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1. 发明授权

US09048276B2 Matched coefficient of thermal expansion for an electrostatic chuck 有权
标题翻译：静电吸盘匹配的热膨胀系数
公开(公告)号：US09048276B2
公开(公告)日：2015-06-02
申请号：US13116732
申请日：2011-05-26
申请人： William D. Lee , Ashwin M. Purohit
发明人： William D. Lee , Ashwin M. Purohit
IPC分类号： B23B31/28 , H01L21/687 , H01L21/683 , H01L21/67
CPC分类号： H01L21/6831 , B23B31/28 , H01L21/67103 , H01L21/6833 , Y10T29/49117 , Y10T279/23
摘要： An apparatus and method are provided for selecting materials for forming an electrostatic clamp. The electrostatic clamp has a backing plate having a first coefficient of thermal expansion, wherein the backing plate provides structural support and rigidity to the electrostatic clamp. The electrostatic clamp further has a clamping plate having a clamping surface associated with contact with a workpiece, wherein the clamping plate has a second coefficient of thermal expansion associated therewith. The clamping plate is bonded, attached or grown to the backing plate, wherein minimal deflection of the clamping plate is evident across a predetermined temperature range. The first coefficient of thermal expansion and second coefficient of thermal expansion, for example, are substantially similar, and vary by no greater than a factor of three.
摘要翻译：提供了用于选择用于形成静电夹的材料的装置和方法。静电夹具具有第一热膨胀系数的背板，其中背板为静电夹具提供结构支撑和刚性。静电夹具还具有夹持板，该夹板具有与工件接触的夹紧表面，其中夹持板具有与之相关联的第二热膨胀系数。夹板被粘合，附接或生长到背板，其中夹板的最小偏转在预定温度范围内是明显的。例如，第一热膨胀系数和第二热膨胀系数基本相似，并且变化不大于三分之一。

2. 发明授权

US08422193B2 Annulus clamping and backside gas cooled electrostatic chuck 有权
标题翻译：环形夹紧和背面气体冷却静电卡盘
公开(公告)号：US08422193B2
公开(公告)日：2013-04-16
申请号：US11641334
申请日：2006-12-19
申请人： Teng Chao D. Tao , William D. Lee , Marvin R. LaFontaine , Ashwin M. Purohit
发明人： Teng Chao D. Tao , William D. Lee , Marvin R. LaFontaine , Ashwin M. Purohit
IPC分类号： H01L21/683
CPC分类号： H01L21/6833
摘要： An electrostatic clamp (ESC), system, and method for clamping a workpiece is provided. A clamping plate of the ESC has central disk and an annulus encircling the central disk, wherein the central disk is recessed from the annulus by a gap distance, therein defining a volume. Backside gas delivery apertures are positioned proximate to an interface between the annulus and the central disk. A first voltage to a first electrode of the annulus clamps a peripheral region of the workpiece to a first layer. A second voltage to a second electrode of the central disk generally compensates for a pressure of a backside gas within the volume. The ESC can be formed of J-R- or Coulombic-type materials. A cooling plate associated with the clamping plate further provides cooling by one or more cooling channels configured to route a cooling fluid therethrough.
摘要翻译：提供了用于夹紧工件的静电夹（ESC），系统和方法。 ESC的夹紧板具有中心盘和围绕中心盘的环形空间，其中中心盘从环形空间中间隙距离定义一个体积。背侧气体输送孔位于环形区域与中央盘之间的界面附近。环到第一电极的第一电压将工件的周边区域夹紧到第一层。中心盘的第二电极的第二电压通常补偿体积内的背侧气体的压力。 ESC可由J-R-或库仑型材料形成。与夹紧板相关联的冷却板还通过一个或多个冷却通道提供冷却，所述冷却通道被配置成使冷却流体从其中引导。

3. 发明授权

US09558980B2 Vapor compression refrigeration chuck for ion implanters 有权
标题翻译：用于离子注入机的蒸气压缩制冷卡盘
公开(公告)号：US09558980B2
公开(公告)日：2017-01-31
申请号：US12725508
申请日：2010-03-17
申请人： William D. Lee , Ashwin M. Purohit , Marvin R. LaFontaine
发明人： William D. Lee , Ashwin M. Purohit , Marvin R. LaFontaine
IPC分类号： H01L21/687 , H01L21/683 , H01J37/20 , H01J37/317 , H01L21/67
CPC分类号： H01L21/6831 , H01J37/20 , H01J37/3171 , H01J2237/002 , H01J2237/2001 , H01J2237/2007 , H01J2237/20214 , H01J2237/2065 , H01J2237/31701 , H01L21/67109
摘要： Aspects of the present invention relate to ion implantation systems that make use of a vapor compression cooling system. In one embodiment, a thermal controller in the vapor compression system sends refrigeration fluid though a compressor and a condenser according to an ideal vapor compression cycle to help limit or prevent undesired heating of a workpiece during implantation, or to actively cool the workpiece.
摘要翻译：本发明的方面涉及利用蒸气压缩冷却系统的离子注入系统。在一个实施例中，蒸汽压缩系统中的热控制器根据理想的蒸汽压缩循环通过压缩机和冷凝器发送制冷流体，以帮助限制或防止在植入期间不期望的加热工件，或者主动冷却工件。

4. 发明授权

US08941968B2 Heated electrostatic chuck including mechanical clamp capability at high temperature 有权
标题翻译：加热静电卡盘包括高温下的机械夹紧能力
公开(公告)号：US08941968B2
公开(公告)日：2015-01-27
申请号：US13152735
申请日：2011-06-03
申请人： Perry J. I. Justesen , Allan D. Weed , William Davis Lee , Ashwin M. Purohit , Robert D. Rathmell , Gary M. Cook
发明人： Perry J. I. Justesen , Allan D. Weed , William Davis Lee , Ashwin M. Purohit , Robert D. Rathmell , Gary M. Cook
IPC分类号： H01L21/687 , H01L21/683
CPC分类号： H01L21/68728 , H01L21/6831
摘要： An electrostatic clamp is provided, having a clamping plate, wherein a clamping surface of the clamping plate is configured to contact the workpiece. A voltage applied to one or more electrodes selectively electrostatically attracts the workpiece to the clamping surface. One or more auxiliary clamping members are further provided wherein the one or more auxiliary clamping members are configured to selectively secure at least a portion of the workpiece to the clamping surface. A temperature monitoring device configured to determine a temperature of the workpiece is provided, and a controller is configured to selectively clamp the workpiece to the clamping surface via a control of the voltage to the one or more electrodes and the one or more auxiliary clamping members, based, at least in part, on the temperature of the workpiece.
摘要翻译：提供了一种具有夹板的静电夹具，其中夹持板的夹紧表面构造成接触工件。施加到一个或多个电极的电压选择性地静电将工件吸引到夹紧表面。还提供了一个或多个辅助夹紧构件，其中一个或多个辅助夹紧构件构造成选择性地将至少一部分工件固定到夹紧表面。提供了一种被配置为确定工件的温度的温度监视装置，并且控制器被配置为经由对一个或多个电极和一个或多个辅助夹紧构件的电压的控制来选择性地将工件夹紧到夹紧表面，至少部分地基于工件的温度。

5. 发明授权

US08270142B2 De-clamping wafers from an electrostatic chuck 有权
标题翻译：从静电卡盘中取出晶片
公开(公告)号：US08270142B2
公开(公告)日：2012-09-18
申请号：US12331619
申请日：2008-12-10
申请人： William D. Lee , Ashwin M. Purohit , Marvin R. LaFontaine , Richard J. Rzeszut
发明人： William D. Lee , Ashwin M. Purohit , Marvin R. LaFontaine , Richard J. Rzeszut
IPC分类号： H01L21/683
CPC分类号： H01L21/6833 , H01L21/6831
摘要： One embodiment of the present invention relates to a method for declamping a semiconductor wafer that is electrically adhered to a surface of an electrostatic chuck by a clamping voltage. In this method, the clamping voltage is deactivated. For a time following the deactivation, a first region of the wafer is lifted an first distance from the surface of the electrostatic chuck while a second region of the wafer remains adhered to the surface of the electrostatic chuck. A predetermined condition is monitored during the time. The second region is lifted from the surface of the electrostatic chuck when the predetermined condition is met.
摘要翻译：本发明的一个实施例涉及一种用于通过钳位电压电粘合到静电卡盘表面上的半导体晶片的方法。在这种方法中，钳位电压被去激活。在停用之后的一段时间，晶片的第一区域从静电卡盘的表面提升第一距离，而晶片的第二区域保持粘附到静电卡盘的表面。在此期间监视预定条件。当满足预定条件时，第二区域从静电卡盘的表面提升。

6. 发明授权

US07952851B2 Wafer grounding method for electrostatic clamps 有权
标题翻译：用于静电夹的晶圆接地方法
公开(公告)号：US07952851B2
公开(公告)日：2011-05-31
申请号：US12262399
申请日：2008-10-31
申请人： Marvin R. LaFontaine , Ari Eiriksson , Ashwin M. Purohit , William D. Lee
发明人： Marvin R. LaFontaine , Ari Eiriksson , Ashwin M. Purohit , William D. Lee
IPC分类号： H01L21/683
CPC分类号： H01L21/6831 , H01L21/68742
摘要： An electrostatic chuck and method for clamping and de-clamping a workpiece is provided. The ESC comprises a clamping plate having a clamping surface, and one or more electrodes. An electric potential applied to the one or more electrodes selectively clamps the workpiece to the clamping surface. An arc pin operably coupled to the clamping plate and a power source provides an arc for penetrating an insulating layer of the workpiece. The arc pin is selectively connected to an electrical ground, wherein upon removal of the insulative layer of the workpiece, the arc pin provides an electrical ground connection to the workpiece.
摘要翻译：提供了用于夹紧和去夹紧工件的静电卡盘和方法。 ESC包括具有夹紧表面的夹板和一个或多个电极。施加到一个或多个电极的电位选择性地将工件夹紧到夹紧表面。可操作地联接到夹持板的电弧销和电源提供用于穿透工件的绝缘层的电弧。弧形销被选择性地连接到电接地，其中在移除工件的绝缘层时，电弧销提供与工件的电接地连接。

7. 发明申请

US20100142114A1 ELECTROSTATIC CHUCK WITH COMPLIANT COAT 有权
标题翻译：具有合身涂层的静电卡盘
公开(公告)号：US20100142114A1
公开(公告)日：2010-06-10
申请号：US12331813
申请日：2008-12-10
申请人： Ashwin M. Purohit , Marvin R. LaFontaine , William D. Lee , Richard J. Rzeszut
发明人： Ashwin M. Purohit , Marvin R. LaFontaine , William D. Lee , Richard J. Rzeszut
IPC分类号： H01L21/683
CPC分类号： H01L21/6831 , H02N13/00
摘要： The present invention is directed to an electrostatic chuck (ESC) with a compliant layer formed from TT-Kote® and a method of forming a clamping plate for an ESC. The ESC comprises a compliant layer having a low friction surface for reducing or eliminating particulates generated from thermal expansion. The method comprises forming a clamping member for a substrate comprising a ceramic material and a ceramic surface, and coating the ceramic surface with a compliant layer comprising an organic silicide or TT-Kote®.
摘要翻译：本发明涉及一种具有由TT-Kote制成的顺应层的静电卡盘（ESC）和形成ESC用夹板的方法。 ESC包括具有低摩擦表面的柔顺层，用于减少或消除由热膨胀产生的微粒。该方法包括形成用于包括陶瓷材料和陶瓷表面的基底的夹紧构件，并且用包含有机硅化物或TT-Kote的柔性层涂覆陶瓷表面。

8. 发明授权

US08902560B2 Electrostatic chuck ground punch 有权
标题翻译：静电吸盘冲床
公开(公告)号：US08902560B2
公开(公告)日：2014-12-02
申请号：US12262990
申请日：2008-10-31
申请人： David B. Smith , William D. Lee , Marvin R. LaFontaine , Ashwin M. Purohit
发明人： David B. Smith , William D. Lee , Marvin R. LaFontaine , Ashwin M. Purohit
IPC分类号： H01L21/683 , H01T23/00
CPC分类号： H01L21/6831
摘要： An electrostatic chuck and method for clamping a workpiece is provided. The ESC comprises a clamping plate having a clamping surface, and one or more electrodes. An electric potential applied to the one or more electrodes selectively clamps the workpiece to the clamping surface. A punch is operably coupled to the clamping plate and an electrical ground, wherein the punch comprises a trigger mechanism and a punch tip. The punch tip translates between extended and retracted positions, wherein a point of the punch tip is proud of the clamping surface when the punch tip is in the extended position. The punch tip is configured to translate toward the clamping surface upon clamping the workpiece to the clamping plate. Upon reaching the retracted position, the trigger mechanism imparts an impact force to the punch tip, forcing the punch tip into the workpiece and providing an electrical ground connection to the workpiece.
摘要翻译：提供一种用于夹持工件的静电卡盘和方法。 ESC包括具有夹紧表面的夹板和一个或多个电极。施加到一个或多个电极的电位选择性地将工件夹紧到夹紧表面。冲头可操作地联接到夹板和电接地，其中冲头包括扳机机构和冲头。冲头顶端在延伸位置和缩回位置之间平移，其中当冲头顶端处于延伸位置时，冲头尖端的点对夹紧表面感到骄傲。冲压头被配置成在将工件夹紧到夹紧板上时朝向夹紧表面平移。在到达缩回位置时，触发机构向冲头提供冲击力，迫使冲头尖端进入工件并提供与工件的电接地连接。

9. 发明申请

US20100142113A1 DE-CLAMPING WAFERS FROM AN ELECTROSTATIC CHUCK 有权
标题翻译：来自静电切割机的去夹具
公开(公告)号：US20100142113A1
公开(公告)日：2010-06-10
申请号：US12331619
申请日：2008-12-10
申请人： William D. Lee , Ashwin M. Purohit , Marvin R. LaFontaine , Richard J. Rzeszut
发明人： William D. Lee , Ashwin M. Purohit , Marvin R. LaFontaine , Richard J. Rzeszut
IPC分类号： H01L21/683
CPC分类号： H01L21/6833 , H01L21/6831
摘要： One embodiment of the present invention relates to a method for declamping a semiconductor wafer that is electrically adhered to a surface of an electrostatic chuck by a clamping voltage. In this method, the clamping voltage is deactivated. For a time following the deactivation, a first region of the wafer is lifted an first distance from the surface of the electrostatic chuck while a second region of the wafer remains adhered to the surface of the electrostatic chuck. A predetermined condition is monitored during the time. The second region is lifted from the surface of the electrostatic chuck when the predetermined condition is met.
摘要翻译：本发明的一个实施例涉及一种用于通过钳位电压电粘合到静电卡盘表面上的半导体晶片的方法。在这种方法中，钳位电压被去激活。在停用之后的一段时间，晶片的第一区域从静电卡盘的表面提升第一距离，而晶片的第二区域保持粘附到静电卡盘的表面。在此期间监视预定条件。当满足预定条件时，第二区域从静电卡盘的表面提升。

10. 发明申请

US20080192405A1 Variable frequency electrostatic clamping 有权
标题翻译：变频静电夹紧
公开(公告)号：US20080192405A1
公开(公告)日：2008-08-14
申请号：US11704033
申请日：2007-02-08
申请人： Ashwin M. Purohit
发明人： Ashwin M. Purohit
IPC分类号： H01L21/683
CPC分类号： H01L21/6833 , H02N13/00
摘要： A method for clamping a workpiece involves placing the workpiece on a clamping surface of an electrostatic clamp. A clamping voltage is applied to the electrostatic clamp at a first frequency, therein providing a first clamping force between the workpiece and the electrostatic clamp. The application of clamping voltage at the first frequency is halted and another clamping voltage at a second frequency is applied to the electrostatic clamp, therein providing a second clamping force between the workpiece and the electrostatic clamp. The second frequency is greater than the first frequency, wherein the second clamping force is less than the first clamping force. The application of the clamping voltage at the second frequency is then halted, and the workpiece is removed from the electrostatic clamp. The clamping voltage can be controlled based on a set of performance criteria, such as a desired minimum clamping force and a maximum de-clamp time.
摘要翻译：夹紧工件的方法包括将工件放置在静电夹的夹紧表面上。钳位电压以第一频率施加到静电夹持器，其中在工件和静电夹具之间提供第一夹紧力。停止在第一频率施加钳位电压，并且将另一个频率的另一个钳位电压施加到静电夹，其中在工件和静电夹具之间提供第二夹紧力。第二频率大于第一频率，其中第二夹紧力小于第一夹紧力。然后停止施加第二频率的钳位电压，并将工件从静电夹中取出。可以基于一组性能标准来控制钳位电压，例如期望的最小钳位力和最大去钳位时间。

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