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    • 1. 发明授权
    • Damascene process for carbon memory element with MIIM diode
    • 具有MIIM二极管的碳记忆元件的镶嵌工艺
    • US07935594B2
    • 2011-05-03
    • US12566486
    • 2009-09-24
    • April Dawn SchrickerDeepak C. SekarAndy FuMark Clark
    • April Dawn SchrickerDeepak C. SekarAndy FuMark Clark
    • H01L21/8234
    • H01L45/1233H01L27/101H01L27/1021H01L27/2418H01L27/2481H01L45/04H01L45/06H01L45/122H01L45/144H01L45/149H01L45/1683
    • Forming a metal-insulator diode and carbon memory element in a single damascene process is disclosed. A trench having a bottom and a sidewall is formed in an insulator. A first diode electrode is formed in the trench during a single damascene process. A first insulating region comprising a first insulating material is formed in the trench during the single damascene process. A second insulating region comprising a second insulating material is formed in the trench during the single damascene process. A second diode electrode is formed in the trench during the single damascene process. The first insulating region and the second insulating region reside between the first diode electrode and the second diode electrode to form a metal-insulator-insulator-metal (MIIM) diode. A region of carbon is formed in the trench during the single damascene process. At least a portion of the carbon is electrically in series with the MIIM diode.
    • 公开了在单个镶嵌工艺中形成金属绝缘体二极管和碳记忆元件。 具有底部和侧壁的沟槽形成在绝缘体中。 在单个镶嵌工艺期间,在沟槽中形成第一二极管电极。 在单个镶嵌工艺期间,在沟槽中形成包括第一绝缘材料的第一绝缘区域。 在单个镶嵌工艺期间,在沟槽中形成包括第二绝缘材料的第二绝缘区域。 在单镶嵌工艺期间,在沟槽中形成第二二极管电极。 第一绝缘区域和第二绝缘区域位于第一二极管电极和第二二极管电极之间,以形成金属 - 绝缘体 - 绝缘体 - 金属(MIIM)二极管。 在单个镶嵌工艺期间,在沟槽中形成碳区域。 至少一部分碳与MIIM二极管电串联。
    • 2. 发明申请
    • DAMASCENE PROCESS FOR CARBON MEMORY ELEMENT WITH MIIM DIODE
    • 具有MIIM二极管的碳记忆元件的弥散过程
    • US20100081268A1
    • 2010-04-01
    • US12566486
    • 2009-09-24
    • April Dawn SchrickerDeepak C. SekarAndy FuMark Clark
    • April Dawn SchrickerDeepak C. SekarAndy FuMark Clark
    • H01L21/44
    • H01L45/1233H01L27/101H01L27/1021H01L27/2418H01L27/2481H01L45/04H01L45/06H01L45/122H01L45/144H01L45/149H01L45/1683
    • Forming a metal-insulator diode and carbon memory element in a single damascene process is disclosed. A trench having a bottom and a sidewall is formed in an insulator. A first diode electrode is formed in the trench during a single damascene process. A first insulating region comprising a first insulating material is formed in the trench during the single damascene process. A second insulating region comprising a second insulating material is formed in the trench during the single damascene process. A second diode electrode is formed in the trench during the single damascene process. The first insulating region and the second insulating region reside between the first diode electrode and the second diode electrode to form a metal-insulator-insulator-metal (MIIM) diode. A region of carbon is formed in the trench during the single damascene process. At least a portion of the carbon is electrically in series with the MIIM diode.
    • 公开了在单个镶嵌工艺中形成金属绝缘体二极管和碳记忆元件。 具有底部和侧壁的沟槽形成在绝缘体中。 在单个镶嵌工艺期间,在沟槽中形成第一二极管电极。 在单个镶嵌工艺期间,在沟槽中形成包括第一绝缘材料的第一绝缘区域。 在单个镶嵌工艺期间,在沟槽中形成包括第二绝缘材料的第二绝缘区域。 在单镶嵌工艺期间,在沟槽中形成第二二极管电极。 第一绝缘区域和第二绝缘区域位于第一二极管电极和第二二极管电极之间,以形成金属 - 绝缘体 - 绝缘体 - 金属(MIIM)二极管。 在单个镶嵌工艺期间,在沟槽中形成碳区域。 至少一部分碳与MIIM二极管电串联。
    • 6. 发明授权
    • Damascene process for carbon memory element with MIIM diode
    • 具有MIIM二极管的碳记忆元件的镶嵌工艺
    • US07615439B1
    • 2009-11-10
    • US12240758
    • 2008-09-29
    • April Dawn SchrickerDeepak C. SekarAndy FuMark Clark
    • April Dawn SchrickerDeepak C. SekarAndy FuMark Clark
    • H01L21/8234
    • H01L45/1233H01L27/101H01L27/1021H01L27/2418H01L27/2481H01L45/04H01L45/06H01L45/122H01L45/144H01L45/149H01L45/1683
    • Forming a metal-insulator diode and carbon memory element in a single damascene process is disclosed. A trench having a bottom and a sidewall is formed in an insulator. A first diode electrode is formed in the trench during a single damascene process. A first insulating region comprising a first insulating material is formed in the trench during the single damascene process. A second insulating region comprising a second insulating material is formed in the trench during the single damascene process. A second diode electrode is formed in the trench during the single damascene process. The first insulating region and the second insulating region reside between the first diode electrode and the second diode electrode to form a metal-insulator-insulator-metal (MIIM) diode. A region of carbon is formed in the trench during the single damascene process. At least a portion of the carbon is electrically in series with the MIIM diode.
    • 公开了在单个镶嵌工艺中形成金属绝缘体二极管和碳记忆元件。 具有底部和侧壁的沟槽形成在绝缘体中。 在单个镶嵌工艺期间,在沟槽中形成第一二极管电极。 在单个镶嵌工艺期间,在沟槽中形成包括第一绝缘材料的第一绝缘区域。 在单个镶嵌工艺期间,在沟槽中形成包括第二绝缘材料的第二绝缘区域。 在单镶嵌工艺期间,在沟槽中形成第二二极管电极。 第一绝缘区域和第二绝缘区域位于第一二极管电极和第二二极管电极之间,以形成金属 - 绝缘体 - 绝缘体 - 金属(MIIM)二极管。 在单个镶嵌工艺期间,在沟槽中形成碳区域。 至少一部分碳与MIIM二极管电串联。