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    • 6. 发明授权
    • Method for feeding a granular raw material and feeding apparatus
    • 颗粒状原料供给装置的供给方法
    • US5876496A
    • 1999-03-02
    • US827105
    • 1997-03-17
    • Naoki NagaiChihiro TashiroAtsushi OzakiMichiaki Oda
    • Naoki NagaiChihiro TashiroAtsushi OzakiMichiaki Oda
    • C30B15/02C30B29/06
    • C30B15/02Y10T117/1056Y10T117/1064
    • A feeding reservoir 11 for intermittently or continuously feeding granular raw material into a pulling apparatus 1, a chamber 13 connected to the feeding reservoir 11 through a gate valve 12, a granular raw material supply section 15 by which the granular raw material is supplied to the chamber 13 through a gate valve 14 and a pressure adjustment means 20 which adjusts the inner pressure of the chamber 13 is provided, and the granular raw material is fed to the feeding reservoir 11 while maintaining the inner pressure of the feeding reservoir 11 as the same as the inner pressure of the single crystal pulling apparatus 1. This feeding method and structure makes it possible to feed an additional amount of granular raw material even during the continuous charging process and or the recharging process without interrupting the process and also to pull a heavy single crystal rod with a large diameter without increasing the capacity of the feeding reservoir.
    • 用于将颗粒状原料间歇地或连续地供给到牵引装置1的供给储存器11,通过闸阀12连接到供给储存器11的室13,粒状原料供给部15,向颗粒状原料供给部 设置通过闸阀14的室13和调节室13的内部压力的压力调节装置20,并且将颗粒状原料供给到供给储存器11,同时保持供给储存器11的内部压力相同 作为单晶拉制装置1的内压。该供给方法和结构使得即使在连续充电过程和充电过程中也可以不间断地进行加工而再次加入附加量的颗粒状原料 单晶棒直径大,不增加供料槽的容量。
    • 8. 发明授权
    • Semiconductor ingot machining method
    • 半导体锭加工方法
    • US5484326A
    • 1996-01-16
    • US159501
    • 1993-11-30
    • Yoshihiro HiranoAtsushi Ozaki
    • Yoshihiro HiranoAtsushi Ozaki
    • B24B1/00B23D5/00B28D1/22B28D5/00B28D5/02C30B33/00G01N23/207H01L21/304B24B7/00
    • B24B5/50B23D5/00C30B33/00
    • The cutting process is executed after the grinding process and for one semiconductor ingot, one grinding device and one inner diameter saw slicing machine are used to perform grinding process and cutting process respectively. During the grinding process, the entirety of the cylindrical body portion of the semiconductor ingot is cylindrically ground, a portion of the tail end is cylindrically ground, the orientation flat position is determined and an orientation flat is formed by surface grinding. During the cutting process the tail portion is cut off and a sample for lifetime measurement is taken and a wafer sample is cut off from the end of the cylindrical body portion on the tail side. The semiconductor ingot is reversed in the direction of the axis and the head portion of the semiconductor ingot is cut off and a wafer sample is cut off from the cylindrical body portion on the head side. Wafer samples are cut off from the end of the cylindrical body portion on the head side and from the middle portion of cylindrical body portion to divide the cylindrical body portion into two blocks.
    • 在研磨过程之后执行切割过程,并且对于一个半导体锭,一个研磨装置和一个内径锯切机分别进行研磨处理和切割处理。 在研磨过程中,半导体锭的圆筒体部分的整体是圆柱形的,尾端的一部分是圆柱形的,确定取向平面位置,并通过表面研磨形成取向平面。 在切割过程中,尾部被切断,并且进行寿命测量的样品,并且从尾侧的圆柱体部分的端部切下晶片样品。 半导体锭在轴线方向上反转,并且半导体锭的头部被切断,并且晶片样品从头侧的圆柱形主体部分切除。 将晶片样品从头侧的圆筒体部分的端部和圆筒体部分的中间部分切除,以将圆柱体部分分成两个块。