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1. 发明授权

US09257319B2 Parallel single substrate processing system with alignment features on a process section frame 有权
标题翻译：平行单基板处理系统，具有过程段框架上的对准特征
公开(公告)号：US09257319B2
公开(公告)日：2016-02-09
申请号：US13488297
申请日：2012-06-04
申请人： Arthur Keigler
发明人： Arthur Keigler
IPC分类号： H01L21/677 , H01L21/67 , H01L21/68 , H01L21/687
CPC分类号： H01L21/67757 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67057 , H01L21/67173 , H01L21/6776 , H01L21/67781 , H01L21/68 , H01L21/68707
摘要： A system for fluid processing substrate surfaces arrayed in a fluid having a process section with a frame having a plurality of process elements to process the substrate surfaces without contacting the substrate surfaces and a substrate holder assembly having a number of substrate holders and configured for transporting substrates as a unit. The substrate holder assembly and each of the substrate holders are configured for removable coupling to the process section frame, each substrate holder configured to hold at least one of the substrates. The process section frame has alignment features disposed so that, on coupling of the substrate holder assembly with the process section frame, the alignment features interface with each substrate holder of the substrate holder assembly and locate each substrate holder in repeatable alignment, at corresponding coupling of each substrate holder and the process section frame, with respect to a predetermined feature of the process section.
摘要翻译：一种用于流体处理衬底表面的系统，其布置在具有工艺部分的流体中，所述工艺部分具有框架，所述工艺部分具有多个工艺元件，以处理衬底表面而不接触衬底表面;以及衬底保持器组件，其具有多个衬底保持器并且构造成用于传送作为一个单位。衬底保持器组件和每个衬底保持器被构造成用于可移除地连接到工艺段框架，每个衬底保持器被配置成保持至少一个衬底。处理部分框架具有对准特征，其布置成使得在衬底保持器组件与过程部分框架的联接时，对准特征与衬底保持器组件的每个衬底保持器接合并且将每个衬底保持器定位成可重复对准，每个衬底保持器和处理部分框架相对于处理部分的预定特征。

2. 发明授权

US09117856B2 Substrate loader and unloader having an air bearing support 有权
标题翻译：底板装载机和卸载机具有空气轴承支撑
公开(公告)号：US09117856B2
公开(公告)日：2015-08-25
申请号：US13279414
申请日：2011-10-24
申请人： Daniel Goodman , Arthur Keigler , Freeman Fisher
发明人： Daniel Goodman , Arthur Keigler , Freeman Fisher
IPC分类号： A47J45/00 , H01L21/67 , H01L21/683 , H01L21/687
CPC分类号： H01L21/67092 , H01L21/6838 , H01L21/68764 , H01L21/68785
摘要： A substrate separation chuck which is adapted to separate a substrate from an adhering surface. The substrate separation chuck has a support adapted to support the adhering surface. An air bearing surface is adapted to support the substrate, the air bearing surface axially moveable relative to the support. The air bearing surface has a first position adjacent the substrate with the substrate coupled to the adhering surface. The air bearing surface is moveable from the first position to a second position separating the substrate from the adhering surface without contact between the substrate and the air bearing surface.
摘要翻译：一种衬底分离卡盘，其适于将基底与粘附表面分离。衬底分离卡盘具有适于支撑粘附表面的支撑件。空气轴承表面适于支撑基底，空气轴承表面相对于支撑件可轴向移动。空气轴承表面具有与衬底相邻的第一位置，衬底与粘附表面相连。空气轴承表面可以从第一位置移动到第二位置，从而将基板与粘合表面分离，而不会在基板和空气轴承表面之间接触。

3. 发明授权

US08512543B2 Method for fluid processing a workpiece 有权
标题翻译：流体处理工件的方法
公开(公告)号：US08512543B2
公开(公告)日：2013-08-20
申请号：US12963991
申请日：2010-12-09
申请人： Arthur Keigler , John Harrell , Zhenqiu Liu , Qunwei Wu
发明人： Arthur Keigler , John Harrell , Zhenqiu Liu , Qunwei Wu
IPC分类号： C25D5/08 , C25D7/12 , H01L21/00
CPC分类号： C25D17/001 , C25D5/003 , C25D7/123 , C25D17/005 , C25D17/06 , C25D21/10 , C25D21/12 , H01L21/67023 , H01L21/67126
摘要： A method of fluid processing a semiconductor workpiece, including disposing a workpiece holder with a housing capable of containing a fluid, the workpiece holder retaining the workpiece, providing an agitation system connected to the housing and comprising a member disposed within the housing adjacent the workpiece holder, and agitating the fluid by moving the member substantially parallel to a surface of the workpiece with a non-uniform oscillatory motion, the non-uniform oscillatory motion being a series of substantially continuous geometrically asymmetric oscillations wherein each consecutive oscillation of the series is geometrically asymmetric having at least two substantially continuous opposing strokes wherein reversal positions of each substantially continuous stroke of the substantially continuous asymmetric oscillation are disposed asymmetrically with respect to a center point of each immediately preceding substantially continuous stroke of the oscillation.
摘要翻译：一种流体处理半导体工件的方法，包括将具有能够容纳流体的壳体布置在工件夹持器上，保持工件的工件保持器，提供连接到壳体的搅拌系统，并且包括设置在壳体内的邻近工件保持器的构件并且通过以非均匀的振荡运动基本上平行于工件的表面移动构件来搅动流体，该非均匀振荡运动是一系列基本上连续的几何非对称振荡，其中该系列的每个连续振荡是几何不对称的具有至少两个基本上连续的相对冲程，其中基本上连续的不对称振荡的每个基本上连续行程的反转位置相对于振荡的每个紧接在前的基本上连续的行程的中心点非对称地设置。

4. 发明申请

US20120325275A1 SUBSTRATE HOLDER 有权
标题翻译：基板支架
公开(公告)号：US20120325275A1
公开(公告)日：2012-12-27
申请号：US13356252
申请日：2012-01-23
申请人： Daniel Goodman , Arthur Keigler , David G. Guarnaccia
发明人： Daniel Goodman , Arthur Keigler , David G. Guarnaccia
IPC分类号： B08B3/00 , B23Q3/06 , B23B31/12 , F26B11/02 , B23B31/14
CPC分类号： B23B31/14 , B23B31/1261 , F26B5/08 , H01L21/68728 , Y10T279/18 , Y10T279/247
摘要： A rotary chuck adapted to hold a substrate. The rotary chuck has a rotatable chuck portion and an edge grip having a movable grip member movably mounted to the rotatable chuck portion, the moveable grip member being substantially free moving so that rotation of the rotating chuck portion causes the moveable grip member to move in a plane substantially aligned with a surface of the substrate to engage the substrate in a engaged position. A resilient element is coupled to the moveable grip member, the resilient member biasing the grip member to a disengaged position.
摘要翻译：适于保持基板的旋转卡盘。旋转卡盘具有可旋转卡盘部分和边缘把手，其具有可移动地安装到可旋转卡盘部分的可移动抓握构件，可移动抓握构件基本上自由移动，使得旋转卡盘部分的旋转导致可移动抓握构件在平面基本上与衬底的表面对准，以将衬底接合在接合位置。弹性元件联接到可移动握持构件，弹性构件将把手构件偏置到脱离位置。

5. 发明申请

US20120305192A1 PARALLEL SINGLE SUBSTRATE PROCESSING FLUID JET MODULE 审中-公开
标题翻译：平行单基板加工流体喷射模块
公开(公告)号：US20120305192A1
公开(公告)日：2012-12-06
申请号：US13488354
申请日：2012-06-04
申请人： ARTHUR KEIGLER , Freeman Fisher , Daniel L. Goodman
发明人： ARTHUR KEIGLER , Freeman Fisher , Daniel L. Goodman
IPC分类号： B05B1/02 , B08B3/02 , C25D17/00
CPC分类号： H01L21/67757 , H01L21/67028 , H01L21/67034 , H01L21/67051 , H01L21/67057 , H01L21/67173 , H01L21/6776 , H01L21/67781 , H01L21/68 , H01L21/68707
摘要： A system for fluid processing one or more substrate surfaces arrayed in a fluid. The system has a process module with a frame and a plurality of fluid jet elements to inject a fluid at the substrate surfaces without contacting the substrate surfaces. A substrate holder assembly has a holder frame and a number of substrate holders, each of which is coupled to the holder frame and configured to hold a substrate so that a different substrate is held by each substrate holder of the substrate holder assembly for transport therewith as a unit to and from the process module. The substrate holder assembly and each substrate holder of the substrate holder assembly are removably coupled to the process module frame and, when coupled to the process module frame, each substrate holder is independently moveable and positionable relative to the other substrate holders of the substrate holder assembly.
摘要翻译：一种用于流体处理排列在流体中的一个或多个衬底表面的系统。该系统具有一个具有框架和多个流体喷射元件的过程模块，以在衬底表面上注入流体而不接触衬底表面。衬底保持器组件具有保持器框架和多个衬底保持器，每个衬底保持器联接到保持器框架并且构造成保持衬底，使得不同的衬底由衬底保持器组件的每个衬底保持器保持以便作为来往和来自过程模块的单元。衬底保持器组件和衬底保持器组件的每个衬底保持器可移除地耦合到过程模块框架，并且当耦合到过程模块框架时，每个衬底保持器可独立地相对于衬底保持器组件的其他衬底保持器可移动和定位。

6. 发明申请

US20100301564A1 BALANCING PRESSURE TO IMPROVE A FLUID SEAL 有权
标题翻译：平衡压力以改善流体密封
公开(公告)号：US20100301564A1
公开(公告)日：2010-12-02
申请号：US12790264
申请日：2010-05-28
申请人： Arthur Keigler , Qunwei Wu , Zhenqiu Liu , John Harrell
发明人： Arthur Keigler , Qunwei Wu , Zhenqiu Liu , John Harrell
IPC分类号： F16J15/02
CPC分类号： H01L21/67126 , C25D5/003 , C25D7/123 , C25D17/001 , C25D21/12 , H01L21/67023
摘要： A method of fluid sealing a workpiece is provided. The method includes providing a force to cause a ring to form a barrier to fluid entry with the workpiece and preventing fluid from crossing the barrier to fluid entry by forming a pressure differential across the barrier.
摘要翻译：提供了流体密封工件的方法。该方法包括提供一个力，以使环形成与流体进入工件的阻挡层，并且通过在该屏障上形成一个压差来防止流体穿过该屏障穿过该流体入口。

7. 发明申请

US20100295225A1 METHOD AND APPARATUS FOR FLUID PROCESSING A WORKPIECE 有权
标题翻译：流体加工工艺的方法和装置
公开(公告)号：US20100295225A1
公开(公告)日：2010-11-25
申请号：US12786219
申请日：2010-05-24
申请人： Arthur Keigler , John Harrell , Zhenqiu Liu , Qunwei Wu
发明人： Arthur Keigler , John Harrell , Zhenqiu Liu , Qunwei Wu
IPC分类号： B23Q3/00 , F16J15/06
CPC分类号： C25D17/001 , C25D5/003 , C25D7/123 , C25D17/005 , C25D17/06 , C25D21/10 , C25D21/12 , H01L21/67023 , H01L21/67126
摘要： A method of fluid sealing a workpiece is provided. The method includes placing a workpiece on a ring, engaging at least one engagement feature of the ring with at least one retaining feature defined by the member and flexing the member to provide a force to the at least one engagement feature to cause the ring to form a barrier to fluid entry with the workpiece.
摘要翻译：提供了流体密封工件的方法。该方法包括将工件放置在环上，将环的至少一个接合特征与由构件限定的至少一个保持特征接合并使构件弯曲以向至少一个接合特征施加力以使环形成流体进入工件的障碍。

8. 发明授权

US07727366B2 Balancing pressure to improve a fluid seal 失效
标题翻译：平衡压力以改善流体密封
公开(公告)号：US07727366B2
公开(公告)日：2010-06-01
申请号：US11265543
申请日：2005-11-02
申请人： Arthur Keigler , Qunwei Wu , Zhenqiu Liu , John Harrell
发明人： Arthur Keigler , Qunwei Wu , Zhenqiu Liu , John Harrell
IPC分类号： C25B9/02
CPC分类号： H01L21/67126 , C25D5/003 , C25D7/123 , C25D17/001 , C25D21/12 , H01L21/67023
摘要： A method and apparatus for fluid sealing a workpiece retained by a workpiece holder are described. A pressure differential can be formed across a fluid seal to counteract fluid attempting to penetrate the fluid seal, which can contaminate the underside of the workpiece. The apparatus can include a ring forming a barrier to fluid entry with the workpiece and a source providing pressure to form the pressure differential. The pressure or the pressure differential can counteract hydroscopic fluid pressure or hydrostatic fluid pressure that is acting to force fluid through the barrier between the ring and the workpiece.
摘要翻译：描述了用于流体密封由工件保持器保持的工件的方法和装置。可以跨流体密封件形成压力差，以抵消试图渗透流体密封件的流体，这可能污染工件的下侧。该装置可以包括形成与流体进入工件的阻挡物的环和提供压力以形成压力差的源。压力或压力差可抵消吸入液体压力或静压流体压力，其作用是迫使流体通过环和工件之间的阻挡层。

9. 发明申请

US20050160977A1 Method and apparatus for fluid processing a workpiece 有权
公开(公告)号：US20050160977A1
公开(公告)日：2005-07-28
申请号：US10971530
申请日：2004-10-22
申请人： Arthur Keigler , John Harrell , Zhenqiu Liu , Qunwei Wu
发明人： Arthur Keigler , John Harrell , Zhenqiu Liu , Qunwei Wu
IPC分类号： B23K15/00 , C25D5/18 , C25D5/22 , C25D7/12 , C25D17/00 , C25D21/10 , C25D21/12 , H01L21/00
CPC分类号： C25D17/001 , C25D5/003 , C25D7/123 , C25D17/005 , C25D17/06 , C25D21/10 , C25D21/12 , H01L21/67023 , H01L21/67126
摘要： A method and apparatus for retaining a workpiece against a workpiece holder are described. A flexible member can be used to provide a substantially uniform force to securely retain the workpiece, which can allow the workpiece to be consistently positioned in a process module. In one detailed embodiment, a barrier to fluid entry is formed between the workpiece and a ring for retaining the workpiece against a workpiece holder. This provides a reliable seal during fluid processing to prevent fluid from reaching the underside of a workpiece. In various embodiments, the workpiece holder can be used to align a workpiece in a process module or to hold one or more workpieces in a configuration that allows for higher throughput.

10. 发明授权

US09714474B2 Seed layer deposition in microscale features 有权
公开(公告)号：US09714474B2
公开(公告)日：2017-07-25
申请号：US12755198
申请日：2010-04-06
申请人： Arthur Keigler , Johannes Chiu , Zhenqiu Liu , Daniel Goodman
发明人： Arthur Keigler , Johannes Chiu , Zhenqiu Liu , Daniel Goodman
IPC分类号： C25D7/12 , H01L21/288 , H01L21/768 , C25D17/00
CPC分类号： C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/76873 , H01L21/76898 , H01L2221/1089
摘要： A method and system for coating the interior surfaces of microscale hole features fabricated into the substantially planar surface of a work piece. The method comprises providing a work piece with a barrier metal coating that is substantially continuous and uniform both along the planar surface of the work piece and the inner surfaces of the microscale hole features wherein said barrier metal coating is applied by a substantially surface reaction limited process. The workpiece is provided with a coating, on the planar surface of the work piece, of a thick metal layer anchored to the barrier metal coat and disposed to provide substantially uniform electrical conduction capability to the microscale features located throughout and across the workpiece. An electrical contact path is provided to the electrically conductive coating at the perimeter of the work piece. The workpiece is immersed in a chemical bath, causing said chemical bath to fully contact the interior surfaces of the microscale hole features, said chemical bath containing metal ions suitable for electrodeposition. An electric potential is applied at the perimeter of the work piece to cause electrodeposition of metal ions onto all surfaces of the work piece including the interior surfaces of the microscale hole features to a predetermined finish coating in one step.

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