置和方法。 电气机械换能器被配置成与设备操作地接触。 换能器可以直接安装到被配置为安装到设备的基板上。 承载电子组件的第一装置(例如,印刷电路板)被配置为将振动驱动信号传送到机电换能器。 承载电子组件的第二装置(例如,印刷电路板)被配置为用于接收来自机电换能器的振动感测信号。 第一和第二装置可以互换地安装在可以安装到基板的壳体内。 壳体可以包括用于接收机电换能器的孔。